TW344092B - Semiconductor device provided with low melting point metal bumps and process for producing same - Google Patents
Semiconductor device provided with low melting point metal bumps and process for producing sameInfo
- Publication number
- TW344092B TW344092B TW086112308A TW86112308A TW344092B TW 344092 B TW344092 B TW 344092B TW 086112308 A TW086112308 A TW 086112308A TW 86112308 A TW86112308 A TW 86112308A TW 344092 B TW344092 B TW 344092B
- Authority
- TW
- Taiwan
- Prior art keywords
- melting point
- semiconductor device
- low melting
- point metal
- device provided
- Prior art date
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/00013—Fully indexed content
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- H—ELECTRICITY
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- H01L2924/01014—Silicon [Si]
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- H01L2924/01—Chemical elements
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- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
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- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H01L2924/01—Chemical elements
- H01L2924/01061—Promethium [Pm]
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- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24426996 | 1996-08-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW344092B true TW344092B (en) | 1998-11-01 |
Family
ID=17116243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086112308A TW344092B (en) | 1996-08-27 | 1997-08-27 | Semiconductor device provided with low melting point metal bumps and process for producing same |
Country Status (7)
Country | Link |
---|---|
US (2) | US7045388B2 (zh) |
EP (2) | EP0922300B1 (zh) |
JP (3) | JP3633941B2 (zh) |
DE (1) | DE69738324T2 (zh) |
MY (1) | MY130223A (zh) |
TW (1) | TW344092B (zh) |
WO (1) | WO1998009332A1 (zh) |
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JP4656275B2 (ja) | 2001-01-15 | 2011-03-23 | 日本電気株式会社 | 半導体装置の製造方法 |
TW546805B (en) * | 2002-07-18 | 2003-08-11 | Advanced Semiconductor Eng | Bumping process |
US7235429B2 (en) * | 2003-05-28 | 2007-06-26 | Via Technologies, Inc. | Conductive block mounting process for electrical connection |
WO2005059957A2 (en) * | 2003-12-12 | 2005-06-30 | Great Wall Semiconductor Corporation | Metal interconnect system and method for direct die attachment |
TWI313051B (en) * | 2004-06-10 | 2009-08-01 | Advanced Semiconductor Eng | Method and structure to enhance height of solder ball |
JP2006202969A (ja) | 2005-01-20 | 2006-08-03 | Taiyo Yuden Co Ltd | 半導体装置およびその実装体 |
GB0512836D0 (en) * | 2005-06-21 | 2005-08-03 | Jha Animesh | Inert alloy anodes for aluminium electrolysis cell using molten salt bath confidential |
JP2008187561A (ja) * | 2007-01-31 | 2008-08-14 | Alps Electric Co Ltd | 表面弾性波素子 |
GB0716716D0 (en) * | 2007-08-29 | 2007-10-10 | Cambridge Silicon Radio Ltd | Chip mounting |
US20100029074A1 (en) * | 2008-05-28 | 2010-02-04 | Mackay John | Maskless Process for Solder Bump Production |
WO2009146373A1 (en) * | 2008-05-28 | 2009-12-03 | Mvm Technoloiges, Inc. | Maskless process for solder bumps production |
WO2011004469A1 (ja) * | 2009-07-08 | 2011-01-13 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
EP2557420B1 (en) * | 2011-08-12 | 2015-10-14 | Nxp B.V. | Semiconductor device having Au-Cu electrodes and method of manufacturing semiconductor device |
DE112013004003A5 (de) * | 2012-08-10 | 2015-08-06 | EvoSense Research & Development GmbH | Sensor mit einfacher Verbindungstechnik |
JP6075465B2 (ja) | 2014-01-07 | 2017-02-08 | 株式会社村田製作所 | 補修方法および補修材 |
US20170018525A1 (en) * | 2014-03-28 | 2017-01-19 | Intel Corporation | Method and process for emib chip interconnections |
US9425090B2 (en) * | 2014-09-19 | 2016-08-23 | Infineon Technologies Austria Ag | Method of electrodepositing gold on a copper seed layer to form a gold metallization structure |
JP6455335B2 (ja) * | 2015-06-23 | 2019-01-23 | 三菱電機株式会社 | 半導体装置 |
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DE19628702A1 (de) * | 1995-07-25 | 1997-01-30 | Fraunhofer Ges Forschung | Flußmittelfreie Kontaktierung von Bauelementen |
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JP3003656B2 (ja) * | 1997-12-24 | 2000-01-31 | 日本電気株式会社 | 微細金属球の搭載治具 |
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-
1997
- 1997-08-27 JP JP51147498A patent/JP3633941B2/ja not_active Expired - Lifetime
- 1997-08-27 TW TW086112308A patent/TW344092B/zh not_active IP Right Cessation
- 1997-08-27 WO PCT/JP1997/002987 patent/WO1998009332A1/en active IP Right Grant
- 1997-08-27 EP EP97937811A patent/EP0922300B1/en not_active Expired - Lifetime
- 1997-08-27 US US09/254,119 patent/US7045388B2/en not_active Expired - Fee Related
- 1997-08-27 EP EP07121545.3A patent/EP1918991B1/en not_active Expired - Lifetime
- 1997-08-27 DE DE69738324T patent/DE69738324T2/de not_active Expired - Lifetime
- 1997-08-27 MY MYPI97003950A patent/MY130223A/en unknown
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2000
- 2000-08-04 US US09/632,910 patent/US7045389B1/en not_active Expired - Fee Related
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2008
- 2008-04-28 JP JP2008117794A patent/JP2008187211A/ja active Pending
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2009
- 2009-10-19 JP JP2009240715A patent/JP2010050470A/ja active Pending
Also Published As
Publication number | Publication date |
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DE69738324T2 (de) | 2008-10-09 |
EP0922300A1 (en) | 1999-06-16 |
WO1998009332A1 (en) | 1998-03-05 |
JP3633941B2 (ja) | 2005-03-30 |
MY130223A (en) | 2007-06-29 |
JP2010050470A (ja) | 2010-03-04 |
EP1918991B1 (en) | 2017-04-05 |
EP0922300B1 (en) | 2007-11-28 |
US7045389B1 (en) | 2006-05-16 |
US20020036344A1 (en) | 2002-03-28 |
EP1918991A2 (en) | 2008-05-07 |
EP1918991A3 (en) | 2011-02-16 |
JP2008187211A (ja) | 2008-08-14 |
US7045388B2 (en) | 2006-05-16 |
DE69738324D1 (de) | 2008-01-10 |
JP2001501366A (ja) | 2001-01-30 |
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