FR2914497B1 - Structure de composants haute frequence a faibles capacites parasites - Google Patents
Structure de composants haute frequence a faibles capacites parasitesInfo
- Publication number
- FR2914497B1 FR2914497B1 FR0754221A FR0754221A FR2914497B1 FR 2914497 B1 FR2914497 B1 FR 2914497B1 FR 0754221 A FR0754221 A FR 0754221A FR 0754221 A FR0754221 A FR 0754221A FR 2914497 B1 FR2914497 B1 FR 2914497B1
- Authority
- FR
- France
- Prior art keywords
- parasites
- high frequency
- frequency components
- low capacity
- capacity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 244000045947 parasite Species 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/8611—Planar PN junction diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0814—Diodes only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0754221A FR2914497B1 (fr) | 2007-04-02 | 2007-04-02 | Structure de composants haute frequence a faibles capacites parasites |
US12/059,600 US8269252B2 (en) | 2007-04-02 | 2008-03-31 | Structure of high-frequency components with low stray capacitances |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0754221A FR2914497B1 (fr) | 2007-04-02 | 2007-04-02 | Structure de composants haute frequence a faibles capacites parasites |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2914497A1 FR2914497A1 (fr) | 2008-10-03 |
FR2914497B1 true FR2914497B1 (fr) | 2009-06-12 |
Family
ID=38626319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0754221A Expired - Fee Related FR2914497B1 (fr) | 2007-04-02 | 2007-04-02 | Structure de composants haute frequence a faibles capacites parasites |
Country Status (2)
Country | Link |
---|---|
US (1) | US8269252B2 (fr) |
FR (1) | FR2914497B1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3029686A1 (fr) * | 2014-12-08 | 2016-06-10 | St Microelectronics Tours Sas | Dispositif radiofrequence protege contre des surtensions |
US10283463B2 (en) * | 2017-04-11 | 2019-05-07 | International Business Machines Corporation | Terahertz detector comprised of P-N junction diode |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0099979B1 (fr) * | 1982-07-26 | 1987-04-08 | LGZ LANDIS & GYR ZUG AG | Détecteur de champ magnétique et son application |
JPS6173345A (ja) * | 1984-09-19 | 1986-04-15 | Toshiba Corp | 半導体装置 |
US5241210A (en) * | 1987-02-26 | 1993-08-31 | Kabushiki Kaisha Toshiba | High breakdown voltage semiconductor device |
US5344785A (en) * | 1992-03-13 | 1994-09-06 | United Technologies Corporation | Method of forming high speed, high voltage fully isolated bipolar transistors on a SOI substrate |
US5841169A (en) | 1996-06-27 | 1998-11-24 | Harris Corporation | Integrated circuit containing devices dielectrically isolated and junction isolated from a substrate |
JPH10270567A (ja) * | 1997-03-21 | 1998-10-09 | Oki Electric Ind Co Ltd | トランジスタ保護素子 |
JP2001345428A (ja) * | 2000-03-27 | 2001-12-14 | Toshiba Corp | 半導体装置とその製造方法 |
US6429502B1 (en) * | 2000-08-22 | 2002-08-06 | Silicon Wave, Inc. | Multi-chambered trench isolated guard ring region for providing RF isolation |
JP2002100761A (ja) * | 2000-09-21 | 2002-04-05 | Mitsubishi Electric Corp | シリコンmosfet高周波半導体デバイスおよびその製造方法 |
US6562666B1 (en) * | 2000-10-31 | 2003-05-13 | International Business Machines Corporation | Integrated circuits with reduced substrate capacitance |
FR2830123A1 (fr) * | 2001-09-26 | 2003-03-28 | St Microelectronics Sa | Peripherie haute tension |
-
2007
- 2007-04-02 FR FR0754221A patent/FR2914497B1/fr not_active Expired - Fee Related
-
2008
- 2008-03-31 US US12/059,600 patent/US8269252B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20080237785A1 (en) | 2008-10-02 |
US8269252B2 (en) | 2012-09-18 |
FR2914497A1 (fr) | 2008-10-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20131231 |