TW331671B - Reference plane requiring no conductor and grid alignment - Google Patents

Reference plane requiring no conductor and grid alignment

Info

Publication number
TW331671B
TW331671B TW086103650A TW86103650A TW331671B TW 331671 B TW331671 B TW 331671B TW 086103650 A TW086103650 A TW 086103650A TW 86103650 A TW86103650 A TW 86103650A TW 331671 B TW331671 B TW 331671B
Authority
TW
Taiwan
Prior art keywords
signal conductors
grid
conductor
reference plane
grid alignment
Prior art date
Application number
TW086103650A
Other languages
English (en)
Inventor
D Suski Edward
Original Assignee
Ast Res Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ast Res Inc filed Critical Ast Res Inc
Application granted granted Critical
Publication of TW331671B publication Critical patent/TW331671B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
TW086103650A 1996-03-25 1997-03-22 Reference plane requiring no conductor and grid alignment TW331671B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/620,971 US5675299A (en) 1996-03-25 1996-03-25 Bidirectional non-solid impedance controlled reference plane requiring no conductor to grid alignment

Publications (1)

Publication Number Publication Date
TW331671B true TW331671B (en) 1998-05-11

Family

ID=24488173

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086103650A TW331671B (en) 1996-03-25 1997-03-22 Reference plane requiring no conductor and grid alignment

Country Status (9)

Country Link
US (1) US5675299A (zh)
EP (1) EP0890197B1 (zh)
JP (1) JP3530195B2 (zh)
KR (1) KR100283508B1 (zh)
CN (1) CN1177329C (zh)
CA (1) CA2250206A1 (zh)
DE (1) DE69734279T2 (zh)
TW (1) TW331671B (zh)
WO (1) WO1997036340A1 (zh)

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US9166550B2 (en) 2013-03-14 2015-10-20 Avago Technologies General Ip (Singapore) Pte. Ltd. System and method for using a reference plane to control transmission line characteristic impedance
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US10993635B1 (en) 2016-03-22 2021-05-04 Flextronics Ap, Llc Integrating biosensor to compression shirt textile and interconnect method
DE102017101478A1 (de) * 2017-01-26 2018-07-26 Rheinmetall Waffe Munition Gmbh Vorrichtung zum Entlüften oder Belüften eines Raumes
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US10757800B1 (en) * 2017-06-22 2020-08-25 Flex Ltd. Stripline transmission lines with cross-hatched pattern return plane, where the striplines do not overlap any intersections in the cross-hatched pattern
US11039531B1 (en) 2018-02-05 2021-06-15 Flex Ltd. System and method for in-molded electronic unit using stretchable substrates to create deep drawn cavities and features
WO2020092334A2 (en) * 2018-10-29 2020-05-07 Cellink Corporation Flexible hybrid interconnect circuits
US10964660B1 (en) 2018-11-20 2021-03-30 Flex Ltd. Use of adhesive films for 3D pick and place assembly of electronic components
US10896877B1 (en) 2018-12-14 2021-01-19 Flex Ltd. System in package with double side mounted board
KR20210014797A (ko) * 2019-07-30 2021-02-10 삼성디스플레이 주식회사 표시 장치
CN111540993B (zh) * 2019-12-16 2022-01-11 瑞声科技(新加坡)有限公司 传输线以及终端设备
JP2021145061A (ja) * 2020-03-12 2021-09-24 京セラ株式会社 フレキシブル配線板
KR20230021466A (ko) * 2021-08-05 2023-02-14 삼성전자주식회사 플렉서블 접속 부재 및 그를 포함하는 전자 장치
CN113709989A (zh) * 2021-09-03 2021-11-26 博敏电子股份有限公司 一种提升电磁屏蔽膜阻抗匹配要求产品可靠性的方法

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Also Published As

Publication number Publication date
EP0890197B1 (en) 2005-09-28
EP0890197A4 (en) 1999-06-02
KR20000005001A (ko) 2000-01-25
US5675299A (en) 1997-10-07
CA2250206A1 (en) 1997-10-02
EP0890197A1 (en) 1999-01-13
JP3530195B2 (ja) 2004-05-24
DE69734279D1 (de) 2005-11-03
JP2000507427A (ja) 2000-06-13
WO1997036340A1 (en) 1997-10-02
CN1177329C (zh) 2004-11-24
CN1221517A (zh) 1999-06-30
DE69734279T2 (de) 2006-07-13
KR100283508B1 (ko) 2001-03-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees