201101983 六、發明說明： 【發明所屬之技術領域】 ，本發明係有關於—種散、散熱ϋ及其製造方法 尤‘種可擴增散熱面積的散熱轉片與具有該散熱錯片 的散熱器及其製造方法。 【先前技術】 -般散熱裝置通常係包括—導熱座、複數熱管以及複 數散_片。導熱座係貼接於一發熱電子元件上，熱管包 含一受熱段以及分別從受熱段兩端延伸而出的一放孰段， =此種熱管通常係呈一㈣。熱管之受熱段係嵌設：導熱 座’而散熱鰭片則是一一穿接於熱管之放熱段。發熱.電子 產=熱量係先傳導至導熱座，導熱座再將熱量傳 ^面^攻後熱量由熱管傳至散熱鰭片，再由散熱轉片的 表面散逸至空氣中。 然而，此種散熱裝置在實際使用上仍具有一此 散熱裝置之熱管係呈υ型，而散熱籍片侧片 肢直接穿人熱管之中，如此將會造成散熱鰭片中央 熱管的放熱段較遠，所以散熱鰭片在此部散 顯著。另外’發熱電子元件所產生的廢教將： 。里積存在導熱座上，進而影響散熱裝置整體的散熱效 是以’如何解決上述之問題點，即成 良之目標。 ％ 3人所改 【發明内容】 201101983 本發明之一目的，在於提供一 片式散熱器及其製造方法，m 擴增散熱面積的鱗 蟲掩糟由母—散熱鰭片本身的彎折 疊接’在有限的的空間之内提高散熱韓片的密度，並= 散熱鰭片所具有的散熱面積，進 " 熱效能。 ㈣進岐升散歸置的整體散 為了達成上述之目的，本發明係提供 面積的散熱鰭片，包括一下板以及 ^ n 一空π # 下板以及―上板’該下板開設有 自該τ板延伸，並彎折疊置於該下板之上 Ο並於之間开>成有一散熱通道。 為了達成上述之目的，本發明係提供一種可 .彳；的籍片式散熱器’包括-熱管以及複數職片，該 =一受熱段以及自該受熱段延伸而出的-放熱段， 以散…一、s片具有一下板以及從該下板延伸的一上板，該上 板係彎折疊置於該下板之上並於之間形成有一散熱通道， 該下板及該上板開設有相互對應的一穿孔，該散熱籍片分 〇別以該穿孔依序套接在該熱管之該放熱段。 為了達成上述之目的，本發明係提供一種可擴增散教 面積的鰭片式散熱器的製造方法，其步驟包括：a)提供二 導座以及一熱官，b)將該熱管嵌固於該導熱座内丨C)提 i、複數放熱鰭>}，該散熱韓片具有—下板以及從該下板延 伸的_M反’將該上板彎折叠接於該下板之上丨由於該上 板及該下板開設有相互對應的—穿孔；以及e)將該等散熱 鰭片以該等穿孔依序套接於該熱管。 本發明對知於先前技術具有以下功效，在一定的空間 201101983 内提高散熱鱗片的密度以擴增散熱面積。另外，散 還可依實際需求而向左右兩侧向外延伸。再者，還可 熱座上貼接-散熱體來提高導熱座的導熱效率。又，熱戽 之受熱段底部係呈平面狀並與導熱座底部齊平，係可更^ 密貼接於發熱電子元件上，提高熱傳效能。 ' 【實施方式】 有關本發明之詳細說明及技術内容，配合圖式說明如 下’然而所_式僅提供參考與制用，並非用來對本發 明加以限制者。 請參閱第-至三圖，係分別為本發明散熱賴片之立體 外觀圖、本發明散熱鰭片之側視圖以及本發明之立體分解 圖’本發明係提供-種可擴增散熱面積的轉片式散熱器工 ，包括-導熱座10、複數熱管20、複數散熱鰭片3〇以及一 散熱體40，其中： 導熱座10，其底部設有複數開槽11。導熱座10係貼接 於一發熱電子元件（圖未示）上。本實施例中，熱管20的 個數係為三，但不以此型態為限。 熱管20具有一受熱段21以及分別自受熱段以兩端彎折 延伸7出的—放熱段22，以使熱管20呈一 U型。另外，兩 放熱'^又22之間係形成有—容置空間e。受熱段21係容設於 幵:〜内而嵌设於導熱座10。再者，請參照第六圖，受熱 段21之底部係呈一平面狀，並與導熱座_底部相齊平， 、使，散熱裳置1貼接於發熱電子元件（圖未示）時，能 更緊逸的貼接，達到更好的熱傳效能。 201101983 散熱韓片3G具有-下板31以及從下板31延伸的一上板 32，上板32係彎折疊置於下板31之上並於之間形成有一散 ,，，、通道b下板31及上板32開設有相互對應的一穿孔％， 散熱籍片30分別以穿孔33依序套接在熱管如之放熱段^。 而穿孔33周圍成型有自下板31延伸的一内環牆以 及自上板32延伸的一外環牆321 ,内環牆311與外環牆 321係相互貼接，内環牆311係與熱管2〇之放熱段熱接 觸。 ❹ 冑熱體4G則貼接於導熱座10並配置於散熱鰭片30之間 ’即散熱體40配設於容置空間e内。散熱體4()具有與導熱 座10熱接觸的一基座41以及從基座41向上延伸的複數延伸 片42，此等延伸片42係間隔設置，以在兩延伸片42之間形 成有一氣流通道d。 "月參閱第四及五圖，係分別為本發明之立體組合圖以 及第四圖5-5剖面線之局部剖視圖。請參照第四圖，散 〇，鰭片30係穿接於熱管2〇之放熱段22。而可以實際的使用 而求改變上板32或下板31的尺寸，使其向兩側延伸，如 此亦可增加散熱面積。 一明併參照第六至八圖，係分別為本發明散熱鰭片製 作示意圖（一）、本發明散熱鰭片製作示意圖（二）以及 本發明散熱鰭片製作示意圖（三）。首先，上板32係被對 折疊接於下板31之上，再於上板32以及下板31開設有相互 對應的穿孔33。最後以一成型治具對上板32及下板31進行 I伸加工，而分別成型有一内環牆311以及與内環牆311 201101983 貼接的一外環牆321 。 、本：ί:【九至十—圖’係分別為本發明之側視截面圖 視截二:=截:== = - 延伸而配設於位於兩端的散熱糊之間=Ϊ == 型態可使導熱座1〇上的熱量除了藉由^ 散熱效能。™餘_延伸片42來散熱，增加 ::閱第十圖，由俯視圖可看出，散熱鰭片3〇之上板 32或下板31可依#際❹需求_水平 ，以增加散熱效能。 狀伸擴張 閱第十-圖，導熱座1()之底部與熱管如之受熱段 係貼接於發熱電子元件6Q的表面。圖中所標示的 即為電子元件6G產生的廢熱所傳遞的方向。廢熱 σ藉由'、、、g 20的文熱段21傳遞至兩端的放熱段^ ’再傳遞 至散熱鰭片3G，最後再由散熱鰭片3㈣表面散逸至空氣中 以完成散熱。 另外種方式是電子元件60產生的廢熱傳遞至導熱座 1〇再由導熱座10傳遞至散熱體40的延伸片42之表面，最 後再由流動的空氣將廢熱帶走，以完成散熱。藉由將這兩 種散：方式結合，可增強此散熱裝置1的熱傳效能。 ^明參閲第十二圖，係為本發明製造方法之流程圖，本 發明所提供之可擴增散熱面積的鰭片式散熱器的製造方法 其步驟包括： 3 201101983 步驟101，提供導熱座以及熱管20。 部八組裳導熱座10以及熱管20。將熱㈣之-邛刀嵌固於導熱座10内，埶 座10。進-步說m 他部份係外露於導熱 的開内，:A …S 20之受熱段21係容設於導熱座10 1槽π内’並與導孰座1〇賢漆目上社 ⑵系位於導熱㈣的^ 而熱管2G之放熱段 於下’散熱鰭片3〇彎折製程。將上板32彎折疊接 Ο板32不笼真，。如第一及二圖所示，彎折後的下板3〗與上 、，且於之間形成有散熱通道b。另外，上板32 2端係呈麵起狀而不完全貼接係為了增加散熱鰭片30的 ' ，不μ型態為限’下㈣之末端呈翹起亦可 步驟104，散熱鰭片3〇延伸加工製程。接著，以一 f治=7G對上板32及下板31進行延伸加工，而分別成型有 一内環牆311以及與内環牆311貼接的-外環牆321。進 〇 -步說明’成型治具70的加工方向係由幻下板的下方往上 ^中壓’因此，内環牆311係、由位於下板31延伸而成，外 %牆321貝11是由位於上板32延伸而成，兩者係相互緊密貼 接。 步驟105 ’組裝散熱鰭片3〇。將該等散熱鰭片3〇以穿 孔33依序套接於熱管2〇。 步驟106組裝散熱體40。提供一散熱體4〇，將散熱 體4〇貼接於導熱座10上，而散熱體4〇之延伸片42係配設於 放熱段22之間的容置空間c内。 201101983 凊參照第十三圖’係為本發明散熱鰭片另一實施例之 側視截面圖，散熱鰭片30之上板32係彎折疊置於下板31之 上並於之間形成有散熱通道b。本實施例中，下板31開設 有一穿孔33。穿孔33周圍成型有一環牆34，但不以此型態 為限。 請參照第十四圖’係為本發明散熱鰭片又一實施例之 側視截面圖’本實施例中，熱管2〇係為—扁管。因此散軌 體4〇之基座41可直接貼接於受熱段21上。而受熱段21之底 :可直接貼接於一發熱電子元件（圖未示）上。可節省散 熱器1的元件數量，更可減少田或夕 ㈣β ^元件接觸所造成的 熱傳遞知失，確保熱傳效能。 綜上所述，當知本發明之可摊 埶器及+ i 夂a散熱面積的鰭片式散 又Si:具有產業利用性、新穎性與進步性， 又本發明之構造亦夫苗 ' ^ ^ 合發明專利申請要件，⑽利法使用，完全符 【圖式簡單說明】 ^ 第一圖 第二圖 第三圖 第四圖 第五圖 第六圖 第七圖 第八圖 係本發明散_片之立體外觀圖。 係本發明散熱鰭片之側視圖。 係本發明之立體分解圖。 係本發明之立體組合圖。 係第四圖以剖面線之局 係本發明散熱鰭片製作示意圖（一 係本發明散熱鰭片t作示意 係本發明散熱鰭片製作μ圖r 10 201101983 第九圖係本發明之侧視截面圖。 第十圖係第六圖沿7-7剖面線之剖視圖。 第十一圖係本發明使用狀態之侧視截面圖。 第十二圖係本發明製造方法之流程圖。 第十二圖係本發明散熱鰭片另一實施例之侧視截面圖 第十四圖係本發明散熱鰭片又一實施例之側視截面圖 【主要元件符號說明】 1 散熱裝置 Ο ίο 導熱座 11 開槽 .20 熱管 21 受熱段 30 散熱鰭片 31 下板 32 上板 〇 33 穿孔 40 散熱體 41 基座 60 電子元件 70 成型治具 b 散熱通道 d 氣流通道 22 放熱段 311 内環牆 321 外環牆 34 環牆 42 延伸片 C 容置空 104、1〇5、1〇6 步驟 101、102、1〇3201101983 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating fin and a heat sink having the same heat dissipating area and a heat sink having the heat dissipating chip And its manufacturing method. [Prior Art] The general heat sink generally includes a heat conducting seat, a plurality of heat pipes, and a plurality of heat sinks. The heat conducting seat is attached to a heat-generating electronic component, and the heat pipe comprises a heat receiving section and a releasing section respectively extending from both ends of the heated section, and the heat pipe is usually one (four). The heat-receiving section of the heat pipe is embedded: the heat-conducting seat' and the heat-dissipating fins are one-to-one that is connected to the heat-dissipating section of the heat pipe. Heating. Electronics = heat is first transmitted to the heat-conducting seat, and the heat-conducting seat transfers the heat to the surface. The heat is transferred from the heat pipe to the heat-dissipating fins, and then the surface of the heat-dissipating fins is dissipated into the air. However, the heat dissipating device still has a heat pipe type of the heat dissipating device in the actual use, and the heat dissipating chip side limb directly penetrates the heat pipe, so that the heat releasing section of the central heat pipe of the heat dissipating fin is compared. Far, so the heat sink fins are prominent in this part. In addition, the waste education produced by the heating electronic components will: The accumulation of heat on the heat sink, which affects the overall heat dissipation of the heat sink, is the goal of how to solve the above problems. %3人改修[Abstract] 201101983 One of the objects of the present invention is to provide a one-piece heat sink and a manufacturing method thereof, in which the scaled mask of the heat dissipation area is folded by the mother-heat sink fin itself Increase the density of the heat-dissipating Korean film within the limited space, and = the heat-dissipating area of the heat-dissipating fins, and the thermal efficiency. (4) In order to achieve the above purpose, the present invention provides an area of heat dissipating fins, including a lower plate and an empty π # lower plate and an "upper plate" which is provided with the τ The plate extends and is folded over the lower plate and is opened to form a heat dissipation channel. In order to achieve the above object, the present invention provides a removable heat sink 'including a heat pipe and a plurality of jobs, the heat receiving section and the heat releasing section extending from the heat receiving section to disperse The s-piece has a lower plate and an upper plate extending from the lower plate, and the upper plate is folded and folded on the lower plate to form a heat dissipation passage therebetween, and the lower plate and the upper plate are opened Correspondingly, a heat-dissipating piece is sequentially sleeved in the heat-dissipating section of the heat pipe. In order to achieve the above object, the present invention provides a method for manufacturing a finned heat sink capable of amplifying a teaching area, the steps comprising: a) providing a second guide and a heat official, b) embedding the heat pipe in The heat conducting seat has a crucible C), a plurality of radiating fins, and the heat dissipating fin has a lower plate and a lower plate extending from the lower plate to fold the upper plate over the lower plate. The upper plate and the lower plate are respectively provided with corresponding perforations; and e) the heat dissipating fins are sequentially sleeved on the heat pipe with the perforations. The present invention has the following effects on the prior art, and increases the density of the heat sinking scale in a certain space 201101983 to amplify the heat dissipation area. In addition, the dispersion can also extend outward to the left and right sides according to actual needs. Furthermore, the heat sink can be attached to the heat sink to improve the heat transfer efficiency of the heat transfer seat. Moreover, the bottom portion of the heated segment of the heat is flat and flush with the bottom of the heat conducting seat, so that it can be closely attached to the heat-generating electronic component to improve heat transfer efficiency. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The detailed description and technical content of the present invention are to be construed as limited and not limited by the description. Please refer to the third to third figures, which are respectively a perspective view of the heat dissipation sheet of the present invention, a side view of the heat dissipation fin of the present invention, and a perspective exploded view of the present invention. The present invention provides an amplifiable heat dissipation area. The chip radiator includes a heat conducting block 10, a plurality of heat pipes 20, a plurality of heat radiating fins 3A, and a heat sink 40, wherein: the heat conducting seat 10 has a plurality of slots 11 at the bottom thereof. The thermal pad 10 is attached to a heat generating electronic component (not shown). In this embodiment, the number of the heat pipes 20 is three, but is not limited to this type. The heat pipe 20 has a heat receiving section 21 and a heat releasing section 22 which is bent and extended from the heat receiving section at both ends to make the heat pipe 20 have a U shape. In addition, the two heat-dissipating '^22's are formed with an accommodation space e. The heat receiving section 21 is housed in the heat transfer seat 10 so as to be housed in the 幵:~. Furthermore, please refer to the sixth figure, the bottom of the heated section 21 is in a flat shape, and is flush with the bottom of the heat conducting seat _, so that the heat sink 1 is attached to the heat generating electronic component (not shown). Can be more tightly attached to achieve better heat transfer performance. 201101983 The heat-dissipating Korean piece 3G has a lower plate 31 and an upper plate 32 extending from the lower plate 31. The upper plate 32 is folded and folded on the lower plate 31 to form a gap between the lower plate and the lower plate. 31 and the upper plate 32 are provided with a corresponding perforation %, and the heat dissipating pieces 30 are respectively sleeved by the through holes 33 in the heat pipe such as the heat release section. An inner ring wall extending from the lower plate 31 and an outer ring wall 321 extending from the upper plate 32 are formed around the through hole 33. The inner ring wall 311 and the outer ring wall 321 are attached to each other, and the inner ring wall 311 is connected with the heat pipe. 2〇 The exothermic section is in thermal contact. The heat sink 4G is attached to the heat conducting base 10 and disposed between the heat radiating fins 30. That is, the heat radiating body 40 is disposed in the accommodating space e. The heat sink 4 () has a base 41 in thermal contact with the heat conducting seat 10 and a plurality of extending pieces 42 extending upward from the base 41. The extending pieces 42 are spaced apart to form an air flow between the extending pieces 42. Channel d. "Monthly, refer to the fourth and fifth figures, which are respectively a partial sectional view of the present invention and a partial cross-sectional view of the hatching of the fourth figure 5-5. Referring to the fourth figure, the fins 30 are connected to the heat release section 22 of the heat pipe 2〇. However, the size of the upper plate 32 or the lower plate 31 can be changed to be practically used to extend to both sides, thereby increasing the heat dissipation area. Referring to the sixth to eighth drawings, respectively, it is a schematic diagram of the heat-dissipating fins of the present invention (1), a schematic diagram of the heat-dissipating fins of the present invention (2), and a schematic diagram of the heat-dissipating fins of the present invention (3). First, the upper plate 32 is folded over the lower plate 31, and the upper plate 32 and the lower plate 31 are respectively provided with corresponding through holes 33. Finally, the upper plate 32 and the lower plate 31 are subjected to a drawing process by a forming jig, and an inner ring wall 311 and an outer ring wall 321 attached to the inner ring wall 311 201101983 are respectively formed.本: :: [Nine to ten-graphs] are respectively side-viewing views of the invention. See two cuts: = cut: == = - extended and placed between the heat sinks at both ends = Ϊ == type The state allows the heat on the heat-conducting seat 1 to be dissipated by the heat dissipation effect. The TM _ extension sheet 42 is used for heat dissipation, and the following is shown in the top view. As can be seen from the top view, the heat dissipation fins 3 〇 the upper plate 32 or the lower plate 31 can be increased according to the demand level _ level to increase the heat dissipation performance. Extension and expansion According to the tenth-figure, the bottom of the heat-conducting seat 1 () and the heat pipe such as the heated section are attached to the surface of the heat-generating electronic component 6Q. What is indicated in the figure is the direction in which the waste heat generated by the electronic component 6G is transmitted. The waste heat σ is transmitted to the heat radiating fins 3 ′ of the heat radiating fins 2 ′ of the ', , g 20 and then transferred to the heat radiating fins 3 G , and finally the surface of the heat radiating fins 3 ( 4 ) is dissipated into the air to complete the heat dissipation. Alternatively, the waste heat generated by the electronic component 60 is transferred to the heat conducting seat 1 and then transferred from the heat conducting base 10 to the surface of the extending piece 42 of the heat radiating body 40, and finally the flowing air passes the waste tropical air to complete the heat dissipation. By combining these two types of modes, the heat transfer efficiency of the heat sink 1 can be enhanced. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 12 is a flow chart of a manufacturing method of the present invention. The method for manufacturing a finned heat sink with an expandable heat dissipation area provided by the present invention includes the following steps: 3 201101983 Step 101, providing a heat conducting seat And a heat pipe 20. The eight groups of sports hot springs 10 and heat pipes 20. The heat (four)-sickle is embedded in the heat-conducting seat 10, and the seat 10 is mounted. Step-by-step m said that part of it is exposed inside the heat-conducting opening: A...S 20's heated section 21 is housed in the heat-conducting seat 10 1 slot π' and with the guide seat 1〇贤漆目上社 (2) It is located in the heat conduction (four) ^ and the heat pipe of the heat pipe 2G is in the lower heat dissipation fin 3〇 bending process. The upper plate 32 is bent and folded, and the slab 32 is not caged. As shown in the first and second figures, the bent lower plate 3 is upper and lower, and a heat dissipation passage b is formed therebetween. In addition, the upper end of the upper plate 32 is in a surface-like shape and is not completely attached in order to increase the heat-dissipating fins 30, and the end of the lower-side type is limited to the lower end (four), and the end may be lifted. Step 104, the heat-dissipating fins 3 〇Extension processing process. Next, the upper plate 32 and the lower plate 31 are stretched by a f = 7G, and an inner ring wall 311 and an outer ring wall 321 which is attached to the inner ring wall 311 are respectively formed. Step-by-step description 'The machining direction of the forming fixture 70 is pressed from the bottom of the lower panel to the upper middle. Therefore, the inner ring wall 311 is formed by extending on the lower plate 31, and the outer wall 321 is 11 It is formed by extending on the upper plate 32, and the two are closely attached to each other. Step 105 'Assemble the heat sink fins 3〇. The heat dissipating fins 3 are sequentially sleeved in the heat pipe 2 through the through holes 33. Step 106 assembles the heat sink 40. A heat dissipating body 4 is provided, and the heat dissipating body 4 is attached to the heat conducting base 10, and the extending piece 42 of the heat dissipating body 4 is disposed in the accommodating space c between the heat releasing sections 22. 201101983 Referring to the thirteenth embodiment, a side cross-sectional view of another embodiment of the heat dissipating fin of the present invention is shown. The upper surface 32 of the heat dissipating fin 30 is folded and folded on the lower plate 31 to form a heat dissipation therebetween. Channel b. In this embodiment, the lower plate 31 defines a through hole 33. A ring wall 34 is formed around the perforation 33, but is not limited to this type. Referring to Fig. 14 is a side cross-sectional view showing still another embodiment of the heat dissipating fin of the present invention. In this embodiment, the heat pipe 2 is a flat tube. Therefore, the base 41 of the loose rail body 4 can be directly attached to the heated section 21. The bottom of the heated section 21 can be directly attached to a heat-generating electronic component (not shown). The number of components of the heat sink 1 can be saved, and the heat transfer loss caused by the contact of the β or the element can be reduced, and the heat transfer efficiency can be ensured. In summary, it is known that the fins of the present invention and the fin-shaped dispersion of the heat dissipation area of the + i 夂a are both industrially usable, novel and progressive, and the structure of the present invention is also ^ Incorporating the patent application requirements, (10) the use of the law, fully in accordance with the [Simple Description] ^ The first picture, the second picture, the third picture, the fourth picture, the fifth picture, the sixth picture, the seventh picture, the eighth picture, the invention The three-dimensional appearance of the film. A side view of the heat sink fin of the present invention. It is a perspective exploded view of the present invention. It is a three-dimensional combination diagram of the present invention. The fourth figure is a schematic diagram of the heat dissipation fins of the present invention in the section line (a series of heat dissipation fins of the present invention is used as a schematic diagram of the heat dissipation fins of the present invention. FIG. 10 is a top view of the present invention. Fig. 11 is a cross-sectional view taken along line 7-7 of the sixth drawing. Fig. 11 is a side cross-sectional view showing the state of use of the present invention. Fig. 12 is a flow chart showing the manufacturing method of the present invention. FIG. 14 is a side cross-sectional view showing another embodiment of the heat dissipating fin of the present invention. [Main component symbol description] 1 heat sink Ο ίο thermally conductive seat 11 slotted .20 heat pipe 21 heat receiving section 30 heat sink fin 31 lower plate 32 upper plate 〇 33 perforation 40 heat sink 41 pedestal 60 electronic component 70 forming fixture b heat dissipation channel d air flow passage 22 heat release section 311 inner ring wall 321 outer ring wall 34 Ring wall 42 extension piece C accommodates empty 104, 1〇5, 1〇6 steps 101, 102, 1〇3