AU8598798A - Conductive epoxy flip-chip on chip - Google Patents

Conductive epoxy flip-chip on chip

Info

Publication number
AU8598798A
AU8598798A AU85987/98A AU8598798A AU8598798A AU 8598798 A AU8598798 A AU 8598798A AU 85987/98 A AU85987/98 A AU 85987/98A AU 8598798 A AU8598798 A AU 8598798A AU 8598798 A AU8598798 A AU 8598798A
Authority
AU
Australia
Prior art keywords
chip
conductive epoxy
flip
epoxy flip
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU85987/98A
Inventor
Marc E. Robinson
William R. Scharrenberg
Alfons Vindasius
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cubic Memory Inc
Original Assignee
Cubic Memory Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cubic Memory Inc filed Critical Cubic Memory Inc
Publication of AU8598798A publication Critical patent/AU8598798A/en
Abandoned legal-status Critical Current

Links

Classifications

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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
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    • H01L2924/181—Encapsulation
AU85987/98A 1997-07-29 1998-07-29 Conductive epoxy flip-chip on chip Abandoned AU8598798A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US90216997A 1997-07-29 1997-07-29
US08902169 1997-07-29
US08/918,500 US6271598B1 (en) 1997-07-29 1997-08-22 Conductive epoxy flip-chip on chip
US08918500 1997-08-22
PCT/US1998/015659 WO1999007015A1 (en) 1997-07-29 1998-07-29 Conductive epoxy flip-chip on chip

Publications (1)

Publication Number Publication Date
AU8598798A true AU8598798A (en) 1999-02-22

Family

ID=27129319

Family Applications (1)

Application Number Title Priority Date Filing Date
AU85987/98A Abandoned AU8598798A (en) 1997-07-29 1998-07-29 Conductive epoxy flip-chip on chip

Country Status (5)

Country Link
US (1) US6271598B1 (en)
JP (1) JP2001512292A (en)
KR (1) KR20010022384A (en)
AU (1) AU8598798A (en)
WO (1) WO1999007015A1 (en)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19818824B4 (en) * 1998-04-27 2008-07-31 Epcos Ag Electronic component and method for its production
JP2000243900A (en) * 1999-02-23 2000-09-08 Rohm Co Ltd Semiconductor chip, semiconductor device using it, and manufacture of semiconductor chip
JP2001196529A (en) * 2000-01-17 2001-07-19 Mitsubishi Electric Corp Semiconductor device and wiring method therefor
JP2001352035A (en) * 2000-06-07 2001-12-21 Sony Corp Assembling jig for multilayer semiconductor device and manufacturing method therefor
US7041533B1 (en) * 2000-06-08 2006-05-09 Micron Technology, Inc. Stereolithographic method for fabricating stabilizers for semiconductor devices
TW483129B (en) * 2000-10-05 2002-04-11 Amkor Technology Taiwan Linkou Package for image sensing device and its manufacturing process
KR100776130B1 (en) * 2001-03-22 2007-11-16 매그나칩 반도체 유한회사 Stacked semiconductor package
US6400007B1 (en) * 2001-04-16 2002-06-04 Kingpak Technology Inc. Stacked structure of semiconductor means and method for manufacturing the same
US6586825B1 (en) * 2001-04-26 2003-07-01 Lsi Logic Corporation Dual chip in package with a wire bonded die mounted to a substrate
US20030038356A1 (en) * 2001-08-24 2003-02-27 Derderian James M Semiconductor devices including stacking spacers thereon, assemblies including the semiconductor devices, and methods
DE10142120A1 (en) * 2001-08-30 2003-03-27 Infineon Technologies Ag Electronic component has semiconductor chips whose passive back sides are fastened to top side of carrier substrate and active chip surface, respectively
US7242082B2 (en) 2002-02-07 2007-07-10 Irvine Sensors Corp. Stackable layer containing ball grid array package
US6967411B2 (en) * 2002-02-07 2005-11-22 Irvine Sensors Corporation Stackable layers containing ball grid array packages
US6753613B2 (en) * 2002-03-13 2004-06-22 Intel Corporation Stacked dice standoffs
US6976236B1 (en) * 2002-04-05 2005-12-13 Procket Networks, Inc. Method for automatically routing connections between top side conductors and bottom side conductors of an integrated circuit package
KR20030083306A (en) * 2002-04-20 2003-10-30 삼성전자주식회사 A memory card
US6849935B2 (en) * 2002-05-10 2005-02-01 Sarnoff Corporation Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
USRE41914E1 (en) 2002-05-10 2010-11-09 Ponnusamy Palanisamy Thermal management in electronic displays
US6659512B1 (en) 2002-07-18 2003-12-09 Hewlett-Packard Development Company, L.P. Integrated circuit package employing flip-chip technology and method of assembly
US20040012094A1 (en) * 2002-07-18 2004-01-22 Harper Timothy V. Flip-chip integrated circuit package and method of assembly
US7335971B2 (en) 2003-03-31 2008-02-26 Robert Bosch Gmbh Method for protecting encapsulated sensor structures using stack packaging
JP4537702B2 (en) * 2003-12-26 2010-09-08 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method thereof
US7122906B2 (en) * 2004-01-29 2006-10-17 Micron Technology, Inc. Die-wafer package and method of fabricating same
US7215018B2 (en) * 2004-04-13 2007-05-08 Vertical Circuits, Inc. Stacked die BGA or LGA component assembly
US7245021B2 (en) * 2004-04-13 2007-07-17 Vertical Circuits, Inc. Micropede stacked die component assembly
US7705432B2 (en) * 2004-04-13 2010-04-27 Vertical Circuits, Inc. Three dimensional six surface conformal die coating
US7443037B2 (en) * 2006-04-01 2008-10-28 Stats Chippac Ltd. Stacked integrated circuit package system with connection protection
US7535110B2 (en) * 2006-06-15 2009-05-19 Marvell World Trade Ltd. Stack die packages
US8208266B2 (en) 2007-05-29 2012-06-26 Avx Corporation Shaped integrated passives
US8723332B2 (en) * 2007-06-11 2014-05-13 Invensas Corporation Electrically interconnected stacked die assemblies
WO2008157779A2 (en) * 2007-06-20 2008-12-24 Vertical Circuits, Inc. Three-dimensional circuitry formed on integrated circuit device using two- dimensional fabrication
US7714426B1 (en) 2007-07-07 2010-05-11 Keith Gann Ball grid array package format layers and structure
US8704379B2 (en) * 2007-09-10 2014-04-22 Invensas Corporation Semiconductor die mount by conformal die coating
KR101554761B1 (en) 2008-03-12 2015-09-21 인벤사스 코포레이션 Support mounted electrically interconnected die assembly
US9153517B2 (en) 2008-05-20 2015-10-06 Invensas Corporation Electrical connector between die pad and z-interconnect for stacked die assemblies
US7863159B2 (en) * 2008-06-19 2011-01-04 Vertical Circuits, Inc. Semiconductor die separation method
US8829677B2 (en) 2010-10-14 2014-09-09 Invensas Corporation Semiconductor die having fine pitch electrical interconnects
US8127185B2 (en) * 2009-01-23 2012-02-28 Micron Technology, Inc. Memory devices and methods for managing error regions
JP5963671B2 (en) * 2009-06-26 2016-08-03 インヴェンサス・コーポレーション Electrical interconnection for stacked dies in zigzag configuration
US9147583B2 (en) 2009-10-27 2015-09-29 Invensas Corporation Selective die electrical insulation by additive process
TWI544604B (en) 2009-11-04 2016-08-01 英維瑟斯公司 Stacked die assembly having reduced stress electrical interconnects
US8525334B2 (en) 2010-04-27 2013-09-03 International Rectifier Corporation Semiconductor on semiconductor substrate multi-chip-scale package
US8677617B2 (en) * 2010-04-28 2014-03-25 International Business Machines Corporation Printed circuit board edge connector
US9871019B2 (en) 2015-07-17 2018-01-16 Invensas Corporation Flipped die stack assemblies with leadframe interconnects
US9490195B1 (en) 2015-07-17 2016-11-08 Invensas Corporation Wafer-level flipped die stacks with leadframes or metal foil interconnects
US9825002B2 (en) 2015-07-17 2017-11-21 Invensas Corporation Flipped die stack
US9508691B1 (en) 2015-12-16 2016-11-29 Invensas Corporation Flipped die stacks with multiple rows of leadframe interconnects
US10566310B2 (en) 2016-04-11 2020-02-18 Invensas Corporation Microelectronic packages having stacked die and wire bond interconnects
US9595511B1 (en) 2016-05-12 2017-03-14 Invensas Corporation Microelectronic packages and assemblies with improved flyby signaling operation
US9728524B1 (en) 2016-06-30 2017-08-08 Invensas Corporation Enhanced density assembly having microelectronic packages mounted at substantial angle to board
US11456272B2 (en) 2020-09-11 2022-09-27 Western Digital Technologies, Inc. Straight wirebonding of silicon dies

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648131A (en) * 1969-11-07 1972-03-07 Ibm Hourglass-shaped conductive connection through semiconductor structures
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor
US4954875A (en) * 1986-07-17 1990-09-04 Laser Dynamics, Inc. Semiconductor wafer array with electrically conductive compliant material
US5675180A (en) * 1994-06-23 1997-10-07 Cubic Memory, Inc. Vertical interconnect process for silicon segments
KR100349896B1 (en) * 1994-12-28 2002-12-26 삼성에스디아이 주식회사 Mounting structure of ic and mounting method thereof

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KR20010022384A (en) 2001-03-15
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WO1999007015A1 (en) 1999-02-11

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