AU1834795A - Autoclave bonding of sputtering target assembly - Google Patents

Autoclave bonding of sputtering target assembly

Info

Publication number
AU1834795A
AU1834795A AU18347/95A AU1834795A AU1834795A AU 1834795 A AU1834795 A AU 1834795A AU 18347/95 A AU18347/95 A AU 18347/95A AU 1834795 A AU1834795 A AU 1834795A AU 1834795 A AU1834795 A AU 1834795A
Authority
AU
Australia
Prior art keywords
sputtering target
target assembly
autoclave bonding
autoclave
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU18347/95A
Inventor
Richard Ernest Demaray
Manuel Herrera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AKT Inc
Original Assignee
Applied Komatsu Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Komatsu Technology Inc filed Critical Applied Komatsu Technology Inc
Publication of AU1834795A publication Critical patent/AU1834795A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491—Manufacturing of targets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
AU18347/95A 1995-01-25 1995-01-25 Autoclave bonding of sputtering target assembly Abandoned AU1834795A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1995/001089 WO1996023085A1 (en) 1995-01-25 1995-01-25 Autoclave bonding of sputtering target assembly

Publications (1)

Publication Number Publication Date
AU1834795A true AU1834795A (en) 1996-08-14

Family

ID=22248573

Family Applications (1)

Application Number Title Priority Date Filing Date
AU18347/95A Abandoned AU1834795A (en) 1995-01-25 1995-01-25 Autoclave bonding of sputtering target assembly

Country Status (5)

Country Link
EP (1) EP0752017A1 (en)
JP (1) JP3804974B2 (en)
AU (1) AU1834795A (en)
TW (1) TW317518B (en)
WO (1) WO1996023085A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3983862B2 (en) * 1997-10-24 2007-09-26 Ｄｏｗａホールディングス株式会社 Sputtering target and its joining method and joining apparatus
US6506289B2 (en) * 2000-08-07 2003-01-14 Symmorphix, Inc. Planar optical devices and methods for their manufacture
US6884327B2 (en) 2002-03-16 2005-04-26 Tao Pan Mode size converter for a planar waveguide
US8535396B2 (en) 2002-08-09 2013-09-17 Infinite Power Solutions, Inc. Electrochemical apparatus with barrier layer protected substrate
US20070264564A1 (en) 2006-03-16 2007-11-15 Infinite Power Solutions, Inc. Thin film battery on an integrated circuit or circuit board and method thereof
TWI274199B (en) 2002-08-27 2007-02-21 Symmorphix Inc Optically coupling into highly uniform waveguides
US8636876B2 (en) 2004-12-08 2014-01-28 R. Ernest Demaray Deposition of LiCoO2
US7959769B2 (en) 2004-12-08 2011-06-14 Infinite Power Solutions, Inc. Deposition of LiCoO2
US7838133B2 (en) 2005-09-02 2010-11-23 Springworks, Llc Deposition of perovskite and other compound ceramic films for dielectric applications
US8342383B2 (en) 2006-07-06 2013-01-01 Praxair Technology, Inc. Method for forming sputter target assemblies having a controlled solder thickness
US8197781B2 (en) 2006-11-07 2012-06-12 Infinite Power Solutions, Inc. Sputtering target of Li3PO4 and method for producing same
US9334557B2 (en) 2007-12-21 2016-05-10 Sapurast Research Llc Method for sputter targets for electrolyte films
JP5705549B2 (en) 2008-01-11 2015-04-22 インフィニット パワー ソリューションズ， インコーポレイテッド Thin film encapsulation for thin film batteries and other devices
US20100012488A1 (en) * 2008-07-15 2010-01-21 Koenigsmann Holger J Sputter target assembly having a low-temperature high-strength bond
EP2319101B1 (en) 2008-08-11 2015-11-04 Sapurast Research LLC Energy device with integral collector surface for electromagnetic energy harvesting and method thereof
EP2474056B1 (en) 2009-09-01 2016-05-04 Sapurast Research LLC Printed circuit board with integrated thin film battery
US20110300432A1 (en) 2010-06-07 2011-12-08 Snyder Shawn W Rechargeable, High-Density Electrochemical Device
KR101240204B1 (en) * 2011-12-19 2013-03-07 주식회사 나노신소재 Method for manufacturing a cylindrical sputtering target
CN107914075A (en) * 2017-11-14 2018-04-17 宁波江丰电子材料股份有限公司 Target material welding method
JP7311290B2 (en) * 2019-03-27 2023-07-19 Ｊｘ金属株式会社 Segmented sputtering target and manufacturing method thereof
JP7250723B2 (en) 2020-03-31 2023-04-03 Ｊｘ金属株式会社 Sputtering target and sputtering target manufacturing method
CN113070685B (en) * 2021-03-26 2022-05-03 安徽江淮汽车集团股份有限公司 Edge covering and spot welding integrated die
CN113458523A (en) * 2021-07-05 2021-10-01 宁波江丰电子材料股份有限公司 Welding method of tantalum target material assembly

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63270459A (en) * 1987-04-24 1988-11-08 Matsushita Electric Ind Co Ltd Bonding method for sputtering target
JP2731152B2 (en) * 1987-11-17 1998-03-25 日立金属株式会社 Sputtering target with cooling member
JPH03140464A (en) * 1989-10-26 1991-06-14 Kobe Steel Ltd Backing device for target
GB9108553D0 (en) * 1991-04-22 1991-06-05 Ion Coat Ltd Ionised vapour source

Also Published As

Publication number Publication date
WO1996023085A1 (en) 1996-08-01
JPH10502707A (en) 1998-03-10
EP0752017A1 (en) 1997-01-08
JP3804974B2 (en) 2006-08-02
TW317518B (en) 1997-10-11

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