M288393 八、新型說明： 【新型所屬之技術領域】 本創作為提供一種散熱裝置，係利用聚熱基座抵貼於發熱元 件表面，並藉由鰭片迅速均勻導熱，再透過聚熱基座之鰭片的延 伸方向為逆著扇葉的旋轉方向傾斜呈一夾角，進而達到鰭片均勻 散熱、風壓集中及吹風距離遠之功效。 【先前技術】 按，隨著高科技的蓬勃發展，電子元件的體積趨於微小化， 而且單位面積上的③、集度也愈來愈高’其效能更是不斷增強，在 ^些因素之下，電子元件的總發熱量則幾乎逐年升高，倘若沒有 良好的政熱方式來.電子元件所產生的熱，這些過高的溫度將 導致電子70件產生電子獅與減力等縣造成整體的穩定性降 氏^及細知私子元件本身的壽命，因此如何排除這些熱量以避 免電子兀件的過熱，一直是不容忽視的的問題。 —再者纟於個人電腦已普及在現代的社會裡，且電腦世代的 生命週期愈短，中央處理器（CPU)淘汰率也跟著升高，而中 緣里器的贱增加、處理速度錄，相_它所排放出的熱量 也不斷的增加’耐中域理器的表面積並沒有太大的變化之下 ，目前中央處翻缸作溫度約為6Q—9代左右，以這 況繼續發展，發熱的 寺數將持績升高，若沒有完善的散熱裝置 ’將會嚴重影響中央虚 里1^的正常運作，所以如何提高散熱器的 M288393 散熱效能是相當重要缸作；細，在上述種__驅使下， 創作人自八十—年起為主要針對散熱片陸續進行研發設計盘量產 至今，並可於核准在案之第五◦九三四八號、五七五二七I號等 專利案中瞭解其賴片之細微差異’即會直接影響散熱片的散熱 效率’請參閱第八圖所示’係為習用之立體外觀圖，由圖中可清 楚看出’其散熱片A由底層基板A i向上獻有複數之鑛片a 2 ，而風扇B即裝設於鰭片A 2之上表面，然而，當風扇b轉動傳 达冷風時’其冷卻風是由絲下的枝吹駐底縣板A丄表面 予以散熱，續由㈣A 2間的散熱通道A 3將熱風散發至四周， 然而’以此結構設計’其層疊之方式會使得整體的高度增加，且 祕板C上之晶片C 1並無法直接得到冷卻風的吹送，當熱源由 底層基板A 1進人後，會快_熱_上謂片A 2傳送，再經 由冷卻風朝下吹送，但是，—般風扇B是藉由賴B以動來形 成送風狀態，鼠使瓶扇料是無風就是風力微弱， 極易形成散熱的死角，以散熱片A之底層基板A丨而言，由於熱 聚焦效應’往往底層基板A丨巾峨是熱能最高的地方，如此使 得散熱片整體的散纽果不高，料致⑼c i過細致電腦當 機甚至資料損毀。 是以，要如何解決上述之問題與缺失，即為從事此行業之相 關廠商所亟欲研究改善之方向所在者。 【新型内容】 4 M288393 故曰創作人麵於上述缺失，乃搜集相關資料，經由多方評 考里並以;^事於此行業累積之多年經驗，經由不斷試作及 你改，始设叶出此種散熱裝置的新型專利誕生者。 本創作之主要目的乃在於聚熱基座側邊設置有風扇，其聚熱 基座之鰭片的延伸方向為逆著扇葉的旋轉方向傾斜呈—夾角，透 過基座側邊之風扇吹送冷風，使冷風針絲熱基財心予以散 •熱’使風扇所吹出之冷風的風壓增加，即可-次將韓片之孰源予 叫非除’並辅以導鱗包覆糖基座之㈣外緣，即可形成一空 氣循環對流狀態’輯_片均勻散熱、防止冷風溢出、風壓隼 中及吹風距離遠之功效。 【實施方式】 #為達成上述目的及功效，本創作所_之技術手段及其構造M288393 VIII. New Description: [New Technology Field] This product provides a heat dissipating device that is attached to the surface of the heating element by a heat collecting base, and is quickly and uniformly thermally conductive by the fins, and then passes through the heat collecting base. The extending direction of the fin is inclined at an angle against the rotation direction of the blade, thereby achieving the effect of uniform heat dissipation of the fin, concentration of wind pressure and long distance of blowing. [Prior Art] According to the rapid development of high technology, the volume of electronic components tends to be miniaturized, and the 3, the unit area is getting higher and higher. The performance is constantly increasing, in some factors. Under the circumstance, the total heat output of electronic components is almost increasing year by year. If there is no good political heat method. The heat generated by electronic components will cause the 70 electrons to produce electronic lions and power reduction. The stability of the lowering and knowing the life of the private component itself, so how to eliminate this heat to avoid overheating of the electronic component has been a problem that cannot be ignored. - In addition, personal computers have become popular in modern society, and the shorter the life cycle of the computer generation, the CPU (CPU) elimination rate has also increased, while the middle edge of the device has increased, processing speed, The heat emitted by the phase _ is also increasing continually. The surface area of the medium-resistant slab is not much changed. At present, the temperature at the center is about 6Q-9, and continues to develop. The number of fever temples will increase. If there is no perfect heat sink, it will seriously affect the normal operation of the central imaginary 1^, so how to improve the heat dissipation performance of the M288393 of the radiator is quite important; Driven by __, the creators have been developing and designing heat sinks for the heat sinks since the 1980s, and can be approved on the 5th, 9340, 5, 5, 2, 7 I. In the patent case, the nuances of the film are known to directly affect the heat dissipation efficiency of the heat sink. Please refer to the figure in Figure 8 for the stereoscopic appearance of the conventional image. It can be clearly seen from the figure that its heat sink A From the bottom substrate A i up There are a plurality of pieces a 2 , and the fan B is installed on the upper surface of the fin A 2 . However, when the fan b rotates to convey the cold wind, the cooling air is blown by the branches under the wire. The surface is dissipated, and the hot air is radiated to the periphery by the heat dissipation channel A 3 between the two (A) A 2, but the structure of the structure is increased by the way of the structure design, and the wafer C 1 on the secret board C cannot be directly When the cooling source is blown, when the heat source enters the bottom substrate A1, it will be transmitted quickly, and then the film A 2 will be conveyed, and then blown downward by the cooling wind. However, the fan B is moved by the B. In order to form the air supply state, the mouse makes the fan material windless or the wind is weak, and it is easy to form a dead angle of heat dissipation. In the case of the bottom substrate A of the heat sink A, due to the thermal focusing effect, the bottom substrate A is often the highest thermal energy. The place, so that the overall heat sink of the heat sink is not high, it is expected that (9) c i too fine computer crash or even data damage. Therefore, how to solve the above problems and deficiencies is the direction that the relevant manufacturers engaged in this industry are eager to study and improve. [New content] 4 M288393 The original creator of the above-mentioned genius is collecting the relevant information. Through the multi-party evaluation and the many years of experience accumulated in this industry, through continuous trials and changes, you will set up this leaf. The birth of a new type of patent for heat sinks. The main purpose of the present invention is to provide a fan on the side of the heat collecting base, and the fins of the heat collecting base extend in a direction opposite to the rotation direction of the blade, and the fan is blown through the fan on the side of the base. In order to make the cold wind needles heat the foundation, the heat will increase the wind pressure of the cold air blown by the fan, and then the source of the Korean film will be called the non-de- The outer edge of (4) can form an air circulation convection state, which can evenly dissipate heat, prevent cold air from overflowing, wind pressure, and blowing distance. [Embodiment] #Technical means and structure of the present invention for achieving the above purpose and effect
下，俾 ’兹綠圖就本_之較佳實施·加酬其特徵與功能如 利完全瞭解。 /月同日样閱第-、二、三、四圖所示，係為本創作之立體分 解圖、立體局部組合圖、立體外觀圖及於使用時之側視剖面圖， _可清_，本創作之散熱_包括有散熱片i及風扇 2所組成；其中： <該散熱>n為具有-聚熱基座21，並於聚熱基座“底部 设有可供發熱元件4表面抵貼之接觸面！丨i，而聚熱基座工丄 上方則設有複難射狀之，鰭片丨2，且㈣i 2為呈_傾斜角度 7 M288393Next, ’ ‘ 绿 图 就 就 绿 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ On the same day, the same as the first, second, third, and fourth pictures, this is the three-dimensional exploded view of the creation, the three-dimensional partial combination map, the three-dimensional appearance and the side view of the profile when used, _ can be clear _, this The heat dissipation of the creation includes a heat sink i and a fan 2; wherein: <the heat dissipation>n is a heat collecting base 21, and the bottom of the heat collecting base is provided with a surface for the heat generating component 4 The contact surface is 丨i, and the top of the heat collecting pedestal is provided with a difficult typhoon, the fin 丨 2, and (4) i 2 is _ inclined angle 7 M288393
该風扇2為設置於散熱片1-侧， 對於散熱片1之鰭片^ 2處。 b成有間隙121，而鰭片i2上方一 ’並使分叉片12 2彎折有一角度。 赛片1一侧，且風扇2之扇葉21為正 藉由上述構件於組構時，係先將風扇2設置於散熱片 ί一側，亚使散熱片1之鰭片12的延伸方向為逆著風扇2之屬 # 1的旋轉方向傾斜—角度，進而賴片1 2與扇葉2 i形成 夾角再於政熱》1之_片i 2外緣進—步包覆有導風罩3， 且導風罩3二側為分別具有開口3 i，而導風罩3之其中一側開 口 3 1處射供風扇2設置固定，即可完成本創作之整體組裝。 疋以，本創作於使用時，絲將散熱片1之聚熱基座1 1的 接觸面111與發熱元件4表面相互緊密壓貼，其散熱片1可為 銘、銅、_合金或導熱係數佳且f輕之材質賴成，而發熱元 件4則可為晶片、介面卡晶片、中央處理賊具發熱效果之電子 元件所構成，如此，便可將導風單3包覆於散熱片工之縛片工2 外緣，並使風扇2設置於散熱片丄之側邊，且風扇2之扇葉2工 的旋轉方向為與㈣！ 2_斜方向形成有夾角，以此結構設計 ’當發熱讀4於發熱時，其聚熱基座i !之接觸面2】會將 熱源快速吸收並料至㈣2 2處，於風扇2吹送冷風時，制 葉2 1旋獅風壓位置正好可正朗# i 2之卿:1 2 1處以及 聚熱基座1底部，如此，便可直接吹送冷風至聚絲座丄與發熱 元件4之間，此外，扇葉2!與鰭片i 2為形成錯位導風，使得 8 M288393 冷風朝向聚熱基座i聚集並在間隙丄2工處流動予以5熱 片12之分叉片122主要在集中風壓，因縛片12::= 的，12之間隙⑴是由内往外呈漸心 風於車父見的間隙1 2 1處容§散發，《透過分又片i 2 7 =冷風往聚熱基射中心集中，以使風扇3所吹出之冷風=The fan 2 is disposed on the side of the heat sink 1 and is located on the fin 2 of the heat sink 1. b has a gap 121, and a fin above the fin i2 and the bifurcated piece 12 2 is bent at an angle. When the blade 1 of the fan 2 is being assembled by the above-mentioned components, the fan 2 is first disposed on the side of the heat sink ί, and the extending direction of the fin 12 of the heat sink 1 is Tilting against the direction of rotation of the genus #1 of the fan 2, the angle of the slab 1 2 forms an angle with the fan blade 2 i, and then the outer edge of the slab i 2 of the political heat 1 is covered with the air hood 3 And the air hood 3 has an opening 3 i on each of the two sides, and the one side opening 31 of the air hood 3 is provided for the fan 2 to be fixed, so that the overall assembly of the creation can be completed.本 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The heating element 4 can be composed of a wafer, an interface card chip, and an electronic component that centrally processes the heat effect of the thief. Thus, the wind guide 3 can be coated on the heat sink. Attach the outer edge of the cutter 2, and set the fan 2 to the side of the heat sink ,, and the direction of rotation of the fan 2 of the fan 2 is (4)! 2_ oblique direction is formed with an angle, and the structure design 'when the heat reading 4 is heated, the contact surface 2 of the heat collecting base i! will quickly absorb and feed the heat source to (4) 22, and blow the cold air to the fan 2. At the time, the blade 2 1 lion wind pressure position is just right. # i 2之卿: 1 2 1 and the bottom of the heat collecting base 1, so that the cold air can be directly blown between the filament seat and the heating element 4. In addition, the blade 2! and the fin i 2 form a misaligned wind guide, so that the 8 M288393 cold air gathers toward the heat collecting base i and flows at the gap 丄2, and the bifurcation piece 122 of the 5 hot sheet 12 is mainly concentrated. Wind pressure, due to the binding piece 12::=, the gap between the 12 (1) is from the inside out, the heart is seen in the gap of the car father to see the gap 1 2 1 § 散 , , 《 《 i i i i i i i i i i i i i i i i i i i i i i i The heat base is concentrated so that the cold air blown by the fan 3 =
私加，也增祕片1 2的散熱面積，並同時藉由導風罩3來防 止冷風於嶋1 2處向外溢出散發，便可增長風流再—次將鱗片 1 2之熱源予輯除，進而達到鰭片有效均勻 出、風壓射及吹風距_之功效。 請繼續參閱第五圖所示，係為本創作另一較佳實施例之側視 剖面圖，可由®中可清楚看出，本創作之散熱片丨之聚熱基座工 1内可進—步設置有導熱塊1 3，其導熱塊1 3可絲、銅、銘 銅合金或導熱係數佳且質輕之材質（如熱導管或熱柱等）所構成 如此，可避免因散熱片1過重，以致發熱元件4無法承受散熱 片1之重量而損壞，透過導熱塊i 3即可使熱源快速吸收並傳導 至鰭片12中，讓鰭片12均勻導熱，使得熱源不會一直囤積在 聚熱基座11底部，進而提高整體之散熱效果，是以，上述導熱 塊13之設置可視使用者的需求或設計的不同而設置有一個或一 個以上，且導熱塊i 3可直接設置於聚熱基座11底部或中央， 僅需使聚熱基座11與導熱塊丄3為不同材質所製成，此種簡易 修飾及等效結構變化，均應同理包含於本創作之專利範圍内，合 予陳明。 M288393 請繼續表間楚丄 _ 外觀圖，可由圖夂==係為本創作再—較佳實施例之立儀 散熱片1二側之風扇2亦可同時峨 個風扇2則利用/ 個風扇2為利用吹風之方式，而另- 片12予卿風:f’如此，當吹風之風扇2吹送冷風至賴 外界，此種，風之風扇2亦可將散熱後之熱風抽出至 内容易造Γ 為僅使散刻1二側之風扇2於導風罩3 竹喊環騎散熱，料柄自 運用本創作々明查效果，故舉凡 的座门 書圖式内容所為之簡易修飾及等效姓構^卜 ，理私於本創作之專利範圍内，合予陳明構"化’ 分解圖，可由=七圖所不’係為本創作又-較佳實施例之立體 進-步二=楚看出’本創作之聚熱基座11底部為可 杯敍一 …座5’且導熱座5底部之接觸面51面積為ώ ，件4相符’並於聚熱基座^與導熱座5之間二管 ‘=2長，熱基座U長度相同，如此，當發熱 ;“、、彳料熱座5會將飾快速魏並料至熱管5 謓μ利賴f 5 2 源平均料至聚餘座11底部表面， D〜、基座1 1均勻受熱’而後再將熱源平均傳導至韓片丄2處 ，進而使得_不會—直_絲齡座1 1之·位置處，進 而可提高整體之賴效果，再者，上述之鮮5 2可依散熱片丄 ^形狀、大小來弯折至導風罩3處，或是f折至聚熱基座U與 =片1 2之交界處韻’為做鮮5 2將_料至溫度較低 处’此種簡易修飾及等效結構變化，均應同理包含於本創作之專 M288393 利範圍内，合予陳明。 、、不上所述，本散熱裝置創作使用時具有顯著之功效增進，域 符合新穎性、創作性及進步性之專利要件，爱依法提出申請，盼 審委早曰賜准本案，以保障創作人之辛苦創作，倘若鈞局有 任何稽疑％不吝來純示，創作人定當竭力配合，實感德便。 述羊、、、田.兒明為針對本創作一種較佳之可行實施例說明而已 :惟該實施舰_雜定本創作之㈣翻細，凡其它未脱 _本創作所揭示之技#精神下所完成之均等變化與修飾變更，均 應包含於本創作所涵蓋之專利範圍中。 【圖式簡單說明】 第圖係為本創作之立體分解圖。 第一圖係為本創作之立體局部組合圖。 第二圖係為本創作立體外觀圖。 第四圖係為本創作於使用時之側視剖面圖。 社圖係為本創作另一較佳實施例之側视剖面圖。 第六圖係、為本創作再一較佳實施例之立體外觀圖。 弟七圖係為本創作又一較佳實施例之立體分解圖。 第八圖係為習用之立體外觀圖。 M288393 【主要元件 1、 散熱片 1 1、聚熱基座 1 1 1、接觸面 1 2、鰭片 2、 風扇 2 1、扇葉Privately, it also increases the heat dissipation area of the film 1 and at the same time prevents the cold air from spilling out at the 嶋12 by the air hood 3, which can increase the wind flow and then remove the heat source of the scale 12 In turn, the effect of the fins being effectively uniform, the wind pressure and the air blowing distance are achieved. Please refer to the fifth figure for a side view of another preferred embodiment of the present invention. It can be clearly seen from the ® that the heat sink of the present invention can be used in the heat collecting base 1 The step is provided with a heat conducting block 13 , and the heat conducting block 13 can be composed of wire, copper, copper alloy or a material with good thermal conductivity and light weight (such as heat pipe or hot column), so as to avoid excessive weight of the heat sink 1 Therefore, the heating element 4 can not bear the weight of the heat sink 1 and is damaged. The heat source block 3 can quickly absorb and conduct the heat source into the fin 12, so that the fin 12 is uniformly thermally conductive, so that the heat source does not always accumulate in the heat collecting. The bottom of the base 11 further enhances the overall heat dissipation effect, so that the heat conduction block 13 can be disposed one or more differently depending on the user's needs or design, and the heat conductive block i 3 can be directly disposed on the heat collecting base. At the bottom or the center of the seat 11, only the heat collecting base 11 and the heat conducting block 丄3 are made of different materials. Such simple modification and equivalent structural changes are all included in the patent scope of the present invention. To Chen Ming. M288393 Please continue with the table _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In order to use the method of blowing, and another - piece 12 to Qingfeng: f', when the fan 2 blows cold air to the outside, this kind of fan 2 can also extract the hot air after heat dissipation into the inside. In order to make only the fan 2 on the two sides of the slanting side of the air hood 3, the bamboo screaming ring rides the heat, and the handle is self-applied with the effect of the creation, so that the content of the syllabus is simply modified and equivalent. Constructed ^ Bu, privileged within the scope of the patent of this creation, combined with Chen Ming structure " chemical decomposition map, can be based on = seven maps are not based on the creation - the preferred embodiment of the three-dimensional step - step two = Chu look The bottom of the heat collecting base 11 of the present invention is a cup-shaped one seat 5' and the contact surface 51 at the bottom of the heat-conducting seat 5 is ώ, the piece 4 conforms to 'between the heat collecting base ^ and the heat conducting seat 5 The two tubes are '=2 long, the length of the hot base U is the same, so when the heat is generated; ",, the hot seat 5 will be decorated with the fast Wei and the heat pipe 5 謓The Lilai f 5 2 source is averaged to the bottom surface of the polycap 11 , D ~ , the pedestal 1 1 is evenly heated ' and then the heat source is evenly conducted to the Korean 丄 2, thereby making _ not - straight _ 丝At the position of 1 1 , the overall effect can be improved. Furthermore, the fresh 5 2 can be bent to the windshield 3 according to the shape and size of the heat sink, or f to the heat collecting base. At the junction of the seat U and the =1 2, the rhyme 'for the fresh 5 2 will be _ feed to the lower temperature', such simple modification and equivalent structural changes, should be included in the scope of the creation of the special M288393 , combined with Chen Ming.,, not mentioned, the heat sink device has significant effect enhancement when it is created and used. The domain meets the patent requirements of novelty, creativity and progress, and loves to apply according to law. This case is intended to protect the creators' hard work. If there is any suspicion in the scam, the creators will try their best to cooperate with them, and they will feel the virtues. The sheep, the tian, the tian ming are better for this creation. Description of the possible embodiments: only the implementation of the ship _ miscellaneous book creation (four) fine, where others The equal changes and modifications made by the technology disclosed in this article should be included in the scope of patents covered by this creation. [Simplified illustration] The figure is a three-dimensional exploded view of the creation. The first picture is a three-dimensional partial combination of the creation. The second picture is a three-dimensional appearance of the creation. The fourth picture is a side view of the creation in use. 6 is a perspective view of a preferred embodiment of the present invention. The seventh diagram is an exploded perspective view of another preferred embodiment of the present invention. Appearance of the three-dimensional appearance. M288393 [Main components 1, heat sink 1 1, heat collecting base 1 1 1, contact surface 1, 2, fin 2, fan 2 1, fan blade
符號說明】 1 2 1、間隙 12 2、分叉片 3、 導風罩 3 1、開口 4、 發熱元件 5 2、熱管 A 3、散熱通道 5、 導熱座 51、接觸面 A、 散熱片 A 1、底層基板 A 2、鰭片 B、 風扇 B 1、扇葉 C、 電路板DESCRIPTION OF REFERENCE NUMERALS 1 2 1 , gap 12 2, bifurcation piece 3, air hood 3 1 , opening 4 , heating element 5 2 , heat pipe A 3 , heat dissipation channel 5 , heat conducting seat 51 , contact surface A , heat sink A 1 , bottom substrate A 2, fin B, fan B 1, fan blade C, circuit board