M407417 五、新型說明： 【新型所屬之技術領域】 本新型有關於一種散熱片’特別是有關於一種多折式 / 散熱片及採用此多折式散熱片之電子裝置。 【先前技術】 傳統之精簡塑電腦（Thin Client )會將工作晶片 (Chipset)設置於主機板上方’其主要的散熱方式是在主 φ 機板之同侧貼設一散熱片於工作晶片上。故’散熱片均勻 地將熱能分攤後，藉由自然對流的作用下，可使熱能被向 上導引至空氣，進而離開精簡型電腦。 然而，當精簡蜜電腦相似於筆記型電腦之外型時，也 有可能將工作晶片（Chipset)設置於主機板下方。如此， 即使在主機板之同側貼設相同之散熱片於工作晶片上，散 熱片將工作晶片所產生之熱能分攤後，散熱片上之熱能在 自然對流作用下會散逸到主機板下方的空氣中，但由於空 鲁 氣遇熱後會向上方移動’因此熱能仍持續地累積於主機板 下方，無法快速地將熱能帶離此精簡型電腦外。 【新型内容】 本新型揭露一種多折式散熱片及採用此多折式散熱片 之電子裝置，用以快速地將熱能弓丨導至電子裝置外之空氣 中，避免熱能持續地累積於主機板下方，進而降低電子裝 . 置因過熱而影響效能之機率。 本新型依據一實施方式所提供之電子裝置包含一電路 4 M407417 - 板、一第一發熱元件、一鍵盤模組及一多折式散熱片。電 路板具有一開口及相對之第一側及第二侧。第一發熱元件 位於電路板之第一侧。鍵盤模組位於電路板之第二侧。多 ' 折式散熱片包含一第一片體、一第二片體及一第一連接片 體。第一片體位於電路板之第一側並接觸第一發熱元件。 第二片體位於電路板之第二側並接觸鍵盤模組。第一連接 片體位於第一片體及第二片體之間，且第一連接片體之兩 端分別一體成型地連接於第一片體及第二片體之間，且第 • 一連接片體穿過電路板之開口。 此實施方式中，多折式散熱片更包含一第一導熱塊及 一第二導熱塊。第一導熱塊凸設於第一片體面對電路板之 表面，並接觸第一發熱元件。第二導熱塊凸設於第二片體 面對鍵盤模組之表面，並接觸鍵盤模組。 此外，電子裝置更包含一第二發熱元件。第二發熱元 件位於電路板之第一側。多折式散熱片更包含一第三導熱M407417 V. New description: [New technical field] The present invention relates to a heat sink, which is particularly related to a multi-fold/heat sink and an electronic device using the multi-fold heat sink. [Prior Art] The traditional Thin Client will place the Chipset on the motherboard. The main heat dissipation method is to place a heat sink on the working wafer on the same side of the main φ board. Therefore, the heat sink evenly distributes the heat energy, and the natural convection allows the heat to be directed upward to the air, thereby leaving the compact computer. However, when a compact honey computer is similar to a notebook computer, it is also possible to place a chipset under the motherboard. In this way, even if the same heat sink is attached to the working wafer on the same side of the motherboard, the heat sink distributes the heat generated by the working chip, and the heat energy on the heat sink is dissipated into the air below the motherboard under natural convection. However, because the air is heated, it will move upwards. Therefore, the heat is still accumulated under the motherboard, and it is impossible to quickly take the heat away from the compact computer. [New content] The present invention discloses a multi-fold heat sink and an electronic device using the multi-fold heat sink for rapidly guiding the heat energy to the air outside the electronic device, so as to prevent the heat energy from continuously accumulating on the motherboard Below, it reduces the chance that the electronic device will affect the performance due to overheating. According to an embodiment of the present invention, an electronic device includes a circuit 4 M407417 - a board, a first heating element, a keyboard module and a multi-fold heat sink. The circuit board has an opening and opposite first and second sides. The first heating element is located on the first side of the board. The keyboard module is located on the second side of the board. The multi-folded heat sink comprises a first body, a second body and a first connecting piece. The first body is located on a first side of the circuit board and contacts the first heat generating component. The second body is located on the second side of the circuit board and contacts the keyboard module. The first connecting piece is located between the first piece and the second piece, and the two ends of the first connecting piece are integrally integrally connected between the first piece and the second piece, and the first connection The sheet passes through the opening of the board. In this embodiment, the multi-fold heat sink further comprises a first heat conducting block and a second heat conducting block. The first heat conducting block protrudes from the surface of the first body facing the circuit board and contacts the first heat generating component. The second heat conducting block protrudes from the surface of the second sheet facing the keyboard module and contacts the keyboard module. In addition, the electronic device further includes a second heating element. The second heat generating component is located on the first side of the circuit board. The multi-fold heat sink further includes a third heat conduction
塊。第二導熱塊凸設於第一片體面對電路板之表面，並接 觸第二發熱元件。 本新型之一實施例中，鍵盤模組包含一按鍵組。按鍵 組之-側具有多個金屬件，第二導熱塊接觸其中—金屬件。 本新型之另一實施例中，鍵盤模組包含一按鍵組及一 鍵盤支擇架。鍵盤支撐架位於按鍵組與第二片體之間，用 以固定並支#此按鍵組’而且第二導減接觸鍵盤支 又—實施例中，電子裝置更包含-底座、-鍵盤模組及多折键於其中。二件=r幕及 5 D。问時’多折式散熱片更包人一 核-第二連接片體。樞軸二苐三片體、-樞軸連 面’且連接柩軸件。第 連接部伋於第三片體之表 體之間，且第二 體伋於第二片體及第三片 片體及第三片體，分別 卜體成型地連接第- 面。 體及第三片體處於不同平 本新型依據另一實施 片。多折式散熱片包含'提供之一種多折式散熱 片體、—第-導熱二片體、一第三 一第二連接片體及-框軸連接部、1-連接片體二 片體之表面’並用以接觸—發〜導熱塊凸設於第〆 二片體之表面，並用以接觸一；。第二導熱塊凸設於第 =成型地連接於第-片d;: 片體及第二片體分财於不 第〜片體之間’使第 片體之表面，用以連接一樞軸。柢軸連接部位於第三 -體成型地連接於第二片體及第；片體:端= 及第三片财於不同平面。 體之間’使第-片體 =上所述’藉由本新型之多折式散熱片，電子裝置中 之發…源所產生的熱能可快速地經鍵盤模組，而被引導至 電子裝置外之空氣中’進而維持電子裝置應有之工作性能。 【實施方式】 以下將以圖示及詳細說明清楚說明本新型之精神，如 熟悉此技術之人員在瞭解本新型之實施例後，當可由本新 型所教示之技術，加以改變及修飾，其並不脱離本新型之 料υ/417 精神與範圍。 請參閱第1圖所示，第1圖 之外觀示意圖。本新型提:一二:：:新型多折式散熱片 折式散熱#_呈立體狀%/折式散熱片1GGe此多 ㈣⑽整體地具有相狀第-表ΐ ——-Piece. The second heat conducting block protrudes from the surface of the first sheet facing the circuit board and contacts the second heat generating component. In an embodiment of the present invention, the keyboard module includes a button group. The side of the button group has a plurality of metal members, and the second heat conducting block contacts the metal member. In another embodiment of the present invention, the keyboard module includes a button set and a keyboard support frame. The keyboard support frame is located between the button group and the second body, and is used for fixing and supporting the button group and the second guide member and the second keyboard member. The electronic device further includes a base and a keyboard module. Multi-fold key in it. Two pieces = r screen and 5 D. When asked, the multi-fold heat sink is more inclusive of a core-second connecting piece. The pivot shaft is a three-piece body, a pivot joint, and is connected to the shaft member. The first connecting portion is disposed between the surfaces of the third sheet body, and the second body is disposed between the second sheet body and the third sheet body and the third sheet body, and the first surface is integrally formed. The body and the third body are in different levels. The new type is based on another embodiment. The multi-fold heat sink comprises a multi-fold heat sink body provided, a first heat-conducting two-piece body, a third-first second connecting piece body and a frame-axis connecting portion, and a 1-connecting piece body. The surface 'and the contact-hair-heat-conducting block protrudes from the surface of the second sheet and is used to contact one; The second heat conducting block is protruded from the first piece to the first piece d; the piece body and the second piece are divided between the non-first piece body to make the surface of the first piece body for connecting a pivot . The cymbal connection portion is connected to the second body and the third body in a third body-shaped manner; the end body and the third piece are in different planes. By using the multi-fold heat sink of the present invention, the heat generated by the source of the electronic device can be quickly guided to the electronic device via the keyboard module. In the air, it further maintains the working performance of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS The spirit of the present invention will be clearly described in the following description and detailed description, and those skilled in the art, after having understood the embodiments of the present invention, may be modified and modified by the teachings of the present invention. Without departing from the spirit/scope of this new material. Please refer to the appearance of Figure 1 and Figure 1. This new type: one two::: new multi-fold heat sink Folding heat dissipation #_ is a three-dimensional shape / folding heat sink 1GGe more (four) (10) overall with a phase-like —— ——-
—片體20及一第一連接片體130。 第一連接片體130是位於第―Η辦 之間，且第-連接片/；Λ 1〇及第二片體120 -片俨m β ί 兩端分別—體成型地連接第 12〇可八別产於一片體12〇’使得第一片體110及第二片體 刀別處於不同平面’意即第-片體110之平面盥第 二片體，之平面所相隔之垂直高度即為第一連接片、體 1川之寬度。 在其他實施例中，第一片體110及第二片體12〇亦可 分別斜向連接第一連接片體130，使得第一片體u〇之平 面與第二片體120之平面所相隔之垂直高度小於第一連接 片體130之寬度。 此外，多折式散熱片1〇〇之第一表面101上具有一突 出之第一導熱塊ill，第一導熱塊η〗凸設於第一片體 之表面，以便第一導熱塊m可接觸一發熱體。多折式散 熱片100之第一表面1〇1上具有一突出之第二導熱塊12卜 第一導熱塊121凸設於第二片體120之表面，以便第二導 熱塊121可接觸一散熱體。如此，多折式散熱片便可 熱導接不同垂直高度之發熱體及散熱體，以促使此發熱體 及此散熱體之間彼此進行熱交換。 财07417 此外，多折式散熱片100呈「z」字型，意即第 ，第二片體m分別自第一連接片體13〇朝相反之方 *向延伸，以配合發熱體與散熱體對應之配置位置。 然而，為配合發熱體與散熱體於其他之配置位置，豆 ，=例中，多折式散熱片亦可呈「〔」字型，意即第: 伸。，、第一月體亦可分別自第一連接片體朝相同之方向延 復麥閲第1圖所示 片體110之面積大於第120夕 由於第一 統第—片體m之面積，因此多折式散 熱體，進而將此些熱能經多折式敎熱片10。 ::而，其他之實施例中，本新型林排除第二片體120 折_^:等於第一片體110之面積(圖中未示)，使得多 1 斤式散熱片100可提供更多突出之導熱塊於第二片二 之放熱面積，進而提高散熱之效率。 或第是，第一導熱塊111、第二導熱塊⑵ “列:質不限與多折式散熱片100之材質 相同或不相同°本新型之設計人員亦 112之熱傳 1 效率熱^ϋ二導熱塊121或第三導熱塊 請參閱第2圖所示，第〜佳二導能二材質° 之局部栅畋-弟2圖繪不本新型電子裝置200 之局雜略不意圖。本新型另提供一種採用上述多折式散 M4U7417 熱片100之電子震置200。此電子I置2〇〇包含一電路板 #0 第發熱元件320、一第二發熱元件33〇、一鍵盤 輪組340及上述之多折式散熱片100。 此電路板310設於此電子裝置扇巾，而電路板31〇 了有相對之第一側311及第二側312。此電路板31〇例如 為一主機板’而第一側311例如為下侧，且第二側31 如為上側。a sheet body 20 and a first connecting sheet body 130. The first connecting piece 130 is located between the first and second sides, and the first connecting piece /; Λ 1 〇 and the second piece 120 - 俨 m β ί are respectively connected to each other in a body-formed manner. It is produced in a piece 12' so that the first piece 110 and the second piece are in different planes, that is, the plane of the first piece 110 is the second piece, and the vertical height of the plane is the same. A connecting piece, the width of the body 1 Sichuan. In other embodiments, the first body 110 and the second body 12〇 may also be obliquely connected to the first connecting piece 130, respectively, such that the plane of the first piece u〇 is separated from the plane of the second piece 120. The vertical height is smaller than the width of the first connecting piece 130. In addition, the first surface 101 of the multi-folded heat sink 1 has a protruding first heat conducting block ill, and the first heat conducting block η is protruded from the surface of the first body so that the first heat conducting block m can be contacted. A heating element. The first heat conducting block 12 has a protruding portion of the first heat conducting block 12 on the first surface 1 〇 1 of the multi-shaped heat sink 100. The first heat conducting block 121 protrudes from the surface of the second sheet 120 so that the second heat conducting block 121 can contact a heat sink. body. In this way, the multi-fold heat sink can thermally connect the heat generating body and the heat sink of different vertical heights to promote heat exchange between the heat generating body and the heat sink. In addition, the multi-fold heat sink 100 has a z-shaped shape, which means that the second body m extends from the first connecting piece 13 〇 toward the opposite side* to match the heating element and the heat sink. Corresponding configuration location. However, in order to match the heating element and the heat sink in other positions, the bean, in the example, the multi-fold heat sink may also have a "[" shape, meaning that: , the first month body may also extend from the first connecting piece body in the same direction to the same direction. The area of the sheet body 110 shown in FIG. 1 is larger than the area of the first unit first sheet body m. The multi-fold heat sink further heats the heat through the multi-fold heat sheet 10. :: In other embodiments, the novel forest excludes the second sheet 120 fold _^: equal to the area of the first sheet 110 (not shown), so that the more than 1 kg heat sink 100 can provide more The protruding heat conducting block is in the heat releasing area of the second piece 2, thereby improving the efficiency of heat dissipation. Or first, the first heat-conducting block 111 and the second heat-conducting block (2) "column: the quality is not the same as or different from the material of the multi-fold heat sink 100. The designer of the new model also has a heat transfer efficiency of 1". For the second heat-conducting block 121 or the third heat-conducting block, please refer to FIG. 2, and the partial-two-conductor two-phase material is not intended to be used in the novel electronic device 200. There is further provided an electronic vibration device 200 using the above-mentioned multi-fold type M4U7417 hot film 100. The electronic I device 2 includes a circuit board #0, a heating element 320, a second heating element 33, and a keyboard wheel set 340. And the multi-fold heat sink 100. The circuit board 310 is disposed on the electronic device fan, and the circuit board 31 has an opposite first side 311 and a second side 312. The circuit board 31 is, for example, a host. The plate 'and the first side 311 is, for example, the lower side, and the second side 31 is the upper side.
苐發熱元件320设置於電路板31〇之第一側311， 例如第一發熱元件320焊設於電路板310之第一側311表 面第發熱元件320例如可為一中央處理單元、南、 橋晶片或繪圖晶片等。 第二發熱元件330設置於電路板31〇之第一侧311， 例如第二發熱元件33〇焊設於電路板310之第一側311表 =並相鄰f 一發熱元件320。第二發熱元件330例如可為 。己隐體單元，§己憶體單元具有多個發熱體（)。· 鍵盤模組340之一面外露於電子裝置2〇〇之表面， 鍵盤模組340之另一面設於電子裝置2〇〇内，且 板310之第二側312上方。 '屬路 上述多折式散熱片100設於此電子裝置2〇〇中，且八 別熱接觸不同垂直高度之發熱元件32G、㈣與鍵 ^ 340。具體來說，上述多折武散熱片i。。之一端位路 31〇之第-侧311並接觸第-發熱元件32〇。多折 ， 1〇〇之另端位於電路板31〇之第二側312並接觸鍵盤^ 340。多折式散熱片310並穿過電路板31〇之一開口 、、、且 如開孔或缺口）。 例 9 M407417 由於鍵盤模組340的頂部曝露於電子裝置200外之空 . 氣，如此，當第一發熱元件320、第二發熱元件330之熱 能經由多折式散熱片100而傳遞至鍵盤模組340時，藉由 / 自然對流之作用，鍵盤模組340可將熱能引導至電子裝置 . 200外之空氣中。 具體而言，多折式散熱片100之第一片體110位於電 路板310之第一側311，並使第一導熱塊111接觸第一發熱 元件320，以及使第三導熱塊112接觸第二發熱元件330。 φ 多折式散熱片100之第二片體12〇位於電路板310之第二 侧312，並使第二導熱塊121接觸鍵盤模組340。第一連接 片體130則穿越電路板310之開口 313，使得第一連接片 體130自電路板310之第一侧311經過電路板310之第二 側 312。 在其他實施例中’第一片體也可直接接觸第一發熱元 件。第二片體也可直接接觸鍵盤模組。 需說明的是，本新型所述之電子裝置2〇〇可泛指任何 春 具有按鍵之電子裝置200，例如筆記型電腦、個人數位助 理(Personal Digital Assistant ; PDA)、電子辭典、遊戲機、 行動電話或其他攜帶式農置等等：。 本新型以下由一筆記型電腦201 (或精簡型電腦）為 例，以便更詳述夕折式散熱片1 〇〇與筆記型電腦20 1之相 互關係。 凊參閱第3A圖及第3B圖所示，第3A圖繪示本新型 電子裝置200為-筆記型電腦201時之一實施例概略示意 圖。第3B圖繪示第3A圖之Ml區域之局部放大圖。 此實施例中，筆記型電腦 示榮幕_及一樞輪件500 包a 一底座300、一顯 及底座300，使得顯示f幕400 ^ 500樞接顯示螢幕彻 上，或者疋被，動而遠離底座_。底座300例如視為— 空心殼體，可谷納上述之電路板31〇、鍵盤模組34〇、各發 熱元件及多折式散熱片100於其中。 詳細來説，電路板310平躺地設於底座300中。藉由 固定栓301 ’電路板310與底座300相互固定。多折式散 熱片100之第一片體110位於電路板310與底座300之間。 藉由固定栓302，固定栓302穿過第一片體110之定位孔 160，使得第一片體110可被固定於底座300上、電路板 310之第一侧311上或同時被固定於底座300或電路板310 上。如此，使得第一導熱塊111及第三導熱塊112可更穩 固地分別接觸第一發熱元件320及第二發熱元件330，以 維持其熱傳導之效率。 由於此多折式散熱片100之第一片體110被固定於底 座300上，加上第一片體11〇、第一連接片體130與第二 片體120互為一體成型，故，第二片體120之第二導熱塊 121亦可穩固地接觸鍵盤模組340,以維持其熱傳導之效 率。 請參見第3B圖所示，此實施例中’鍵盤模組340包含 一按鍵組341。按鍵組341包含多個間隔排列之按鍵342， 各按鍵342相同之一侧皆具有一金屬件343。此些金屬件 343之材質例如為鋁或銅等具良好導熱係數之金屬。如此， 當第二片體12〇之第二導熱塊121接觸鍵盤模組340時， M407417 第二導熱塊121是接觸其中之一金屬件343。故，當各發 熱元件之熱能經由多折式散熱片：1〇〇而傳遞至鍵盤模組 340之金屬件343時，藉由自然對流的作用，金屬件343 可將熱能向上引導至電子裝置200外之空氣中。 請參閱第4A圖及第4B圖所示。第4A圖緣示本新型 電子裝置200為一筆記型電腦2〇1時之另一實施例概略示 意圖。第4B圖繪示第4A圖之M2區域之局部放大圖。 請參見第4B圖所示，此另一實施例中，鍵盤模組34〇 • 包含一按鍵組341及一鍵盤支撐架344。按鍵組341包含 多個間隔排列之按鍵342，各按鍵342相同之一側皆具有 一金屬件343。鍵盤支撐架344位於按鍵組341與第二片 體120之間，用以固定並支撲此按鍵組位於此筆記型 電腦201之外表面，而且鍵盤支撐架344之面積大於各按 鍵342之金屬件343的面積。鍵盤支撐架344及此些金屬 件343之材質，例如為鋁或銅等具良好導熱係數之金屬。 . 如此，當第二片體120之第二導熱塊121接觸鍵盤模組34〇 φ 時，第二導熱塊121是接觸按鍵組341之鍵盤支撐架344。 故，上述各發熱元件320、330所傳來之熱能便可均勻地分 攤於鍵盤支撐架344上，並藉由自然對流的作用，鍵盤支 撐架344向上導引熱能至電子裝置2〇〇外之空氣中。 復參閱第1圖、第2圖及第3A圖所示，本新型之另 一實施例中’多折式散熱片100更包含一第三片體140及 一第二連接片體150。第二連接片體15〇位於第二片體12〇 及第二片體14〇之間，且第二連接片體15〇之兩端分別一 體成型地連接第二片體120及第三片體14〇，使得第二片 12 «ihu/417 體Uo及第三片體140可分別處於不同平面。 ”此外，多折式散熱片100:更包含一樞轴連接部141， - 抱輪連接部141位於第三片體140之表面，並連接上述之 樞軸件500，藉此，上述各發熱元件32〇、33〇之熱能亦可 ·· 經由第二連接片體150及第三片體14()被傳導至樞軸件 5〇〇。由於樞轴件500之材質，例如亦為鋁或銅等具良好導 熱係數之金屬，樞軸件500也可有助於熱能之傳導。 此外，一般而吕，為了有效散去顯示螢幕4〇〇之光源 _ 所產生之熱能，顯示螢幕400亦具有其散熱設計(例如散埶 外殼）’故，當多折式散熱片100之樞軸連接部141連接: 軸件500時，多折式散熱片100亦可將上述各發熱元件 320、330所產生之熱能部份地傳至顯示螢幕4〇〇，藉由顯 示螢幕400幫助多折式散熱片ι〇〇進行散熱。 · 又，儘管上述各發熱元件320、33〇所傳來之熱能是藉 由自然對流的作用（被動散熱），由按鍵組341導引熱能^ •電子裝置200外之空氣中，本新型仍未排除電子裝置=具 φ 有主動散熱70件（圖中未示），例如風扇，藉由風扇所輸出 之氣流更可加強排出熱能至電子裝置外，減輕多 & 片之負擔。 熱 綜上所述，本新型之多折式散熱片可配合電子裝置中 不同垂直高度之發熱體與散熱體，使得發熱體所產生 能可快速地被引導至散熱體。此外，由於鍵盤模組設置^ 電子裝置之表面’發熱體所產生的熱能便可更快速地 導至電子裝置外’進而維持電子裝置應有之工作性能。 纟新型所揭露如上之各實施例中’並非用以限定本新 13 當可^何㈣此技藝者’在不脫離本新型之精神和範圍内’ 二之由之更動與潤♦’因此本新型之保護範圍當視後 附之申清專利範圍所界定者為準。 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵、優點與實施例 能更明顯純，所_式之詳細說明如下： 第1圖繪示本新型多折式散熱片之外觀示意圖。 第2圖繪示本新型電子裝置之概略示意圖。 第3A圖繪示本新型電子裝置為一筆記型電腦時之一 實施例概略示意圖。 第3B圖繪示第3A圖之M1區域之局部放大圖。 第4A圖綠示本新型電子裝置為一筆記型電腦時之另 一實施例概略示意圖。 力 第4B圖繪示第4A圖之M2區域之局部放大圖。 【主要元件符號說明】 100 :多折式散熱片 3〇1、302 :固定栓 101 :第一表面 310 :電路板 102 :第二表面 311 :第一側 110 :第一片體 312 :第二側 111 :第一導熱塊 313 :開口 112 :第三導熱塊 -·· . 320 :第一發熱元件 120 :第二片體 330 ·第二發熱元件 M407417 121 ： 第二導熱塊 340 鍵盤模組 130 ： 第一連接片體 341 按鍵組 140 ： 第三片體 342 按鍵 141 ： 樞軸連接部 343 金屬件 150 ： 第二連接片體 344 鍵盤支撐架 160 ： 定位孔 400 顯示螢幕 200 ： 電子裝置 500 樞軸件 201 ： 筆記型電腦 Ml、 M2 .放大區域 300 ： 底座The heat generating component 320 is disposed on the first side 311 of the circuit board 31. For example, the first heat generating component 320 is soldered to the first side 311 of the circuit board 310. The heat generating component 320 can be, for example, a central processing unit, a south, and a bridge chip. Or drawing a wafer, etc. The second heat generating component 330 is disposed on the first side 311 of the circuit board 31. For example, the second heat generating component 33 is soldered to the first side 311 of the circuit board 310 and adjacent to the heat generating component 320. The second heat generating component 330 can be, for example. The hidden unit, the hex element has a plurality of heating elements (). One side of the keyboard module 340 is exposed on the surface of the electronic device 2, and the other side of the keyboard module 340 is disposed in the electronic device 2b and above the second side 312 of the board 310. 'The above-mentioned multi-fold heat sink 100 is disposed in the electronic device 2, and is in thermal contact with the heating elements 32G, (4) and the keys 340 of different vertical heights. Specifically, the above-mentioned multi-fold heat sink i. . The first side 311 of one of the end paths 31 is in contact with the first heat generating element 32A. The other end is located on the second side 312 of the circuit board 31 并 and contacts the keyboard 340. The multi-folded heat sink 310 passes through one of the openings of the circuit board 31, such as an opening or a notch. Example 9 M407417 The heat of the first heating element 320 and the second heating element 330 is transmitted to the keyboard module through the poly-type heat sink 100 because the top of the keyboard module 340 is exposed to the air outside the electronic device 200. At 340 hours, by means of / natural convection, the keyboard module 340 can direct thermal energy into the air outside the electronic device. Specifically, the first body 110 of the poly-type heat sink 100 is located on the first side 311 of the circuit board 310, and the first heat-conducting block 111 contacts the first heat-generating component 320, and the third heat-conducting block 112 contacts the second. Heating element 330. The second body 12 of the φ multi-fold heat sink 100 is located on the second side 312 of the circuit board 310, and the second heat conducting block 121 contacts the keyboard module 340. The first connecting body 130 passes through the opening 313 of the circuit board 310 such that the first connecting body 130 passes from the first side 311 of the circuit board 310 to the second side 312 of the circuit board 310. In other embodiments, the first sheet may also directly contact the first heat generating element. The second piece can also directly contact the keyboard module. It should be noted that the electronic device 2 of the present invention can generally refer to any electronic device 200 with buttons in the spring, such as a notebook computer, a personal digital assistant (PDA), an electronic dictionary, a game machine, and an action. Telephone or other portable farming, etc.: The following is an example of a notebook computer 201 (or a compact computer) to more closely describe the relationship between the flip-chip heat sink 1 and the notebook computer 20 1 . Referring to FIGS. 3A and 3B, FIG. 3A is a schematic diagram showing an embodiment of the electronic device 200 of the present invention as a notebook computer 201. FIG. 3B is a partial enlarged view of the M1 region of FIG. 3A. In this embodiment, the notebook computer shows the glory _ and a pivoting member 500 package a a base 300, a display base 300, so that the display screen 400 ^ 500 pivotally displays the screen clear, or smashed, Stay away from the base _. The base 300 is, for example, regarded as a hollow housing in which the above-described circuit board 31, the keyboard module 34, the respective heat generating elements, and the multi-fold heat sink 100 are incorporated. In detail, the circuit board 310 is disposed flat in the base 300. The circuit board 310 and the base 300 are fixed to each other by the fixing plug 301'. The first body 110 of the multi-fold heat sink 100 is located between the circuit board 310 and the base 300. The fixing bolt 302 passes through the positioning hole 160 of the first body 110 by the fixing bolt 302, so that the first body 110 can be fixed on the base 300, the first side 311 of the circuit board 310 or simultaneously fixed to the base. 300 or on board 310. Thus, the first heat conducting block 111 and the third heat conducting block 112 can be more stably contacted with the first heat generating component 320 and the second heat generating component 330, respectively, to maintain the efficiency of heat conduction. Since the first body 110 of the multi-fold heat sink 100 is fixed on the base 300, and the first body 11 〇, the first connecting body 130 and the second body 120 are integrally formed with each other, The second heat conducting block 121 of the two body 120 can also firmly contact the keyboard module 340 to maintain the efficiency of heat conduction. Referring to Figure 3B, the keyboard module 340 in this embodiment includes a button set 341. The button group 341 includes a plurality of spaced-apart buttons 342, each of which has a metal member 343 on one side. The material of the metal members 343 is, for example, a metal having a good thermal conductivity such as aluminum or copper. Thus, when the second heat conducting block 121 of the second body 12 contacts the keyboard module 340, the M407417 second heat conducting block 121 contacts one of the metal members 343. Therefore, when the heat energy of each heating element is transmitted to the metal piece 343 of the keyboard module 340 via the multi-fold heat sink: the metal piece 343 can guide the thermal energy upward to the electronic device 200 by the natural convection. Outside the air. Please refer to Figures 4A and 4B. Fig. 4A is a schematic view showing another embodiment of the present invention when the electronic device 200 is a notebook computer. FIG. 4B is a partial enlarged view of the M2 region of FIG. 4A. Referring to FIG. 4B, in another embodiment, the keyboard module 34 includes a button group 341 and a keyboard support frame 344. The button group 341 includes a plurality of spaced-apart buttons 342, each of which has a metal member 343 on one side. The keyboard support frame 344 is located between the button group 341 and the second body 120 for fixing and supporting the button group on the outer surface of the notebook computer 201, and the area of the keyboard support frame 344 is larger than the metal parts of the buttons 342. The area of 343. The material of the keyboard support frame 344 and the metal members 343 is, for example, a metal having a good thermal conductivity such as aluminum or copper. Thus, when the second heat conducting block 121 of the second body 120 contacts the keyboard module 34 〇 φ, the second heat conducting block 121 is the keyboard supporting frame 344 contacting the button group 341. Therefore, the thermal energy transmitted from the heating elements 320 and 330 can be evenly distributed on the keyboard support frame 344, and the keyboard support frame 344 guides the thermal energy up to the electronic device 2 by the natural convection. in the air. Referring to Figures 1, 2, and 3A, in another embodiment of the present invention, the multi-fold heat sink 100 further includes a third body 140 and a second connecting body 150. The second connecting piece 15〇 is located between the second piece 12〇 and the second piece 14〇, and the two ends of the second connecting piece 15〇 are integrally formed to integrally connect the second piece 120 and the third piece 14〇, so that the second piece 12 «ihu/417 body Uo and the third piece 140 can be in different planes respectively. In addition, the multi-fold heat sink 100 further includes a pivotal connection portion 141, and the wheel connection portion 141 is located on the surface of the third sheet body 140, and is connected to the above-mentioned pivot member 500, whereby each of the above-mentioned heating elements 32 〇, 33 〇 thermal energy can also be transmitted to the pivot member 5 经由 via the second connecting piece 150 and the third piece 14 (). Due to the material of the pivot member 500, for example, aluminum or copper When the metal has a good thermal conductivity, the pivot member 500 can also contribute to the conduction of thermal energy. Moreover, in general, in order to effectively dissipate the heat energy generated by the light source of the display screen, the display screen 400 also has its The heat dissipation design (for example, the heat dissipation housing) is such that when the pivotal connection portion 141 of the multi-fold heat sink 100 is connected to the shaft member 500, the multi-fold heat sink 100 can also generate the heat generating components 320 and 330. The heat is partially transmitted to the display screen 4, and the display screen 400 is used to help the heat-dissipating heat sink to dissipate heat. · In addition, although the heat generated by each of the heat-generating elements 320, 33 is by nature The effect of convection (passive heat dissipation), guided by the button set 341 thermal energy ^ In the air outside the sub-device 200, the present invention still does not exclude the electronic device=there are φ active cooling 70 pieces (not shown), such as a fan, and the airflow output by the fan can further enhance the discharge of thermal energy to the outside of the electronic device. In addition, the multi-fold heat sink of the present invention can be combined with the heat generating body and the heat sink of different vertical heights in the electronic device, so that the heat generating body can be quickly guided to the heat sink. In addition, since the keyboard module is provided, the surface of the electronic device can generate the thermal energy generated by the heating element more quickly to the outside of the electronic device, thereby maintaining the working performance of the electronic device. In the example, 'it is not intended to limit the new 13's. (4) This artist's role in the spirit and scope of the new model is not changed. The above definitions of the present invention and other objects, features, advantages and embodiments of the present invention can be more clearly and purely. Fig. 1 is a schematic view showing the appearance of the novel multi-fold heat sink. Fig. 2 is a schematic view showing the electronic device of the present invention. Fig. 3A is a schematic view showing an embodiment of the novel electronic device as a notebook computer. Fig. 3B is a partial enlarged view of the M1 area of Fig. 3A. Fig. 4A is a schematic diagram showing another embodiment of the novel electronic device as a notebook computer. Fig. 4B is a diagram showing Fig. 4A Partial enlarged view of the M2 region. [Main component symbol description] 100: Multi-fold heat sink 3〇1, 302: Fixing plug 101: First surface 310: Circuit board 102: Second surface 311: First side 110: First sheet body 312: second side 111: first heat conducting block 313: opening 112: third heat conducting block - 320. 320: first heat generating element 120: second sheet body 330; second heat generating element M407417 121: Two heat conducting blocks 340 Keyboard module 130 : First connecting piece body 341 Button group 140 : Third piece body 342 Button 141 : Pivot connection part 343 Metal piece 150 : Second connecting piece body 344 Keyboard support frame 160 : Positioning hole 400 Display screen 200: Child apparatus 500 pivot member 201: laptop Ml, M2 expanded region 300: base
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