TWM252252U - Fixation structure of heat sink fins combining with computer case - Google Patents

Description

M252252

4. Description of Creation (1) [Technical Field to which the New Type belongs] This creation relates to a fixed combination structure for the cooling month and the computer case, especially the heat conduction provided between the motherboard and the case. Indirectly subsidizing heat dissipation, and the heat conductor of this soft material is used to consolidate the motherboard and the chassis bottom plate, can improve the bonding strength and prevent vibration. [Prior art]

According to the knowledge of the computer, the CPU of the host computer uses the cooling fins and fans to achieve the cooling effect, and the general way of fixing the heat sink is to directly lock it on the motherboard after contacting the CPU to cool the CPU. By using the heat absorption of the heat sink and the cooling of the fan, the high temperature generated by the CPU in use can be used to achieve the purpose of heat exchange. [New content] ^ The cooling principle of the fan, this guide and the absorption of heat and heat to the material to prevent the shock [implementation in view of one way into the creation of a pair of clips located on the hot body to pass the machine The hot body on the shell will fall.] The main purpose of this case is to arrange the central processing surface in between, leading to heat conduction, and achieving the effectiveness of the auxiliary motherboard and the central processor of the motherboard. That is, the main board of the lifter has a heat-conducting layer. Through the elastic body, the bottom plate phase of the shell and the central processing heat dissipation are all enhanced by the use of heat sinks to strengthen the central processor to the central processor. A heat conducting body is arranged below the heat-dissipating part. The sheet is in contact with the main board between the heat conducting body and the main board, and the eight parts can be directly conducted through the heat conducting body. At the same time, the soft two are consolidated to improve the strength and the device is damaged. By.

Page 5 013663 M252252 Fourth, the creation description (2) The following will be based on the structure and characteristics of the drawing ^ " as follows: not a better embodiment to explain in detail This creation please refer to the combination of the first picture and the second computer case For the heat sink, this creation is mainly a structure that is fixedly connected with the central board on the board 2. The main body inside the case is provided with a heat dissipation fin 4, and the loose key ^ is located above the central processing unit 3 so as to be able to fix the heat dissipation fin 4 ^: ^ 隅 are respectively locked by the fixing post 41, Elastic components are placed between the two boards, and the good contact between the end of the fixed post 41 and the main is between the heat sink fins 4 and the main board 2 and the body 5. The mechanical board 2 and the chassis 1 In order to provide heat conduction between one of the above-mentioned central processing units, it must be used; under the heat of the film, the main board 2 where the central processor 3 is set will be produced ... and the temperature will be lowered. The high-temperature effects generated, so it will be difficult to rule out the heat source on the central processing unit 2. The main board under the processor 3 is to enhance the main board of the processor 3 in the place where the central processor 3 is scattered. Below 2 is the setting-thermal conductivity ^ 'The pair is located in the center of the J-shaped material, and its upper and lower surfaces are viscous.' This heat conductor is a bottom surface of one pole, and the upper surface of the heat conductor 5 is coated with ^ :, which can be fixed. Between the machine and the main board 2 and sandwiched therewith-a shrapnel 6, "Y! Hot body 5 the main board 2 is in contact" can suck The heat source is conducted to the wrong. The elastic piece 6 and the heat conductor 5 directly conduct part of the residual heat to the case! =. ,,, and 5 on the body 5 and then pass through the heat conductor 5 to connect the main board 2 and the bottom plate of the case 1 The degree of soft material, to prevent the motherboard 2 and the center M252252 from falling. 4. Creation instructions (3) Refer to the third and tenth figures. The fixed connection of the fixed heat sink fin 4 = 4 1 In addition to the above, it stands directly on In addition to the inner wall surface of the casing 1, it can also be arranged on the device 1 relative to the four fixing posts 41 1 below the setting position to engage the sleeve so that the fixing post 41 can be sleeved and combined with the connection sleeve 11. A back plate 7 is provided between the main board 2 and the heat-conducting body 5. The back plate 7 is provided with a plate protrusion 7 1 ′ on the surface, which can increase the contact area with the main board 2 and enhance the heat conduction effect. Please refer to the fourth As shown in the figure and the ninth figure, in addition to the above-mentioned directly standing on the inner wall surface of the casing 1, the fixing posts 4 1 for fixing the heat dissipation fins 4 can also be arranged below the four fixing posts 41 on the casing 1. The joint sleeve 1 1 ′ is provided so that the fixing post 41 can be sleeved and combined with the joint sleeve 11, and is interposed between the main board 2 An elastic sheet 6 is provided between the heat conducting body 5 and the heat absorbing effect of the heat conducting body 5 can be improved by using the elastic sheet 6. The contact surface of the elastic sheet 6 and the main board 2 is provided with a backing adhesive to strengthen the fixed contact with the main board 2. The elastic piece 6 has grooves 61 on its four cymbals, so it can happen to be restricted by the fixed cymbals 41 without the need for a separate fixing structure. Please refer to the fifth figure, wherein the fixed posts 41 protrude from the motherboard. 2 The lower pillar 4 1 1 is a plate convex portion 7 1 which is locked to the back plate 7. An elastic element 42 is sleeved between the end of the fixed 枉 41 and the main board 2 to maintain the heat dissipation fins 4 and Good contact between the main boards 2. The heat-conducting body 5 is sticky on both sides, and can fix the plate convex portion 71 of the back plate 7 to the lower end of the case 1 to achieve heat dissipation and fixation and prevent the main board 2 from being pushed by damage. Please refer to the sixth figure. For the fixing connection between the heat dissipation fin 4 and the main board 2, a fastener 43 may be further used for fixing.

Page 7 013665 M252252 IV. Creation instructions (4) 'Has an inverted hook body 431' When the fastener 43 penetrates the heat dissipation fin 4 and the motherboard 2, the inverted hook body 4 3 1 can be attached to the back of the motherboard 2 Positioning. Please refer to the seventh figure, wherein the main board 2 and the heat conductor 5 can be provided with a back plate 7 and an elastic sheet 6 at the same time, and the fixed post 41 can be used as a fixed post 41 or a buckle. Piece 4 3. Continue to refer to the eighth figure, in which the back plate 7 and the elastic sheet 6 between the main board 2 and the heat conductor 5 can be fixed by using a combined fastener 4 3, and the fastener 43 'includes a hook post 431, and plug rod 434; The hook post 421 has an inner hole 433 'with an inverted hook body 432 at the bottom. When using the fastener 43, the hook post 43Γ must first pass through the heat dissipation fin 4, the main board 2, After the back plate 7 and the spring piece 6, the bottom hook body 432 'is hooked on the back plate 7 or the spring piece 6, and then the plug rod 434' is used to plug into the hook post 431, the inner hole 433, and The plug rod 434 stretches the hook post 431 ', so that the bottom hook body 432 at the bottom is enlarged and tightly fastened. To sum up, the composition of this creation can share the heat dissipation fins without work, and the effect of this part of the heat source, and the soft materials are consolidated with each other, which can improve the strength and prevent the vandalized person. The heat sink fixed on the computer case is used to exchange heat from the motherboard. The heat transfer body can be used to achieve the lifting row. The heat conductor connects the motherboard and the chassis bottom plate.

Page 8 013666 M252252

Figure 2 shows a three-dimensional view of the CPU cooling configuration inside the creative host. $ 一 3shows an exploded perspective view according to the first figure. Ϊ :::: This is a partial cross-sectional view of the original, with a back plate between the heat sink and the computer case. , Z is a sectional view of an embodiment in which a shrapnel is added between the creative heat sink and the computer case. 6 ^ The figure 5 shows an embodiment of the connection between the creative fixing post and the computer case. This is a solid cross-section view of this creation. Another post structure is connected to the computer case with a fixed post structure and the back is fixed at the same time. Figure 7 is a schematic diagram of the embodiment of the plate and spring sheet used in accordance with Figure 6. The eighth picture shows more than one fixed post of this creation. ^ The nine picture shows a three-dimensional view of the shrapnel of this creation. The tenth picture shows a three-dimensional backplate of this creation. Explanation of symbols Chassis 41 · 411 Joint tube Motherboard Central processor Radiating fin Fixed post Lower post

C1366? M252252

Page ίο C13668

Claims (1)

M252252 5. Scope of patent application 1. A heat sink fixing structure combined with a computer case. The main board on the part is fixed with a central processing unit. A heat sink fin is arranged above the heat sink. It is respectively connected; it is characterized in that: a heat conducting heat body is provided under the main board of the central processing unit as an elastic material, and the upper and lower surfaces are viscous and heat conductive and fixed to the bottom surface of the chassis, and the heat conducting body and the main board are connected By contacting the source, the thermal conductor conducts the hot edge to the case to dissipate heat, and the guide plate and the case bottom plate are consolidated with each other, which can lift the motherboard and the central processor. Wan Lichen cymbal 2 solid-such as: JL Lee: Ganwei and the computer case structure described in item 1, which is between the heat conductor and the main board 3, as in the scope of patent application No. 1 cymbal macro She furnace ,: trb #, Jin Shuzhi and the computer case ... a piece of solid yttrium structure, which is sandwiched between the shrapnel of the thermal conductor fish. " Between the main board and the motherboard 4, such as the patent application scope of the third hot film fixed structure, which is in the middle of the computer case and the computer case. 5. There is a 5 between the machine board and the spring sheet. If the patent application covers the hot film fixing structure, the fixed connection, the computer case and the computer case abut against the inner wall surface of the case ^ ^ convex on the main board The lower degree allows the heat sink fins to be applied to fix the distance between the motherboard and the case to reduce the contact thermal resistance. Force on the processor chip The central processing case of the case is fixed to the column lock body. This guide layer can absorb the hot body, and the back plate is combined with the back plate and the back plate is combined with the back plate. The sandwich pillars are scattered under the pillars. M252252 5. Scope of patent application 6. The heat sink fixing structure combined with the computer case as described in item 1 of the scope of patent application, wherein the casing is arranged below the four fixing posts to be connected with the casing, so that The fixing post can be combined with the joint sleeve. 7. The heat sink fixing structure combined with the computer case as described in item 1 of the scope of the patent application, wherein the fixing post is a fastener and the tail end is provided with an inverted hook body. 8. The heat sink fixing structure combined with a computer case as described in item 1 of the scope of the patent application, wherein the fixed post is further a fastener, which includes a hook post and a plug rod, the hook post has an inner hole and a bottom It is provided with an inverted hook body, and the plug rod can be plugged into the inner hole of the hook column, so that the plug rod can support the hook column to stretch. Page 12 013670