TW255986B - - Google Patents

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Publication number
TW255986B
TW255986B TW082106149A TW82106149A TW255986B TW 255986 B TW255986 B TW 255986B TW 082106149 A TW082106149 A TW 082106149A TW 82106149 A TW82106149 A TW 82106149A TW 255986 B TW255986 B TW 255986B
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TW
Taiwan
Prior art keywords
metal
heat
heat dissipator
attached
bubble
Prior art date
Application number
TW082106149A
Other languages
English (en)
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Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Application granted granted Critical
Publication of TW255986B publication Critical patent/TW255986B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

經濟部中夹棟隼局貝工消費合作杜印製 255986 a7 _ ' --— B7 五、發明説明（厂 ~ '— -- 〔發明領域〕 本發明係有關於半導體元件，更特別.地爲使用於半 導體元件上的金屬泡體熱消散器。 、 〔發明背景〕 在半導體元件及積體電路的傳統熱消散方式爲使用 ，翼片（P i n f i n)或堆疊平板的熱消散器來置於包裝之 背面。堆晏平板和針翼片的消散器在等效於泡體消散器 (散熱效率時需更大㈣積。熱消散之效果依賴於表面 面積和元件的熱傳導率，且和週遭溫度和元件四周之空 氣流動速率有關。 〔發明之簡單摘要説明〕 本發明係利用金屬紐做成之熱消散器，以應用於 丰季體元件上。熱料特性依賴紐的有效㈣面積。 泡tt之散熱面積依紐上每平方英对之氣孔數多寡而定 :每平方英吋提供20個氣孔之泡體消散器，對大部分之 兀件而T提供了適當的表面面積且允許了充足的空氣流 動0 金屬泡嫌被固定於熱擴張器上，藉由導熱膠黏著於 半導體元件上。 本發明象徵了一先進技術’藉由以下之描述及附上 之圖示，使本發明之目的變得容易瞭解，新奇的特性被 敘述於申請專利範圍内。 本紙張尺度逋用中國國家標隼< CNS ) A4規格（210X297公釐） ----------^、-|1.^ (請先閲讀背面之注意事項再填寫本頁) S55986 A7 B7 五、發明説明（ 經濟部中央棵準局貝工消費合作社印裝 〔圖面之簡單敘述〕 圖一係傳統使用針翼片之散熱器； 圖二係傳統使用堆疊平板之散熱器； 圖三係金屬泡想散熱器；且 圏四爲金屬泡禮散熱器和平板散熱器的每c/ffatt之 度數封空氣流動比之表格。 〔本發明之較佳實施例説明〕 圖一爲一針翼片之散熱器。半導體元件1〇上有一锖 張平板11位於其上部表面。針翼片散熱片12有許多翼片 13垂直於散熱片之主體12上。 圖二爲一堆疊平板散熱器。半導體元件2〇之上部平 面上有一熱擴張平板21固定於上。堆疊平板散熱器？2由 多個堆疊平板23及24组成。平板24比平板23更小。這樣 供了更大之散熱面積。 圖三爲本發明之具體圖示，爲使甩金屬泡體之散参 器。金屬泡雜於各種的來源是可用的。半導體元件3〇: -熱擴張器31附著於它的頂部表面。熱擴張器31可以： :譬如，紹或銅之平板，在擴張器土爲金屬泡 32。泡制散器32上有〇孔在其表面上，且穿 器I王體。泡“散器類似海棉上有孔延伸穿過其消= 王體。這些於表面及内部的孔提供了金屬泡雜之^ 單位體積極多的表面散熱面積。 以熱擴張板31爲銘材質爲例，大约是 泡體大约是250mi 1厚。 ^ 請 先 聞 讀 背 面 之 注 頁 裴 訂 線 本紙張从適财關家揉準（CNS ) A4· ( 210X297公釐了 255986 A7 B7 五、發明説明（） 圖四爲平板散熱器和金屬泡體散熱器之比較表。泡 禮教熱器爲1.8"平方X 30"高。平板爲2".平方X .32"高 °空氣的變化量使用側流流過散熱片。每分鐘之氣流量 測取0, 100,300和500FPM。金屬泡體散熱片取每吋10,20 和40個孔。量測値代表元件每瓦之攝氏消散度數。 ’例如，一個4瓦的元件，使用平板散熱器/熱消散 器爲9.9父4 = 39.6。(：之上述周固溫度。若用2〇??1之泡體 消散器則爲8.7 X 4 = 34 . 8°C之上述周圍溫度。這是沒有 空氣流動之情形。若有一氣流3〇〇fpm，使用平板消散器 則爲14 · 4°C之上述周圍溫度。若使用金屬泡體散熱器則 爲10 . 4°C之上述周圍溫度。這是經由金屬泡體消散器之 使用，而改進了 4 °C。 ----------穿-- (請先Μ讀背面之注意事項再填寫本頁) 、τ
I 經濟部中央揉準局負工消費合作社印裝 本紙張尺度適用中國國家揉準（CNS ) Α4規格（210X297公釐）

Claims (1)

  1. Z55986 Α8 Β8 C8 D8 經濟部中央梯準局員工消費合作社印装 申請專利範圍 1.一種使用於半導體元件之熱消散器，由附著於半導體元 件表面之熱擴張器和附著於熱擴張器上之金屬泡髗组成 2. 如申請專利範囲第1項所述之熱消散器，其中該金屬泡 禮爲一熱傳導金屬。 3. 如申請專利範園第1項所述之熱消散器，其中該熱擴張 器爲一熱傳導金屬β 4 ·如申請專利範圍第1項所述之熱消散器，其中該金屬泡 體藉由導熱膠附著於琴熱擴張器上。 5. 如申請專利範圍第1項所述之熱消散器，其中該金屬泡 體飾以黄銅於該熱擴張器上。 6. 如申請專利範圍第1項所述之熱消散器，其中該金屬結 合被飾以黄銅於該熱擴張器上。 7 ·如申請專利範圍第1項所述之熱消散器，其中該金屬泡 體於每吋上有5到50個範園的氣孔。 8.—種用於半導體元件之熱消散器，其特徵包括： 附著於半導體元件表面之熱擴張器；及 附著於熱擴張器上之多孔鋁泡體，其中該多孔鋁泡體於 每吋上約有20個左右的氣孔。 — — — ———— 裝.—I I 訂 ^線 (請先聞讀背面之注意事項再填寫本頁) -6 -
TW082106149A 1992-03-05 1993-08-02 TW255986B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US84665092A 1992-03-05 1992-03-05

Publications (1)

Publication Number Publication Date
TW255986B true TW255986B (zh) 1995-09-01

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ID=25298541

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EP (1) EP0559092A1 (zh)
JP (1) JPH065751A (zh)
KR (1) KR930020647A (zh)
TW (1) TW255986B (zh)

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Also Published As

Publication number Publication date
EP0559092A1 (en) 1993-09-08
KR930020647A (ko) 1993-10-20
JPH065751A (ja) 1994-01-14

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