I276388 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種側吹式散熱裝置與方法，尤# :種可將中央處理器所產生之熱能直接排出至主機殼』 外部’讓熱排除順暢’而具有較佳散熱功效 與方法。 …衣置 【先前技術】 按，一般習用之散熱方式如第6圖所示，其係於一 =處^上設置有—散熱W組6，且該散熱韓片組 Φ又置有風扇6 1，可使該散熱轉片組6吸收該 敎：處理器之熱能，並利用該風扇6 1導引氣流至該散 :、:弋組！上’藉以將該散熱鰭片組6所吸收之該熱能 :λ氣抓邢出而s该散熱鰭片組6上之該熱能被帶出 :’=流係留在主機殼體中’此時則藉由主機殼體上 另外设置之風扇將該氣流排出至主機殼體外部； +但是由於該t央處判上之該散顏與主機 二又體上所設之風扇間通常會有—段距離，所以當主機殼 姊上之風扇尚未將該氣流排出時，該氣流便會於主機殼 :内部循環’而當該氣流於主機殼體内部循環時，該氣 Γ便會被該散熱轉片組6之該風扇6 1吸引，而將該氣 :再-人導引至4散熱片組6上’產生熱循環，造成散 熱不佳之現象。 1276388 又如美國專利號US π”，· B2所示 其係由-基座110、一設置於該基座；；= ::組合！ 3 〇 ' 一罩設於該基座2丄〇與該鰭片組 ;。0 :部之導引殼1 4 0、以及一設置於該基座1 另端1 12之風扇1 2 〇所組成，且該鰭片組合 3 2與該風扇1 2 0對應處具有一凹面端丄34 ;當 =用蚪如该美國專利之第8圖所示，係可將中央處理 …、源之熱能藉由該基座1 1 〇傳至該鰭片組合1 3 〇上，並藉由該風扇！ 2 〇將氣流導引至該韓片組合 1 3 〇之位置處，此時，由於該鰭片組合丄3 〇與該風 f 1 2 0對應處具有一凹面端丄3 4，因此，可使該氣 f經由該鰭片組合丄3 〇將熱能順利導出形成一熱氣 //IL，不會在該鰭片組合1 3 〇内部產生亂流之現象。 士言雖然上述之美國專利，可使該風扇i 2 〇將該熱氣 流f出該鰭片組合i 3 0，而不會在該鰭片組合i 3 〇 内。卩產生亂流之現象；但是由於其整體結構之設置，因 此於導出該熱氣流後，便會使該該熱氣流停留在主機殼 體之内部，且由於一般主機殼體上所設之另一風扇距離 该主機板之散熱裝置較遠，故當主機殼體上所設之另一 風扇尚未將該熱氣流吸取並加以排出時，該熱氣流便會 於主機殼體内部循環，而使該熱氣流再度被該風扇工2 〇吸引，而將該熱氣流再導引至該鰭片組合丄3 〇上， 而‘致主機殼體内部熱循環之現象，進而造成散熱功效 1276388 不佳之情形發生。 1276388 【發明内容】 因此，本發明之主要目的係在於，可使中央處理器 :產生，熱能由一散熱單元吸收後’利用-風扇導引： 机至δ亥散熱單元，使該熱能藉言亥氣流經該散熱單元由一 罩體之::1 口部導出至-電源供應器風扇處，並利用該電 源供應器風扇將該熱能藉該氣流導出至主機殼體外^， 而不會使主機殼體内部產生熱循環，並進而達到 散熱功效。 土 戶首ΪΓ月之另—目的係在於，可利用該電源供應器風 f直接將職能導出至域殼體外部，使主機殼體 去一個風扇之設置。 為達上述之目的，本發明係—種側吹式散熱裝置斑 /’其係包含—側吹式散熱裝置，係由-散熱單元、 ^又於该散熱單m罩體及設置於該罩體—端之一 風扇所組成；及—側吹式散熱方法，係包括： 主機」：)二:散熱單元’將該散熱單元之底座貼覆於 熱早凡之一端對應於 主機忒體内部電源供應器之一風扇處； (b)提供一罩體罩設於該散熱單元上， 二端各具一開口部， 1而其中之一開口部具一斜面部，當 δ亥罩體罩設時，係可依戶斤兩蔣兮罢 、 竹j依所而將邊罩體中該具斜面部之開 口部’或以另一開口部，對摩到 應器風扇處； u主機一部該電源供 (C)將一風扇設置於該具斜面部之開口部處，而 1276388 扇對；1與主機殼體内部該電源供應器風 =二風扇為吸風扇，但當該罩體以另-開口 為排風:内部該電源供應器風扇對應時，則該風扇 收，並導理器所一產:之熱能經由該底座吸 扇導引裔、六石月…、早兀之一鰭片體上之後，利用該風 由該罩體:端：二體:通道部，而將該熱能藉該氣流 熱氣流送至該電二一熱氣流’再直接將該 風扇將該熱氣流導出至:二:’;利用該電源供應器 【實施方式】 觀=閱：12及第3圖所示，係本發明之立體 規不思圖、本發明之☆邮八 肢1 離亍咅阁上月之立租刀解不意圖及本發明之側視狀 :，所示：本發明係一種側吹 明之散熱裝置係由—散熱單 體2、 及一風扇3所組成；而本發 卓體2 扇3將該散熱單元,上之敎可利用該風 應器風扇處，並利用該電；…二广出至-電源供 流導出至主機殼體外部，而不':::f將該熱能藉該氣 循環，進而達難佳之散熱功效。產生熱 較佳St::1 成係由紹、銅，金或銅合金等散熱 i計成’而該散熱單元1係具有-底座i 亥底座11上係延伸有至少-以上之韓片體12: 1276388 ㈣片體1 2間係形成有連通該散熱單元i二端之通道 部13 ’並於該底座11底面之一端具有-缺口部1 4 ’而該底幻！底面之另二側係分別設置有一卡槽丄 5 ’且該散熱單元1之頂面係呈-曲弧狀； 該罩體2係罩設於該散熱單元1上，而該罩體2之 二側面係分別具有一擒板21，且該罩體2之另二側面 9、刀另K、有與5亥政熱單元工二端相對應之開口部2 、23’其中一端之開口部22係具有一斜面部24， 使該二開口部22、夕*山二 ^ ^ 乙 23之知面位於不同平面上，並於 该罩體2之頂面係具有一盘兮#刼σο — .^ Λ ^ °亥政熱早兀1之頂面相對應 之弧面# 2 5，且該罩體2 -相,丨而少掉』〇 f 側面之擋板2 1係分別向 下延伸有至少一以上之接人 而h (U2 1 1與該底座1 1之底 面扣接’而該接合部2 1 1y炎 一 接-邱”… 可為一勾狀體，藉以使該 可對應扣接於該底座11底面：側之卡槽 5 ’而可使該軍體2穩固罩設於該散敎 該風扇3係設置於該罩體1且 上， 開口邻”卡1 早粒比亥具有斜面部2 4之 。卩2 2處，使該風扇對應於該散熱單元丄 之一端，且該風扇3相對於連接 1 其各踹邱考总A 巧使茨皁體處之另一面， 各W處係為—圓弧面3 i，而該風 曲 風屬，或吸JK戶 j* g μ 系了為一排 H及風扇。如S，藉由上述之結構 月文熱裝置。 筹成一側吹式 、請參閱第4、5圖所示，係本發明之、 法示意圖’其係藉該側吹式散熱裝置依下列方 1276388 包括： (a )取-散熱單w，將該散熱單元^一底座 11貼覆於一主機板4之-中央處理器41上，並使該 散Ϊ早兀1之—端對應到—主機殼體5内部之-電源供 應'4 2之風扇處4 3 ’且在該散熱單元工設置時， 係可藉4底座1 1底面—端之缺σ部丨4避開該主機板 4上之電子元件4 4 ; (b)將-軍體2罩設於上述散熱單^上，該罩 =之二端各具—開口部22、23，其中有一開口部 2 2具 一斜面部2 4，當星^ p S -^Π. nrfc v Μ 田皁體2罩设時，係可依所需將 邊具斜面部之開口部22對應於魅機殼體5 電源供應器42風扇43處，或以另—開口部2岸 於該主機殼體5内部之該電源供應器42風扇43處Γ 9 j C i將一風扇3設置於該具斜面部2 4之開口部 2處’ 具斜面部2 4之開口部2 2與主機I276388 IX. Description of the Invention: [Technical Field] The present invention relates to a side-blown heat sink and method, and the heat energy generated by the central processing unit can be directly discharged to the main body casing. Let the heat out of the smooth 'with better heat dissipation and method. ...Apparel [Previous Technology] Press, the conventional heat dissipation method is as shown in Fig. 6, which is provided with a heat dissipation W group 6 at a = ^, and the heat dissipation Korean film group Φ is further provided with a fan 6 1 The heat-dissipating rotor set 6 can be used to absorb the heat of the processor: the fan 6 1 is used to guide the airflow to the air:: group! The heat energy absorbed by the heat sink fin group 6 is: the λ gas is grabbed and the heat energy on the heat sink fin group 6 is taken out: '= the flow system remains in the host casing' The airflow is discharged to the outside of the main body casing by a fan provided on the main body of the main body; however, the fan is usually disposed between the fan and the fan disposed on the main body. - the distance of the section, so when the fan on the main casing has not exhausted the airflow, the airflow will be in the main casing: internal circulation' and when the airflow circulates inside the main casing, the air will The fan 6 1 of the heat-dissipating rotor set 6 is attracted, and the gas: the person is guided to the heat sink group 6 to generate a thermal cycle, resulting in poor heat dissipation. 1276388 is also shown in the U.S. Patent No. US π", · B2, which is provided by the base 110, and is disposed on the base;; = :: combination! 3 〇' a cover is disposed on the base 2 a fin set; 0: a guide shell 1 4 0 of the portion, and a fan 1 2 设置 disposed at the other end 1 12 of the base 1, and the fin combination 3 2 corresponds to the fan 1 2 0 There is a concave end 丄 34; when used = as shown in Fig. 8 of the U.S. patent, the central processing can be carried out by the susceptor 1 1 to the fin assembly 1 3 〇 Up, and by the fan! 2 〇 guide the airflow to the position of the Korean combination 1 3 ,, at this time, since the fin assembly 丄3 具有 has a concave end corresponding to the wind f 1 2 0丄3 4, therefore, the gas f can be smoothly exported to form a hot gas / / IL through the fin assembly 〇 3 ,, and there is no turbulent flow inside the fin assembly 13 3 . In the above U.S. patent, the fan i 2 〇 can send the hot air flow out of the fin combination i 3 0 without being in the fin combination i 3 卩. The phenomenon of turbulence occurs; The arrangement of the body structure, so that after the hot air flow is derived, the hot air flow stays inside the main body casing, and because another fan disposed on the main casing is away from the heat sink of the main board Farther away, when another fan provided on the main body casing has not sucked and exhausted the hot air flow, the hot air flow will circulate inside the main body casing, and the hot air flow is again used by the fan 2 〇 attracting, and the hot air flow is redirected to the fin assembly 丄3 ,, and the phenomenon of thermal cycling inside the main body casing causes the heat dissipation effect 1276388 to be poor. 1276388 [Summary] Therefore, the main purpose of the present invention is to enable the central processing unit to generate heat energy absorbed by a heat dissipating unit and then use the fan to guide the heat to the heat dissipation unit. The cover of the cover::1 is led to the power supply fan, and the heat supply fan is used to conduct the heat energy to the outside of the main body casing without generating the inside of the main body casing. Thermal cycling, In order to achieve the heat dissipation effect, the first purpose of the first month of the Tusho is to use the power supply wind f to directly export the functions to the outside of the domain housing, so that the main body casing can be set to a fan. OBJECTS OF THE INVENTION The present invention relates to a side-blown heat dissipating device spot/there is a side-blown heat dissipating device, which is composed of a heat dissipating unit, a heat dissipating unit m cover body, and one of the end portions of the heat dissipating body. The fan is composed of a fan and a side-blow heat dissipation method, including: a main body:: 2: a heat dissipating unit affixes the base of the heat dissipating unit to one of the heat sources, corresponding to one of the internal power supply of the main body (b) providing a cover cover on the heat dissipating unit, each end having an opening portion, and one of the openings has a sloped portion, and when the δ hood cover is covered,斤Two Jiang 兮 、 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The fan is disposed at the opening portion of the inclined surface, and the 1276388 fan pair; 1 and the host Inside the housing, the power supply wind=two fans are suction fans, but when the cover is exhausted by another opening: when the internal power supply fan corresponds, the fan is received, and the guide is produced: The heat energy is guided by the base suction fan to guide the patriarch, the six stone moon... after one of the fins is used, the wind is used by the cover body: the end: the two body: the passage portion, and the heat energy is used to borrow the hot air from the air flow. Flowing to the electric hot air flow 'and directly directing the fan to the hot air flow to: two: '; using the power supply device [embodiment] View = read: 12 and 3, the present invention The stereoscopic rule does not reflect, the invention of the ☆ mail amps 1 from the 亍咅 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上The heat radiating unit 2 and the fan 3 are composed of the heat radiating unit 2 and the fan 3; and the heat radiating unit of the present invention can be utilized by the wind turbine fan, and the electric power is utilized; The power supply is exported to the outside of the main body casing, and the ':::f is used to circulate the heat energy, thereby achieving the heat dissipation effect. The heat generation is preferably St::1. The heat dissipation unit 1 has a heat dissipation unit i, and the heat dissipation unit 1 has a base body i. : 1276388 (4) The body 1 is formed with a channel portion 13' that communicates with the two ends of the heat dissipating unit i, and has a notch portion 1 4 ' at one end of the bottom surface of the base 11 and the bottom is magic! The other two sides of the bottom surface are respectively provided with a card slot ' 5 ′ and the top surface of the heat dissipation unit 1 is curved in a curved shape; the cover body 2 is disposed on the heat dissipation unit 1 , and the cover body 2 is The side portions respectively have a seesaw 21, and the other two side faces 9 of the cover body 2, the knife K, and the opening portions 2, 23' corresponding to the two ends of the 5 The utility model has a slanting surface portion 24, so that the two opening portions 22, the sacred surface of the shovel 2, and the shovel 23 are located on different planes, and the top surface of the hood 2 has a disk 兮#刼σο — .^ Λ ^ °Hei Zheng hot early 兀 1 on the top surface corresponding to the curved surface # 2 5, and the cover 2 - phase, 丨 少 〇 〇 〇 side baffle 2 1 series respectively extend downwards at least one or more And the hook (the U2 1 1 is fastened to the bottom surface of the base 1 1 and the joint portion 2 1 1y is connected to the Qiu Qiu...) can be a hook-shaped body, so that the corresponding hook can be fastened to the base 11 The bottom surface: the side of the card slot 5 ′, the military body 2 can be stably disposed on the divergence. The fan 3 is disposed on the cover body 1 , and the opening adjacent to the card 1 has an inclined surface portion 2卩 2 2 places, make The fan corresponds to one end of the heat dissipating unit, and the fan 3 is opposite to the other side of the connection 1 and the other side of the body is the arc surface 3 i, and the wind The genus of the genus, or the JK household j* g μ is a row of H and a fan. For example, S, the above-mentioned structure of the monthly heat device. To form a side blowing type, please refer to the figures 4 and 5, The schematic diagram of the present invention is based on the following side 1276388 comprising: (a) taking a heat dissipation unit w, and attaching the heat dissipation unit to a base 11 to a central portion of the motherboard 4 On the processor 41, the end of the divergence 1 corresponds to the fan portion 4 3 ' of the power supply '42 inside the host casing 5 and can be borrowed when the heat sink unit is set 4 The base 1 1 bottom-end σ section 避 4 avoids the electronic component 4 4 on the motherboard 4; (b) The - military 2 is placed on the heat dissipation unit ^, the cover = two ends The opening portion 22, 23 has an opening portion 2 2 having a slope portion 24, and when the star ^ p S -^Π. nrfc v Μ田皂体2 is covered, the side can be beveled as needed Part of the opening 22 A fan 3 should be set at the fan 43 of the power supply housing 5 power supply 42 or at the power supply 42 fan 43 of the power supply unit 42 inside the main housing 5 At the opening portion 2 having the inclined surface portion 24, the opening portion 2 2 having the inclined surface portion 24 and the host
内部之該電源供應器4 2風扇4 q料_ 士 D 為龍戶而Μ Μ扇4 3對應時，則該風扇3 $ $ 另―開口部㈠與主機殼體5内 電源供應器4 2風扇4 Q斟廄pi士 Br„ π 4 3對應…職風扇3為排風扇。 (d )如弟4圖所示，係本發明之使用狀態 ， 其係將該風扇3設置於該罩體2中該具斜面部2:二 口部2 2處，使該具有風扇3之開 ： 内部之該電源供應器4_3對應，:二戶體 為吸風扇’而當该中央處理器4 1所產生之熱能經：該 1276388 散熱單元1之底H i吸收並導引至該鰭片们2後， 由，風扇3將該熱能經—氣流由該罩體2導出而形 熱氣流’並直接將該導出之熱氣流送至該電源供應器4 2風扇4 3處’由於該電源供應器4 2風扇4 3係對應 於主機殼體5之-端面’故可將該熱氣流配合該電源供 應器4 2風扇4 3將熱源排出至主機殼體5外部，而不、 會使主機殼體5内部產生熱循環’進而達到較佳之散熱 功效。 請進一步參閱第5圖，如圖所示係本發明之另一使 用狀態示意圖’其係以該罩體2之另—開口部2 3對應 於該主機殼體5内部之該電源供應器4 2風扇4 3處了 故該設置於該具斜面部2 4之開口部2 2處之風扇3為 排，扇’而當該中央處理器41所產生之熱能經由該散 熱單元1之底座1 1吸收並導引至鳍片體丄2後，利用 該風扇3導引氣流至該散熱單元丨之_通道部丨3間， 使熱能藉該氣流由該罩體2之另一開口部2 3導出成一 熱氣流’並直接將該熱氣流導出至該電源供應器4 2風 扇4 3處’而由於該電源供應器4 2風扇4 3係對應於 主機殼體5之-端面，因此，當該風扇3將該散熱單元 1之熱氣流導出時’該熱氣流即藉由該罩體2頂面之弧 面部2 5產生加壓而達直吹式風扇之效果，使該熱能由 該另-開口部2 3藉該熱氣流排出，如此，即可配合該 電源供應器4 2風扇4 3將熱能藉該熱氣流排出主機殼 1276388 體5外部，而不會使主機殼體5内部產生熱循環，進而 達到較佳之散熱功效。 惟以上所述者，僅為本發明之較佳實施例而已，告 不能以此限定本發明實施之範圍；故，凡依本發明申: 專利範圍及發明說明書内容所作之簡單的等效變化與： 飾，皆應仍屬本發明專利涵蓋之範圍内。The internal power supply 4 2 fan 4 q material _ 士 D is Longhu and Μ 4 fan 4 3 corresponds, then the fan 3 $ additional opening (a) and the main housing 5 power supply 4 2 The fan 4 Q斟廄pi士Br„ π 4 3 corresponds to the exhaust fan 3 as the exhaust fan. (d) As shown in FIG. 4, in the state of use of the present invention, the fan 3 is disposed in the cover 2 The slanting surface 2: the two mouth portions 2 2, so that the fan 3 is opened: the internal power supply 4_3 corresponds to: the two households are suction fans' and the thermal energy generated by the central processing unit 4 1 After: the bottom of the 1276388 heat dissipating unit 1 is absorbed and guided to the fins 2, the fan 3 derives the thermal energy through the airflow from the cover 2 to form a hot air flow and directly derives the The hot air flow is sent to the power supply 4 2 at the fan 43. 'Because the power supply 42 2 the fan 4 3 corresponds to the end face of the main body casing 5, the hot air flow can be matched with the power supply 4 2 The fan 43 discharges the heat source to the outside of the main body casing 5, and does not cause thermal circulation inside the main casing 5 to achieve better heat dissipation. Referring to Fig. 5, there is shown a schematic view of another use state of the present invention. The other opening portion 2 of the cover 2 corresponds to the power supply unit 4 inside the main casing 5. The fan 4 is disposed so that the fan 3 disposed at the opening portion 22 of the inclined surface portion 24 is a row, and the heat generated by the central processing unit 41 is absorbed by the base 1 1 of the heat dissipation unit 1 After being guided to the fin body 2, the fan 3 is used to guide the airflow between the channel portions 3 of the heat dissipating unit, so that the heat energy is derived from the other opening portion 2 3 of the cover body 2 by the air flow. The hot air flow 'and directly directs the hot air flow to the power supply 42 2 fan 43" and since the power supply 42 2 fan 4 3 corresponds to the end face of the main body casing 5, therefore, when the fan 3, when the hot air flow of the heat dissipating unit 1 is led out, the hot air flow is pressurized by the arc surface portion 25 of the top surface of the cover body 2 to achieve the effect of the direct blow type fan, so that the heat energy is from the other opening portion. 2 3 is discharged by the hot air flow, so that the power supply 4 4 fan 4 3 can be used to discharge the heat energy from the main body casing 1 276388 The outside of the body 5 does not cause thermal circulation inside the main body casing 5, thereby achieving better heat dissipation effect. However, the above is only a preferred embodiment of the present invention, and the present invention cannot be limited thereto. Scope of implementation; therefore, the simple equivalent changes made with the scope of the patent and the contents of the invention are in the scope of the invention.
14 1276388 【圖式簡單說明】 第1圖，係本發明之立體外觀示意圖。 第2圖，係本發明之立體分解示意圖。 第3圖，係本發明之側視狀態示意圖。 第4圖，係本發明之使用狀態示意圖。 第5圖，係本發明之另一使用狀態示意圖。 第6圖，係習用之另一使用狀態示意圖。 第7圖，係習用美國專利之立體分解示意圖。 第8圖，係習用美國專利之熱流模擬分析示意圖。 【主要元件符號說明】 散熱單元1 底座1 1 鰭片體1 2 通道部1 3 缺口部1 4 卡槽1 5 罩體2 擋板2 1 接合部2 1 1 開口部2 2、2 3 斜面部2 4 弧面部2 5 風扇3 15 1276388 圓弧面3 1 主機板4 中央處理器4 1 電源供應器4 2 風扇4 3 電子元件4 4 主機殼體5 1614 1276388 [Simple description of the drawings] Fig. 1 is a schematic perspective view of the present invention. Fig. 2 is a perspective exploded view of the present invention. Figure 3 is a schematic side view of the present invention. Fig. 4 is a schematic view showing the state of use of the present invention. Fig. 5 is a schematic view showing another state of use of the present invention. Fig. 6 is a schematic view showing another use state of the conventional use. Figure 7 is a perspective exploded view of a conventional U.S. patent. Figure 8 is a schematic diagram of a heat flow simulation analysis using a U.S. patent. [Description of main component symbols] Heat sink unit 1 Base 1 1 Fin body 1 2 Channel part 1 3 Notch 1 4 Card slot 1 5 Cover 2 Baffle 2 1 Joint 2 1 1 Opening 2 2, 2 3 Inclined 2 4 Arc face 2 5 Fan 3 15 1276388 Circular face 3 1 Motherboard 4 Central processor 4 1 Power supply 4 2 Fan 4 3 Electronic component 4 4 Main unit housing 5 16