TW275185B - - Google Patents

Info

Publication number
TW275185B
TW275185B TW083101379A TW83101379A TW275185B TW 275185 B TW275185 B TW 275185B TW 083101379 A TW083101379 A TW 083101379A TW 83101379 A TW83101379 A TW 83101379A TW 275185 B TW275185 B TW 275185B
Authority
TW
Taiwan
Application number
TW083101379A
Original Assignee
Emi Tec Elektronische Material
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6490474&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW275185(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Emi Tec Elektronische Material filed Critical Emi Tec Elektronische Material
Application granted granted Critical
Publication of TW275185B publication Critical patent/TW275185B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Pens And Brushes (AREA)
TW083101379A 1993-06-14 1994-02-18 TW275185B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4319965A DE4319965C3 (de) 1993-06-14 1993-06-14 Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung

Publications (1)

Publication Number Publication Date
TW275185B true TW275185B (zh) 1996-05-01

Family

ID=6490474

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083101379A TW275185B (zh) 1993-06-14 1994-02-18

Country Status (3)

Country Link
US (4) US5882729A (zh)
DE (3) DE4319965C3 (zh)
TW (1) TW275185B (zh)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4319965C3 (de) * 1993-06-14 2000-09-14 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
CA2129073C (en) * 1993-09-10 2007-06-05 John P. Kalinoski Form-in-place emi gaskets
US6303180B1 (en) 1993-09-10 2001-10-16 Parker-Hannifin Corporation Form-in-place EMI gaskets
DE4340108C3 (de) * 1993-11-22 2003-08-14 Emi Tec Elektronische Material Abschirmelement und Verfahren zu dessen Herstellung
US5536342A (en) * 1994-03-18 1996-07-16 W. L. Gore & Associates, Inc. Automated gasket applicator and method of using same
US6635354B2 (en) 1995-01-20 2003-10-21 Parker-Hannifin Corporation Form-in place EMI gaskets
US5910524A (en) * 1995-01-20 1999-06-08 Parker-Hannifin Corporation Corrosion-resistant, form-in-place EMI shielding gasket
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DE50102590D1 (de) * 2000-01-22 2004-07-22 Helmut Kahl Verfahren zur herstellung einer elektromagnetischen abschirmung
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US6723916B2 (en) * 2002-03-15 2004-04-20 Parker-Hannifin Corporation Combination EMI shielding and environmental seal gasket construction
DE10221100C1 (de) * 2002-05-03 2003-06-05 Neuhaus Elektronik Gmbh Elektrisch leitfähige Dichtung sowie Verfahren und Vorrichtung zu deren Herstellung
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US6831224B2 (en) * 2003-04-25 2004-12-14 Nokia Corporation One-piece manufactured shielding casing for accommodating electronic functional elements
US7372662B2 (en) * 2003-08-14 2008-05-13 Seagate Technology Llc Base deck with formed-in-place gaskets and impact dissipation members for a data storage device
WO2005020228A1 (en) * 2003-08-14 2005-03-03 Seagate Technology Llc Base deck with formed-in-place gaskets and impact dissipation members for a data storage device
TWI357425B (en) * 2003-09-09 2012-02-01 Laird Technologies Inc Microwave-absorbing form-in-place paste
JP2005187793A (ja) * 2003-12-24 2005-07-14 Rohm & Haas Electronic Materials Llc 改良された接着剤
FI121974B (fi) * 2007-05-14 2011-06-30 Flaekt Woods Ab Menetelmä ilmanvaihtokanavien ja/tai niiden päätelaitteiden välisen tiivisteen muodostamiseksi sekä tiiviste
DE102010000088B4 (de) * 2010-01-15 2011-09-22 Sonderhoff Chemicals Gmbh Verfahren und Vorrichtung zum Herstellen von Polymerkaschierungen oder strangförmigen Aufträgen an einem Substrat
DE102010061714B4 (de) * 2010-11-22 2023-09-21 Endress+Hauser SE+Co. KG Elektronikeinheit mit Abschirmung
US8830662B2 (en) * 2011-03-01 2014-09-09 Apple Inc. Electronic devices with moisture resistant openings
DE102011013458A1 (de) * 2011-03-09 2012-09-13 Valeo Systèmes d'Essuyage Scheibenwischerantrieb
CN104324866B (zh) * 2013-07-22 2016-05-11 泰科电子(上海)有限公司 在工件的凹槽中注入密封胶的方法
US20170225423A1 (en) * 2014-12-23 2017-08-10 Dixie Consumer Products Llc Methods for securing a shrinkable film to a paperboard substrate and methods for making paperboard containers therefrom
US9975137B2 (en) * 2015-03-24 2018-05-22 The Boeing Company Systems and methods for sealant layering
WO2018212950A1 (en) * 2017-05-16 2018-11-22 Gentex Corporation Battery module housing and packaging
JP7120119B2 (ja) * 2019-03-29 2022-08-17 日本電産株式会社 液剤塗布方法、液剤塗布機および液状ガスケット
DE102022109752A1 (de) 2022-04-22 2023-10-26 Audi Aktiengesellschaft Vorrichtung zum Auftragen einer Formdichtung, Verfahren und Batterieanordnung

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Also Published As

Publication number Publication date
US20010045713A1 (en) 2001-11-29
DE4319965C2 (de) 1996-11-21
US20040108522A1 (en) 2004-06-10
US7059844B2 (en) 2006-06-13
US5882729A (en) 1999-03-16
DE9404291U1 (de) 1994-06-16
US6949270B2 (en) 2005-09-27
DE4319965C3 (de) 2000-09-14
DE4319965A1 (de) 1994-12-15
DE59401064D1 (de) 1997-01-02
US6329014B1 (en) 2001-12-11

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