M326662 i c 八、新型說明： 【新型所屬之技術領域】 本創作為提供-種前、後熱管繞_散熱片，尤指於電路板 上y表面設置有第-散熱片、第二散熱片，且第_、第二散熱片 之第-、第二熱管繞出電路板側邊供第三散熱片連接，達到三個 .散熱區域供預設風扇散熱，具有熱源排散快速、調整位置 ’ 零件迅速之功效。 、 b 【先前技術】 按，現今科技資訊快速發展，而個人電腦、電子筆記本及筆 圯型電腦由於運算功能強，速度快，因此被普遍運用於各個行業 、’而網路時代的來臨更造成電腦的普及化，其中電_之晶片於 運料會產生熱能，且速度越快所產生的熱能越高，為避免晶片 因而熱燒毁、縮短使用壽命之問題，即在晶片上設有散熱片，使 丨晶Μ生之魏料至散刻上，相風射財送冷空氣至气 熱片間隙中進行散熱。 月 埶其然而’要讓散熱效能更好，則有業者於散熱片之熱源處裝設 、、, …、盲側固叹於發熱元件之熱源處，另一侧則另添設可 :j…、之政熱片，以利用熱管一側吸收熱源傳送至熱管的另一 1藉由另側之散熱片將熱管所吸收熱量予以排除，避免熱管 因過熱而無法再吸收熱量；且熱管内冷卻水為可藉由毛細結構形 成汽體、液體交換之動作。 是以’請參閱第十—圖所示，證書號數第I 2 2 7 8 2 4號 6 M326662 『影像顯示轉接卡之晶片組冷卻元件』發日轉利案，係於民國g 2年4月4日提出申請，申請案號921〇7693號，並核准 公告於民國9 4年2月11日之專利公報，其中，包含有設置於 晶片組A同—側的第—熱窩B ’並具有接觸日日日片組A表面以吸收 晶片組A產生之熱的導熱部B i，與—個具有多數以導熱部b丄 所傳來的熱發散之散_ B 2 ; _設_第—_相反侧 之弟-熱紅，而以轉接卡D介於第—與第二熱窩B、C之間； ==熱管E用以連接第一與第二熱高b、c，自該第一熱 :=物C’其熱管E至少折疊乙次並包_ L二:部份連接至第—熱离B，而其餘部份連接至 上述制之顯示卡晶 時’實存在下列諸多缺失，其中： 1千力“便用 (一） 該熱管E二端為連接 E使用較長尺寸進行連接，而使熱管 ，、傳導熱源亦無法迅速，導致 熱原有囤積、排熱效果不良之問題。 (二） 該熱管E分财插於第— 3 , c 1 Φ ^ ，、、、萵Β、苐二熱窩c之插入孔Β 主要透過熱管切力略 受外力碰撞或晃動時，=-熱寫C定位，當 脫落之問題。 易使弟—熱窩Β、第二熱窩C有 是以，要如何解決上述習用之η 之相關廠商所亟欲研究 問題與缺失，即為從事此行業 。之方向所在者。 7 M326662 【新型内容】 故’根據上述諸點缺失之考量，_人 娜上作-深入分析與探討，並經由多 量= !心鑽研與研發’進而以鎮而不捨的試作與修—^ 别、後熱管繞接用散熱片的新型專利。 路板目的乃在於第—散熱片及第二散熱卿^ 第—鮮账熱管，而透 且有一個:—熱官繞出電路板側邊供第三散熱片連接，達到 迅速:功:：區域供發熱源散熱、且調整位置、更換零件容易、 至,=作之切目的乃在_塌第m向下鎖入 八载墊片之調整元件時’ ,其構造 利完全瞭解。 佳貫^例抑_其特徵與魏如τ，俾 體分=1::二、三圖所示，係為本創作之立體外觀圖、立 刀解圖以及側視剖面圖’由圖中所示可清 、後熱管繞接用散熱片係包之刖 第三散熱片3所組L.放熱片^第二散熱片2及 該第—散細1她_輸㈣上姆熱源抵貼， M326662 且第-散熱片1之基座1丨上齡有複數鰭片丨丨丨，而基座1 1下表面則設有抵貼第-熱管丨2之限位槽丨丨2，並於第一熱 官12-侧繞出第-散熱片工外，且至電路板4側邊後彎折呈水 平狀。 該第二散熱片2為定位於賊f路板4下表面，且内部穿設 有第二熱管21 ’而第二熱管2 i—側繞出第二散熱片2外牙並 至電路板4側邊後彎折呈水平狀。 該第三散糾3為相鄰於電路板賴邊，且第 1 有活動組合之左、右基座31，而左、右基朗内分=相 對應之限位槽311，並透過限位槽3丄丄來夹持第—熱 ^二熱f 2 1呈，，而左、^細1增懷有相對應 供複數定位元件3 2進行鎖固之圓孔3 2 2。 另以’該第-散熱片以第二散熱片2之間為設有可夾持電 路板4之固找置5，而_裝置5具有導熱墊片5 1、承載墊 二52及鎖固轉53等結構’其中該導_ 5丄為定位於第 =„板4之間’且導熱塾片51上設有夹持第」熱 之¥'、、、塊5 1 1 ’亚於導熱塾片5 1四周設有供鎖固元件 鎖入之穿孔512 ;而承载塾片5 2為定位於第二散敎片2 及電路板4⑽，縣餘c 2四般讀·元件5 3對鎖 =整元件521，而調整元件521外則套設有支觀522 導:=Γ53由第—散熱片1所設之穿孔113向下穿過 #墊片5!上之穿孔512及承刪52上之支撐塊⑴ 9 M326662 並鎖入調整元件5 2 1轉成固定。 請同時參閱第四、五、六騎示，係為本創作組裝前之立體 剖Π組裝時之立體勤目及喊後之立體剖_，由圖中所 ρ月疋看出’藉由上述構件於組構時，縣將固定裝置5之承 載墊片5 2粒於電路板4下表面，並同時將承載墊片5 2上之 鰣讀5 2 X對位插入電路板4上之透制丄，而後，即可將 =熱官12結合於第—散熱片1之限位槽112内，並藉由固 定裝置5之鎖固元件5 3鎖入第一散熱片1及導熱墊片5 i之穿 孔1 1 3、5 1 2内，透過轉動鎖固树5 3鎖入承載塾片5 2 上之Itg件5 2 1内呈-定位即可，達到料對位鎖緊固定裝 —第越>；1於電路板4上下表面之功效，具有結構穩固 疋位、不易脫落之效果。 壯再者，上述鎖固元件53外套設有彈簧53工，於鎖緊固定 裝置5+時，可具有彈性空間縣—散熱片i調整至較佳高度。 a精上，俾當第―散熱片1到達定位後，即可將第二散熱片2 疋位於a路板4下表面，並對位棚定裝置5之承載墊片5 2下 ，面呈—定位，使第—散熱片1及第二散熱片2之第-、第二熱 ^ 21之方向同日才對位於電路板側邊，如此，即可將第二 ^熱片3之左、右基座3 i分別夾持第—、第二熱管丄221 月同t彡閱第七圖所示，係為本創作使用時之侧視剖面圖， 由圖中所示可清楚看出，藉由第—及第二散熱片1、2吸收到電 10 M326662 路板4之晶片42熱源時，即可利用第—、第二熱管12、21 來傳導熱源至第三散熱片3上，铜祕排散快速、循環效果良 好之功效。 請繼續參閱第八、九、十圖所示，係為本創作另—較佳實施 例之立體外觀圖、立體分解圖及側視剖關，由圖巾所示可清楚 '看出，本創作之前、後熱管繞·散熱片之第二躺片2進二步 可設置於電路板4上方，而第-散熱片工則對應設置於電路板4 下^· ’且第-散熱片！與電路板4下表面間設有導熱塾片$丄， 而第二散熱片2與電路板4上表面間則設置承載墊片5 2，使承 載墊片5 2平貼於電路板4之發熱晶片4 2上，供發熱晶片4 2 產生之熱麟鴻由承触^ 5 2排散至第二散糾2，達到快 速排散熱源之功效。 而，上述本創作之固定裝置5為可將鎖固元件$ 3由第一散 >熱片1之穿孔1 13朝上鎖入導熱墊片5工之鎖孔5丄2、電路 板4之透孔41、承載塾片5 2至第二散熱片2上，而後，便以 利用彈簧5 3 1及調整元件5 2 1套設在細元件5 3外，透過 調整元件5 21與鎖固元件5 3相互鎖緊，即可將電路板4上下 方各個構件呈-穩固定位作用，其可提供使用者更換不同型式之 散熱片於電路板4發熱晶片4 2上，使排散熱源效果依不同散熱 片來提昇散熱效率’如利料它等效結構變化，冑朗理包含於 本創作之專利範圍内，合予陳明。 又，本創作第一散熱片1及第一熱管12位於電路板4之晶 11 M326662 片4 2表面’而第二散熱片2及第二熱管21位於電路板4下 表面’Γ更換受損之電路板4零件、散熱片等相闕結構時，只需 1二1上鎖固元件5 3進行拆解，即可將第-散熱片1 :s12以第三散熱片3為中心進行扇形擺動，達到拆解 :f:=除電路板4上故障零件之優點’峨^ 又Θ應问理包含於本創作之專利範圍内，合予陳明。 當使用者將本創作之結構安裝於電路板4上時，可 =二:接於第一、第二熱管12、21上形成之轉 Γ方便第—散熱片1扇形擺動調整角度，且方便對位欲散 理舉凡彻其他輪辑效結構變化，均應同 理W於本創作之專利範圍内，合予陳明。 孰=本_主要保護重點為針對電路板4上表面設置具第 埶二之二:熱片1，而電路板4下表面亦設置有具第二 路板4二： 能έ士人;可使第二散熱片3形成轉軸形 沾合於散熱M與第二散糾2之間， =供imr且碰位置、更換零件容易、迅狀 含於本創作之專概_，合予化，均應同理包 m二於本創作之前、後熱管繞接用散熱片為可改細之技 (一）本創作透過第—及第二散熱片W吸收到電路板4熱源 M326662 1 · ^即可使第―、第二鮮12、2!來傳導熱源至第三 敕、片3上，達到具有二個散熱區域供發熱源散熱、且調 正位置、更換零件容易、迅速之功效。 (二作透過第-、第二熱管12、21延伸至電路料側 =再利用第二散熱片3予以樞接，形成尺寸短小之熱管 結構，具有排散熱源快、不易囤積之目的。M326662 ic VIII, new description: [New technical field] This creation provides a kind of front and rear heat pipe winding _ heat sink, especially on the circuit board y surface is provided with a first heat sink, a second heat sink, and The first and second heat pipes of the second and second heat pipes are connected to the side of the circuit board for the third heat sink to be connected to three. The heat dissipation area is used for heat dissipation of the preset fan, and the heat source is quickly dissipated and the position is adjusted. The effect. b [Previous technology] According to the rapid development of today's scientific and technological information, personal computers, electronic notebooks and pen-type computers are widely used in various industries due to their powerful computing functions and speed, and the advent of the Internet era has caused The popularity of computers, in which the wafers generate heat energy, and the faster the speed, the higher the heat energy generated. In order to avoid the problem of heat burning and shortening the service life of the wafer, the heat sink is provided on the wafer. , so that the twins of the twins will be scattered to the ground, and the wind will send cold air to the gap of the hot air to dissipate heat. However, in order to make the heat dissipation performance better, some operators install the heat source at the heat sink, ..., the blind side sighs at the heat source of the heating element, and the other side adds another: j... , the political hot film, the other one that uses the heat pipe to absorb the heat source to the heat pipe, the heat absorbed by the heat pipe is removed by the heat sink on the other side, so that the heat pipe can not absorb heat due to overheating; and the heat pipe inside the heat pipe It is an action of forming a vapor and a liquid exchange by a capillary structure. Therefore, please refer to the tenth-picture, the number of certificate number I 2 2 7 8 2 4 6 M326662 "image display adapter chip chipset cooling element" date transfer, is in the Republic of China g 2 years On April 4, the application was filed with the application number No. 921〇7693, and the patent notice published in the Republic of China on February 11, 1994 was approved, including the first heat-set B' set on the same side of the wafer group A. And having a heat conducting portion B i contacting the surface of the day and day sheet group A to absorb the heat generated by the wafer group A, and a heat dissipating _ B 2 having a majority of the heat conducting portion b ;; - _ the opposite side of the brother - hot red, and the adapter card D between the first - and the second heat nest B, C; = = heat pipe E used to connect the first and second heat high b, c, from The first heat: = object C', the heat pipe E is folded at least twice and the package _ L 2: part is connected to the first heat-off B, and the remaining part is connected to the above-mentioned display card crystals. Missing, of which: 1 thousand force "use it (1) The end of the heat pipe E is connected with a longer size for the connection E, so that the heat pipe, the conduction heat source can not be rapid, resulting in heat original hoarding The problem of poor heat removal effect. (2) The heat pipe E is inserted into the third hole, c 1 Φ ^ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Or when shaking, =- hot write C positioning, when the problem of falling off. Easy to make the brother - heat nest Β, the second heat nest C is, how to solve the above-mentioned η related manufacturers want to study problems and lack It is the direction of the industry. 7 M326662 [New content] Therefore, according to the above-mentioned lack of considerations, _ Man Na is a masterpiece - in-depth analysis and discussion, and through a lot of = heart research and development 'and further The new patent of the heat sink for the trial and repair of the town and the heat pipe. The purpose of the road plate lies in the first heat sink and the second heat sink, and there is a :—The hot official bypasses the side of the circuit board for the connection of the third heat sink, which is fast: work:: the area is used for heat dissipation from the heat source, and the position is adjusted, and the replacement of the parts is easy, and the purpose is to slap the m When locking down the adjustment element of the eight-loaded gasket', its structure is fully understood佳贯^例抑_ Its characteristics and Wei Ru τ, 俾 body points = 1:: two, three pictures, is the three-dimensional appearance of the creation, the vertical knife solution and the side view section 'by the figure The first heat sink can be cleaned, the heat pipe is wrapped with a heat sink, and the third heat sink 3 is assembled. L. The heat sink 2, the second heat sink 2, and the first-scatterer 1 her_transmission (four) upper heat source abuts, M326662 and the base of the first heat sink 1 has a plurality of fins on the upper side, and the lower surface of the base 1 1 is provided with a limit groove 2 against the first heat pipe 2, and A heat official 12-side is wound out of the first heat sink, and is bent horizontally to the side of the circuit board 4. The second heat sink 2 is positioned on the lower surface of the thief f road board 4, and is internally disposed. There is a second heat pipe 21' and the second heat pipe 2i-side is wound around the outer teeth of the second heat sink 2 and is bent to the side of the circuit board 4 to be horizontal. The third scatter 3 is adjacent to the circuit board, and the left and right pedestals 31 of the first active combination, and the left and right kelang inner points = the corresponding limit slots 311, and pass through the limit The groove 3 is for holding the first heat and the second heat f 2 1 is formed, and the left and the thin 1 are provided with a circular hole 3 2 2 corresponding to the plurality of positioning elements 3 2 for locking. In addition, the first heat sink and the second heat sink 2 are provided with a fixed position 5 for holding the circuit board 4, and the device 5 has a heat conductive gasket 5 1 , a bearing pad 52 and a locking turn. 53 such as the structure 'where the guide _ 5 丄 is positioned between the _ plate 4 ' and the thermal conductive cymbal 51 is provided with a grip on the "hot", and the block 5 1 1 ' is in the thermal conductive sheet 5 1 is surrounded by a perforation 512 for locking the locking element; and the bearing jaw 52 is positioned on the second dilation piece 2 and the circuit board 4 (10), the county c 2 four reading elements 5 3 pairs of locks = whole Element 521, and adjusting element 521 is provided with a support 522 guide: = Γ 53 is passed through the perforation 113 provided by the first heat sink 1 through the perforation 512 on the #5 spacer 5! Block (1) 9 M326662 and lock into the adjustment element 5 2 1 into a fixed. Please also refer to the fourth, fifth and sixth riding instructions, which is the three-dimensional diligence and the three-dimensional cross-section after the assembly of the three-dimensional cross-section before the creation of the creation, as seen from the figure in the figure. At the time of construction, the county puts the bearing pad 5 of the fixing device 5 on the lower surface of the circuit board 4, and simultaneously inserts the read 5 2 X alignment on the carrying pad 5 2 into the transparent plate on the circuit board 4. Then, the heat register 12 can be integrated into the limiting slot 112 of the first heat sink 1 and locked into the first heat sink 1 and the heat conductive gasket 5 i by the locking component 53 of the fixing device 5 Within the perforation 1 1 3, 5 1 2, the Itg member 5 2 1 locked into the bearing cymbal 5 2 through the rotation locking tree 5 3 can be positioned and positioned to achieve the material alignment locking and fixing - the first gt ;;1 on the upper and lower surfaces of the circuit board 4, the structure has a stable and stable position, not easy to fall off. Further, the above-mentioned locking component 53 is provided with a spring 53. When the locking device 5+ is locked, the elastic space county-heat sink i can be adjusted to a preferred height. a fine, when the first heat sink 1 reaches the positioning, the second heat sink 2 can be placed on the lower surface of the a road plate 4, and the bearing spacer 5 of the positioning device 5 is placed under the surface, Positioning so that the directions of the first and second heats of the first heat sink 1 and the second heat sink 2 are located on the side of the circuit board on the same day, so that the left and right bases of the second hot film 3 can be The seat 3 i holds the first and second heat pipes respectively. The second heat pipe is shown in the seventh figure. It is a side cross-sectional view of the original use. It can be clearly seen from the figure. - and when the second heat sink 1, 2 is absorbed into the heat source of the wafer 42 of the 10 M326662 circuit board 4, the first and second heat pipes 12, 21 can be used to conduct the heat source to the third heat sink 3, and the copper secrets are scattered. Fast, good cycle effect. Please continue to refer to the eighth, ninth and tenth drawings, which are the three-dimensional appearance, the three-dimensional exploded view and the side-viewing of the preferred embodiment of the present invention, which can be clearly seen from the towel, the creation Before and after, the second tube 2 of the heat pipe winding and the heat sink can be disposed on the circuit board 4 in two steps, and the first heat sink work is correspondingly disposed on the circuit board 4 and the first heat sink! A thermal conductive film 丄 is disposed between the lower surface of the circuit board 4, and a bearing spacer 52 is disposed between the second heat sink 2 and the upper surface of the circuit board 4, so that the bearing pad 52 is flatly attached to the circuit board 4. On the wafer 4 2, the heat lining for the heat generating wafer 4 2 is discharged from the bearing ^ 5 2 to the second scatter 2 to achieve the effect of quickly discharging the heat source. However, the above-mentioned fixing device 5 can lock the locking member $3 from the first hole> the perforation 1 13 of the hot sheet 1 into the locking hole 5丄2 of the thermal pad 5, and the circuit board 4 The through hole 41, the bearing piece 52 to the second heat sink 2, and then the outer part of the thin element 53 is sleeved by the spring 5 31 and the adjusting element 5 2 1 , and the adjusting element 5 21 and the locking element are transmitted. 5 3 interlocking each other, the components above and below the circuit board 4 can be stabilized and fixed, which can provide the user to replace different types of heat sinks on the heat-generating chip 4 2 of the circuit board 4, so that the heat-dissipating source effect is different. The heat sink is used to improve the heat dissipation efficiency. If it is equivalent to the structural change of the material, it is included in the patent scope of this creation and is combined with Chen Ming. Moreover, the first heat sink 1 and the first heat pipe 12 of the present invention are located on the surface 11 of the substrate 11 M326662 of the circuit board 4 and the second heat sink 2 and the second heat pipe 21 are located on the lower surface of the circuit board 4. When the circuit board 4 parts, the heat sink and the like are configured, the first heat sink 1 : s12 can be fan-shaped around the third heat sink 3 by simply disassembling the lock member 5 3 . Resolve: f:= In addition to the advantages of the faulty parts on the circuit board 4' 峨^ Θ 问 问 包含 包含 包含 包含 包含 包含 包含 包含 包含 。 。 。 。 。 。 。 。 。 。 。 。 。 。 When the user installs the structure of the present invention on the circuit board 4, the switch can be formed on the first and second heat pipes 12 and 21 to facilitate the fan-shaped adjustment angle of the heat sink 1 and is convenient. In order to dissipate the changes in the structure of other rounds, it should be the same as W.孰=本_Main protection focus is on the upper surface of the circuit board 4 with the second two: hot film 1, and the lower surface of the circuit board 4 is also provided with a second road board 4 two: can be gentleman; can The second heat sink 3 forms a rotating shaft shape to be adhered between the heat dissipation M and the second dispersion correction 2, = for the imr and the position of the touch, the replacement of the parts is easy, and the content of the creation is quickly included in the creation of the creation _, the combination should be The same package m2 before and after the creation of the heat pipe winding heat sink is a fine technology (a) the creation of the first and second heat sink W absorbed into the circuit board 4 heat source M326662 1 · ^ can make The first and the second fresh 12, 2! are used to conduct the heat source to the third crucible and the sheet 3, and have the effect of having two heat dissipating regions for the heat source to dissipate heat, adjust the position, and replace the parts easily and quickly. (Through the first and second heat pipes 12, 21 extend to the circuit material side = the second heat sink 3 is used for pivotal connection to form a heat pipe structure with a short size, which has the purpose of dissipating a heat dissipation source and being difficult to accumulate.
()本!]作透過第二散熱片3樞接於第_、第二熱管122 1 士上形成之轉軸形態，於調整第—散熱片1進行扇形擺動 日^ ’方可容易對位電路板4之晶片4 2上進行散埶。 :四）本創作透過第-散熱片工及第—熱管丄2位於電路板4上 表面’而第二散熱片2及第二熱f2丄位於電路板4下表 面於更換叉知之電路板4零件時，只需將第一散熱片1 上鎖固元件5 3進行拆解，即可以第三散熱片3為中心進 行扇形擺動’達到拆解容易、快速排除電路板4上故障零 五） 本創作透過鎖固元件5 3由第-散熱片1±向下鎖入至承 載塾片5 2之調整元件5 21，具有同時對位鎖緊固定誓 置5及第—散熱片1於電路板4上下表面之功效，達到: 構穩固定位之效果。 六） 本創作透過第二散熱片2設置於電路板4上方，且使第二 散熱片2下方承载塾片5 2平貼於電路板4之發熱晶片4 2上表面，供發熱晶片4 2產生之熱源得以藉由承載墊片 13 M326662 V» Z排政至弟一散熱片2，達到可替 至發熱晶片4 2上提昇散熱效率之優點。 惟’以上·僅為本_之較佳實施例而已，非因此即傷限 本創作之翻細，故舉凡職賴作·#及圖朗容所、 簡易修飾及等效結構變化，均應同理包含於本創作之專利範 ，合予陳明。 =上所述，本創作上述之前、後熱管繞接用散熱片於使 ，為確實能钿其功效及㈣，故摘作觸—實用 創 =合新型專利之申請要件，_申請，二 :准杨’㈣_作人之辛苦創作，倘若糾審委有任何 曰⑺衫來函指示’創作人定當竭力配合，實感公便。() This is made by the second heat sink 3 pivotally connected to the first and second heat pipes 122 1 on the shape of the rotating shaft, and the adjustment of the first heat sink 1 for the fan-shaped swinging day ^ ' can easily align the circuit board The wafer 4 of 4 is dilated. : 4) The present invention is located on the upper surface of the circuit board 4 through the first heat sinker and the first heat pipe 2, and the second heat sink 2 and the second heat f2 are located on the lower surface of the circuit board 4 to replace the circuit board 4 parts of the fork In this case, only the locking component 5 3 on the first heat sink 1 is disassembled, that is, the fan-shaped swing can be performed centering on the third heat sink 3 'to achieve easy disassembly, and quickly eliminate the fault on the circuit board 4 . The locking element 5 3 is locked downwardly from the first heat sink 1± to the adjusting element 5 21 carrying the cymbal 5 2 , and has the simultaneous locking and fixing of the venting 5 and the first heat sink 1 on the circuit board 4 . The effect of the surface is: to stabilize the fixed position. 6) The present invention is disposed above the circuit board 4 through the second heat sink 2, and the lower surface of the second heat sink 2 is placed on the upper surface of the heat-generating wafer 4 2 of the circuit board 4 for the heat-generating wafer 4 2 to be generated. The heat source can achieve the advantage of improving the heat dissipation efficiency of the heat-generating wafer 4 2 by carrying the gasket 13 M326662 V»Z to the heat sink 2 of the heat sink. However, 'the above is only the preferred embodiment of this _, and therefore it is not limited to the limitation of this creation. Therefore, the responsibilities of Lai Zuo·# and Tulangrong, simple modification and equivalent structural changes should be the same. The patents included in this creation are combined with Chen Ming. = As mentioned above, the heat sink for the heat pipe winding before and after the above creation is used to make it effective and (4), so it is a touch-practical creation = the application requirement of the new patent, _ application, two: Yang '(4) _ as a person's hard work, if the correction committee has any 曰 (7) shirt letter to indicate that the creator will try his best to cooperate, it is really polite.
14 M326662 * ^ 备> 【圖式簡單說明】14 M326662 * ^ 备> [Simple diagram]
第 一 圖 係為本創作之立體外觀圖。 第 圖 係為本創作之立體分解圖。 第 二 圖 係為本創作之侧視剖面圖。 第 四 圖 係為本創作組裝前之立體剖面圖。 第 五 圖 係為本創作組裝時之立體剖面圖。 第 六 圖 係為本創作組裝後之立體剖面圖。 第 七 圖 係為本創作使用時之側視剖面圖。 第 八 圖 係為本創作另一較佳實施例之立體外觀圖。 第 九 圖 係為本創作另一較佳實施例之立體分解圖。 第 十 圖 係為本創作另一較佳實施例之侧視剖面圖。 第十一圖 係為習用之立體分解圖。The first picture is a three-dimensional appearance of the creation. The figure is an exploded view of the creation. The second figure is a side profile view of the creation. The fourth figure is a three-dimensional section before the creation of the creation. The fifth figure is a three-dimensional sectional view of the creation of the creation. The sixth figure is a three-dimensional cross-section of the original assembly. The seventh figure is a side cross-sectional view of the creation. The eighth figure is a perspective view of another preferred embodiment of the present invention. The ninth drawing is an exploded perspective view of another preferred embodiment of the present invention. The tenth figure is a side cross-sectional view of another preferred embodiment of the present invention. The eleventh figure is a three-dimensional exploded view of the conventional.
主要元件符號說明】 1、第一散熱片 1 1、基座 1 1 1、鰭片 1 12、限位槽 1 13、穿孔 1 2、第一熱管 第二散熱片 15 M326662 % ^ 2 1、第二熱管 3、 第三散熱片 3 1、基座 31 1、限位槽 4、 電路板 4 1、透孔 5、 固定裝置 51、導熱墊片 51 1、導熱塊 512、穿孔 5 2、承載墊片 A、 晶片組 B、 第一熱窩 B 1、導熱部 B 2、散熱鰭片 3 1 2、圓孔 3 2、定位元件 4 2、晶片 5 21、調整元件 5 2 2、支撐塊 5 3、鎖固元件 5 31、彈簧 B 3、插入孔 C、第二熱窩 16 M326662 c l、插入孔 D、轉接卡Main component symbol description] 1. First heat sink 1 1 , base 1 1 1 , fin 1 12, limit slot 1 13 , perforation 1 2, first heat pipe second heat sink 15 M326662 % ^ 2 1 2 heat pipe 3, third heat sink 3 1 , base 31 1 , limiting groove 4 , circuit board 4 1 , through hole 5 , fixing device 51 , thermal conductive pad 51 1 , heat conducting block 512 , perforation 5 2 , bearing pad Sheet A, wafer set B, first heat sink B 1, heat transfer portion B 2, heat sink fins 3 1 2, round holes 3 2, positioning member 4 2, wafer 5 21, adjustment member 5 2 2, support block 5 3 , locking element 5 31, spring B 3, insertion hole C, second heat socket 16 M326662 cl, insertion hole D, riser card