KR20010012872A - 범프형성방법 및 범프본더 - Google Patents

범프형성방법 및 범프본더 Download PDF

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Publication number
KR20010012872A
KR20010012872A KR1019997010838A KR19997010838A KR20010012872A KR 20010012872 A KR20010012872 A KR 20010012872A KR 1019997010838 A KR1019997010838 A KR 1019997010838A KR 19997010838 A KR19997010838 A KR 19997010838A KR 20010012872 A KR20010012872 A KR 20010012872A
Authority
KR
South Korea
Prior art keywords
bump
forming method
bonder
bump forming
bump bonder
Prior art date
Application number
KR1019997010838A
Other languages
English (en)
Other versions
KR100465552B1 (ko
Inventor
마에다카하루
마야하라기요시
나리타쇼리키
와타나베마사야
다카쿠라유이치
이케야마사히코
Original Assignee
마츠시타 덴끼 산교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마츠시타 덴끼 산교 가부시키가이샤 filed Critical 마츠시타 덴끼 산교 가부시키가이샤
Publication of KR20010012872A publication Critical patent/KR20010012872A/ko
Application granted granted Critical
Publication of KR100465552B1 publication Critical patent/KR100465552B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR10-1999-7010838A 1997-05-23 1998-05-21 범프형성방법 및 범프본더 KR100465552B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP13391797 1997-05-23
JP???9-133917 1997-05-23
PCT/JP1998/002253 WO1998053485A1 (en) 1997-05-23 1998-05-21 Bump forming method and bump bonder

Publications (2)

Publication Number Publication Date
KR20010012872A true KR20010012872A (ko) 2001-02-26
KR100465552B1 KR100465552B1 (ko) 2005-01-13

Family

ID=15116116

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1999-7010838A KR100465552B1 (ko) 1997-05-23 1998-05-21 범프형성방법 및 범프본더

Country Status (5)

Country Link
US (1) US6098868A (ko)
EP (1) EP0983607B1 (ko)
KR (1) KR100465552B1 (ko)
DE (1) DE69806754T2 (ko)
WO (1) WO1998053485A1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6165888A (en) * 1997-10-02 2000-12-26 Motorola, Inc. Two step wire bond process
DE19812706A1 (de) * 1998-03-23 1999-10-07 F&K Delvotec Bondtechnik Gmbh Verfahren und Vorrichtung zum "ball-bonden"
JP3407275B2 (ja) * 1998-10-28 2003-05-19 インターナショナル・ビジネス・マシーンズ・コーポレーション バンプ及びその形成方法
JP2000133672A (ja) 1998-10-28 2000-05-12 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
EP1174908A1 (en) * 2000-07-21 2002-01-23 Esec Trading S.A. Apparatus for making wire connections
DE10133885A1 (de) 2000-07-21 2002-03-21 Esec Trading Sa Vorrichtung zur Herstellung von Drahtverbindungen
EP1174906A1 (de) * 2000-07-21 2002-01-23 Esec Trading S.A. Vorrichtung zur Herstellung von Drahtverbindungen
US6471116B2 (en) * 2001-01-19 2002-10-29 Orthodyne Electronics Corporation Wire bonding spool system
US6712261B2 (en) * 2002-03-20 2004-03-30 International Business Machines Corporation Solid conductive element insertion apparatus
JP3727616B2 (ja) * 2002-07-11 2005-12-14 株式会社新川 ワイヤボンディング装置
JP2005251919A (ja) * 2004-03-03 2005-09-15 Shinkawa Ltd バンプボンディング装置及びバンプ不着検出方法
US7863737B2 (en) * 2006-04-01 2011-01-04 Stats Chippac Ltd. Integrated circuit package system with wire bond pattern
MY149251A (en) * 2008-10-23 2013-07-31 Carsem M Sdn Bhd Wafer-level package using stud bump coated with solder
US8459530B2 (en) * 2009-10-29 2013-06-11 Asm Technology Singapore Pte Ltd Automatic wire feeding method for wire bonders
US8919632B2 (en) * 2012-11-09 2014-12-30 Asm Technology Singapore Pte. Ltd. Method of detecting wire bonding failures
CN105895543B (zh) * 2014-12-01 2019-09-13 恩智浦美国有限公司 接合引线进给系统及其方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2201545B (en) * 1987-01-30 1991-09-11 Tanaka Electronics Ind Method for connecting semiconductor material
DE3703694A1 (de) * 1987-02-06 1988-08-18 Dynapert Delvotec Gmbh Ball-bondverfahren und vorrichtung zur durchfuehrung derselben
JPH03208354A (ja) * 1990-01-10 1991-09-11 Mitsubishi Electric Corp 半導体装置およびその製造方法
JPH04247631A (ja) * 1991-02-01 1992-09-03 Mitsubishi Electric Corp ワイヤボンディング装置
JP2841126B2 (ja) * 1991-04-19 1998-12-24 株式会社新川 ワイヤボンデイング方法及び装置
US5326015A (en) * 1993-03-29 1994-07-05 Kulicke And Soffa Investments, Inc. Wire bonder tail length monitor
JPH08249724A (ja) * 1995-03-10 1996-09-27 Ricoh Co Ltd 相変化形光メモリー媒体及びその製造方法
JP3074517B2 (ja) * 1995-12-05 2000-08-07 株式会社新川 被覆ワイヤのワイヤボンディング方法
JP3218382B2 (ja) * 1995-12-05 2001-10-15 株式会社新川 被覆ワイヤのワイヤボンディング方法
JP3082657B2 (ja) * 1996-02-08 2000-08-28 松下電器産業株式会社 バンプ形成装置およびバンプ形成方法
JPH09252005A (ja) * 1996-03-15 1997-09-22 Shinkawa Ltd バンプ形成方法
JP3400279B2 (ja) * 1997-01-13 2003-04-28 株式会社新川 バンプ形成方法

Also Published As

Publication number Publication date
DE69806754D1 (de) 2002-08-29
EP0983607B1 (en) 2002-07-24
US6098868A (en) 2000-08-08
WO1998053485A1 (en) 1998-11-26
DE69806754T2 (de) 2003-10-16
KR100465552B1 (ko) 2005-01-13
EP0983607A1 (en) 2000-03-08

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