TW317518B - - Google Patents
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- Publication number
- TW317518B TW317518B TW084105089A TW84105089A TW317518B TW 317518 B TW317518 B TW 317518B TW 084105089 A TW084105089 A TW 084105089A TW 84105089 A TW84105089 A TW 84105089A TW 317518 B TW317518 B TW 317518B
- Authority
- TW
- Taiwan
- Prior art keywords
- patent application
- item
- temperature
- bonding
- target
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 82
- 229910000679 solder Inorganic materials 0.000 claims description 82
- 239000007789 gas Substances 0.000 claims description 52
- 238000004519 manufacturing process Methods 0.000 claims description 46
- 239000013077 target material Substances 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 42
- 238000007789 sealing Methods 0.000 claims description 39
- 238000001816 cooling Methods 0.000 claims description 33
- 238000011049 filling Methods 0.000 claims description 32
- 239000000853 adhesive Substances 0.000 claims description 31
- 230000001070 adhesive effect Effects 0.000 claims description 31
- 238000003466 welding Methods 0.000 claims description 29
- 125000006850 spacer group Chemical group 0.000 claims description 20
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 238000004544 sputter deposition Methods 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- 239000012809 cooling fluid Substances 0.000 claims description 8
- 239000011261 inert gas Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 6
- 238000005477 sputtering target Methods 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000012298 atmosphere Substances 0.000 claims description 5
- 230000002079 cooperative effect Effects 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- 238000000992 sputter etching Methods 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims 9
- 238000003825 pressing Methods 0.000 claims 7
- 239000007767 bonding agent Substances 0.000 claims 5
- 239000000835 fiber Substances 0.000 claims 4
- 241000282461 Canis lupus Species 0.000 claims 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims 2
- 238000009434 installation Methods 0.000 claims 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 claims 1
- 241000282421 Canidae Species 0.000 claims 1
- 241000282326 Felis catus Species 0.000 claims 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- 240000005979 Hordeum vulgare Species 0.000 claims 1
- 235000007340 Hordeum vulgare Nutrition 0.000 claims 1
- 229910052776 Thorium Inorganic materials 0.000 claims 1
- 229910052770 Uranium Inorganic materials 0.000 claims 1
- 238000002679 ablation Methods 0.000 claims 1
- 238000005422 blasting Methods 0.000 claims 1
- 229910002092 carbon dioxide Inorganic materials 0.000 claims 1
- 239000001569 carbon dioxide Substances 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 210000003128 head Anatomy 0.000 claims 1
- 230000002706 hydrostatic effect Effects 0.000 claims 1
- 230000002262 irrigation Effects 0.000 claims 1
- 238000003973 irrigation Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 230000000786 pneumoconiotic effect Effects 0.000 claims 1
- 238000007790 scraping Methods 0.000 claims 1
- 230000035939 shock Effects 0.000 claims 1
- 230000002194 synthesizing effect Effects 0.000 claims 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 claims 1
- 238000001771 vacuum deposition Methods 0.000 claims 1
- 238000013022 venting Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 44
- 239000010410 layer Substances 0.000 description 37
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 15
- 239000007921 spray Substances 0.000 description 14
- 239000004677 Nylon Substances 0.000 description 11
- 239000012528 membrane Substances 0.000 description 11
- 229920001778 nylon Polymers 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 230000000903 blocking effect Effects 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 235000004263 Ocotea pretiosa Nutrition 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 244000227633 Ocotea pretiosa Species 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920006284 nylon film Polymers 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 238000000053 physical method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 244000009660 Sassafras variifolium Species 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 1
- CQMUOFGWJSNFPX-UHFFFAOYSA-N [O].[Sn].[Sn] Chemical compound [O].[Sn].[Sn] CQMUOFGWJSNFPX-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000005276 aerator Methods 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 239000011825 aerospace material Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008384 membrane barrier Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 208000001491 myopia Diseases 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000009931 pascalization Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 210000003625 skull Anatomy 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 1
- 239000011269 tar Substances 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3491—Manufacturing of targets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US1995/001089 WO1996023085A1 (en) | 1995-01-25 | 1995-01-25 | Autoclave bonding of sputtering target assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW317518B true TW317518B (en, 2012) | 1997-10-11 |
Family
ID=22248573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084105089A TW317518B (en, 2012) | 1995-01-25 | 1995-05-22 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0752017A1 (en, 2012) |
| JP (1) | JP3804974B2 (en, 2012) |
| AU (1) | AU1834795A (en, 2012) |
| TW (1) | TW317518B (en, 2012) |
| WO (1) | WO1996023085A1 (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11851748B2 (en) | 2020-03-31 | 2023-12-26 | Jx Metals Corporation | Sputtering target and method for manufacturing a sputtering target |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3983862B2 (ja) * | 1997-10-24 | 2007-09-26 | Ｄｏｗａホールディングス株式会社 | スパッタリングターゲットとその接合方法及び接合装置 |
| US6506289B2 (en) * | 2000-08-07 | 2003-01-14 | Symmorphix, Inc. | Planar optical devices and methods for their manufacture |
| US7469558B2 (en) | 2001-07-10 | 2008-12-30 | Springworks, Llc | As-deposited planar optical waveguides with low scattering loss and methods for their manufacture |
| US7404877B2 (en) | 2001-11-09 | 2008-07-29 | Springworks, Llc | Low temperature zirconia based thermal barrier layer by PVD |
| US6884327B2 (en) | 2002-03-16 | 2005-04-26 | Tao Pan | Mode size converter for a planar waveguide |
| US7378356B2 (en) | 2002-03-16 | 2008-05-27 | Springworks, Llc | Biased pulse DC reactive sputtering of oxide films |
| US7993773B2 (en) | 2002-08-09 | 2011-08-09 | Infinite Power Solutions, Inc. | Electrochemical apparatus with barrier layer protected substrate |
| US20070264564A1 (en) | 2006-03-16 | 2007-11-15 | Infinite Power Solutions, Inc. | Thin film battery on an integrated circuit or circuit board and method thereof |
| US7826702B2 (en) | 2002-08-27 | 2010-11-02 | Springworks, Llc | Optically coupling into highly uniform waveguides |
| US7205662B2 (en) | 2003-02-27 | 2007-04-17 | Symmorphix, Inc. | Dielectric barrier layer films |
| US7238628B2 (en) | 2003-05-23 | 2007-07-03 | Symmorphix, Inc. | Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides |
| US7959769B2 (en) | 2004-12-08 | 2011-06-14 | Infinite Power Solutions, Inc. | Deposition of LiCoO2 |
| CN101931097B (zh) | 2004-12-08 | 2012-11-21 | 希莫菲克斯公司 | LiCoO2的沉积 |
| US7838133B2 (en) | 2005-09-02 | 2010-11-23 | Springworks, Llc | Deposition of perovskite and other compound ceramic films for dielectric applications |
| US8342383B2 (en) * | 2006-07-06 | 2013-01-01 | Praxair Technology, Inc. | Method for forming sputter target assemblies having a controlled solder thickness |
| US8197781B2 (en) | 2006-11-07 | 2012-06-12 | Infinite Power Solutions, Inc. | Sputtering target of Li3PO4 and method for producing same |
| CN101903560B (zh) | 2007-12-21 | 2014-08-06 | 无穷动力解决方案股份有限公司 | 用于电解质膜的溅射靶的方法 |
| US8518581B2 (en) | 2008-01-11 | 2013-08-27 | Inifinite Power Solutions, Inc. | Thin film encapsulation for thin film batteries and other devices |
| US20100012488A1 (en) * | 2008-07-15 | 2010-01-21 | Koenigsmann Holger J | Sputter target assembly having a low-temperature high-strength bond |
| KR102155933B1 (ko) | 2008-08-11 | 2020-09-14 | 사푸라스트 리써치 엘엘씨 | 전자기 에너지를 수확하기 위한 일체형 컬렉터 표면을 갖는 에너지 디바이스 및 전자기 에너지를 수확하는 방법 |
| CN102576828B (zh) | 2009-09-01 | 2016-04-20 | 萨普拉斯特研究有限责任公司 | 具有集成薄膜电池的印刷电路板 |
| EP2577777B1 (en) | 2010-06-07 | 2016-12-28 | Sapurast Research LLC | Rechargeable, high-density electrochemical device |
| KR101240204B1 (ko) * | 2011-12-19 | 2013-03-07 | 주식회사 나노신소재 | 원통형 스퍼터링 타겟의 제조방법 |
| CN107914075A (zh) * | 2017-11-14 | 2018-04-17 | 宁波江丰电子材料股份有限公司 | 靶材焊接方法 |
| JP7311290B2 (ja) * | 2019-03-27 | 2023-07-19 | Ｊｘ金属株式会社 | 分割スパッタリングターゲット及びその製造方法 |
| CN113070685B (zh) * | 2021-03-26 | 2022-05-03 | 安徽江淮汽车集团股份有限公司 | 包边与点焊一体化模具 |
| CN113458523A (zh) * | 2021-07-05 | 2021-10-01 | 宁波江丰电子材料股份有限公司 | 一种钽靶材组件的焊接方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63270459A (ja) * | 1987-04-24 | 1988-11-08 | Matsushita Electric Ind Co Ltd | スパツタ用タ−ゲツトのボンデイング方法 |
| JP2731152B2 (ja) * | 1987-11-17 | 1998-03-25 | 日立金属株式会社 | 冷却部材付きスパッタリング用ターゲット |
| JPH03140464A (ja) * | 1989-10-26 | 1991-06-14 | Kobe Steel Ltd | ターゲットのバッキング装置 |
| GB9108553D0 (en) * | 1991-04-22 | 1991-06-05 | Ion Coat Ltd | Ionised vapour source |
-
1995
- 1995-01-25 AU AU18347/95A patent/AU1834795A/en not_active Abandoned
- 1995-01-25 WO PCT/US1995/001089 patent/WO1996023085A1/en not_active Application Discontinuation
- 1995-01-25 EP EP95910130A patent/EP0752017A1/en not_active Withdrawn
- 1995-01-25 JP JP52282796A patent/JP3804974B2/ja not_active Expired - Lifetime
- 1995-05-22 TW TW084105089A patent/TW317518B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11851748B2 (en) | 2020-03-31 | 2023-12-26 | Jx Metals Corporation | Sputtering target and method for manufacturing a sputtering target |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10502707A (ja) | 1998-03-10 |
| AU1834795A (en) | 1996-08-14 |
| WO1996023085A1 (en) | 1996-08-01 |
| EP0752017A1 (en) | 1997-01-08 |
| JP3804974B2 (ja) | 2006-08-02 |
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