TW243546B - Tray for ball terminal integrated circuits - Google Patents

Tray for ball terminal integrated circuits

Info

Publication number
TW243546B
TW243546B TW083106616A TW83106616A TW243546B TW 243546 B TW243546 B TW 243546B TW 083106616 A TW083106616 A TW 083106616A TW 83106616 A TW83106616 A TW 83106616A TW 243546 B TW243546 B TW 243546B
Authority
TW
Taiwan
Prior art keywords
tray
component
orientation
framework
integrated circuits
Prior art date
Application number
TW083106616A
Other languages
English (en)
Inventor
Robert H Murphy
Maston, Iii
Original Assignee
Murphy R H Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22479383&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW243546(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Murphy R H Co Inc filed Critical Murphy R H Co Inc
Application granted granted Critical
Publication of TW243546B publication Critical patent/TW243546B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/821—Stacking member

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Stackable Containers (AREA)
TW083106616A 1993-10-15 1994-07-18 Tray for ball terminal integrated circuits TW243546B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08137864 US5400904C1 (en) 1993-10-15 1993-10-15 Tray for ball terminal integrated circuits

Publications (1)

Publication Number Publication Date
TW243546B true TW243546B (en) 1995-03-21

Family

ID=22479383

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083106616A TW243546B (en) 1993-10-15 1994-07-18 Tray for ball terminal integrated circuits

Country Status (6)

Country Link
US (1) US5400904C1 (zh)
JP (1) JP2852872B2 (zh)
KR (1) KR0166983B1 (zh)
GB (1) GB2282798B (zh)
MY (1) MY112372A (zh)
TW (1) TW243546B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7059476B2 (en) 2000-03-16 2006-06-13 Kabushiki Kaisha Toshiba Tray for electronic parts

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JP2688664B2 (ja) * 1994-09-07 1997-12-10 シノン電気産業株式会社 半導体デバイス用トレー
US5636745A (en) * 1994-10-27 1997-06-10 Illinois Tool Works Inc. Tray for a component and an apparatus for accurately placing a component within the tray
US5634559A (en) * 1995-07-27 1997-06-03 Plastofilm Industries, Inc. Package tray having reversible nesting and enclosing fastening feature
US5833472A (en) * 1995-07-27 1998-11-10 The Whitaker Corporation Socket assembly for an electronic package
US5758776A (en) * 1996-09-12 1998-06-02 Kinetrix, Inc. Integrated circuit tray with flexural bearings
US5794783A (en) 1996-12-31 1998-08-18 Intel Corporation Die-level burn-in and test flipping tray
US5791486A (en) * 1997-01-07 1998-08-11 Fluoroware, Inc. Integrated circuit tray with self aligning pocket
IE970135A1 (en) * 1997-03-03 1998-09-09 Ranleigh Limited Packaging
US6036023A (en) * 1997-07-10 2000-03-14 Teradyne, Inc. Heat-transfer enhancing features for semiconductor carriers and devices
US6002591A (en) * 1997-07-30 1999-12-14 Intel Corporation Printed circuit board mounting assembly and a method for mounting an integrated circuit device
US6164999A (en) * 1997-07-30 2000-12-26 Intel Corporation Zero insertion force socket and method for employing same to mount a processor
US5971156A (en) * 1997-09-05 1999-10-26 Kinetrix, Inc. Semiconductor chip tray with rolling contact retention mechanism
DE29717254U1 (de) * 1997-09-26 1997-12-18 Isl Schaumstoff Technik Gmbh Eine vor Bruch schützende Verpackung für mit Wafern bestückte Waferboxen
US5878890A (en) * 1997-09-30 1999-03-09 Kaneko Denki Kabushiki Kaisha Carrier tape
US5848703A (en) * 1997-10-20 1998-12-15 R. H. Murphy Co., Inc. Tray for integrated circuits
JP3967010B2 (ja) 1997-11-14 2007-08-29 シャープ株式会社 包装トレイ
US6082547A (en) * 1998-03-27 2000-07-04 Fluoroware, Inc. Adapter jig
US5957293A (en) * 1998-05-04 1999-09-28 Advanced Micro Devices, Inc. Tray to ship ceramic substrates and ceramic BGA packages
US7191512B2 (en) * 1998-09-29 2007-03-20 Applied Kinetics, Inc. Tray system for holding and positioning components
US6202847B1 (en) * 1999-01-19 2001-03-20 Design Ideas, Ltd. Stackable boxes
JP3771084B2 (ja) * 1999-04-30 2006-04-26 Ｎｅｃエレクトロニクス株式会社 半導体集積回路装置用トレイ
US6176066B1 (en) * 1999-05-10 2001-01-23 St Assembly Test Services Pte Ltd. Hook and loop fastener strapping for semiconductor carrying trays
JP3247662B2 (ja) * 1999-05-17 2002-01-21 信越ポリマー株式会社 キャリアテープ
JP4446260B2 (ja) 1999-05-21 2010-04-07 株式会社大川金型設計事務所 半導体素子収納用トレイ
US6568535B1 (en) 2000-01-14 2003-05-27 Peak International Ltd. Apparatus and methods for improving uniform cover tape adhesion on a carrier tape
US6474475B1 (en) * 2000-02-22 2002-11-05 Micron Technology, Inc. Apparatus for handling stacked integrated circuit devices
US6713854B1 (en) 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US6264037B1 (en) 2000-04-27 2001-07-24 R. H. Murphy Co., Inc. Tray for ball grid array integrated circuit
US7337522B2 (en) * 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
SG96189A1 (en) * 2000-11-16 2003-05-23 Ono Hirokazu Semiconductor device housing tray
MY130407A (en) 2000-12-01 2007-06-29 Texchem Pack M Sdn Bhd Tray for storing semiconductor chips
EP1378152A4 (en) * 2001-03-14 2006-02-01 Legacy Electronics Inc METHOD AND DEVICE FOR PREPARING A PCB WITH A THREE-DIMENSIONAL ARRAY OF SEMICONDUCTOR CHIPS USED ON THE SURFACE
US6762487B2 (en) 2001-04-19 2004-07-13 Simpletech, Inc. Stack arrangements of chips and interconnecting members
US20030067082A1 (en) * 2001-05-25 2003-04-10 Mark Moshayedi Apparatus and methods for stacking integrated circuit devices with interconnected stacking structure
US20030040166A1 (en) * 2001-05-25 2003-02-27 Mark Moshayedi Apparatus and method for stacking integrated circuits
US6628132B2 (en) 2001-08-10 2003-09-30 Teradyne, Inc. Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques
US6860741B2 (en) * 2002-07-30 2005-03-01 Avx Corporation Apparatus and methods for retaining and placing electrical components
US6851954B2 (en) 2002-07-30 2005-02-08 Avx Corporation Electrical connectors and electrical components
US6928727B2 (en) 2002-07-30 2005-08-16 Avx Corporation Apparatus and method for making electrical connectors
JP4116851B2 (ja) * 2002-09-19 2008-07-09 富士通株式会社 電子部品の処理方法及び電子部品用治具
TWI237356B (en) 2002-11-04 2005-08-01 Siliconware Precision Industries Co Ltd Tray for ball grid array semiconductor packages
WO2004049334A1 (en) * 2002-11-25 2004-06-10 Sae Magnetics (H.K.) Ltd. An exchange method and mechanism for a component of the magnetic head and the suspension or the head gimbal assembly of the hard disk driver during manufacture
US6868970B2 (en) * 2003-04-16 2005-03-22 Illinois Tool Works Inc. Stackable tray for integrated circuits with corner support elements and lateral support elements forming matrix tray capture system
US20050077205A1 (en) * 2003-10-08 2005-04-14 Pylant James D. Tray with flat bottom reference surface
US7360653B2 (en) * 2004-04-02 2008-04-22 Hutchinson Technology Incorporated Packaging tray for disk drive head suspension assemblies
US7410060B2 (en) * 2004-06-02 2008-08-12 Illinois Tool Works Inc. Stackable tray for integrated circuit chips
JP4429823B2 (ja) * 2004-06-28 2010-03-10 富士通株式会社 半導体装置用トレイ
US20060070894A1 (en) * 2004-08-19 2006-04-06 Bradley Scott C Invertible and adjustable tray
JP4063805B2 (ja) 2004-09-10 2008-03-19 松下電器産業株式会社 収納トレイおよび収納装置
WO2006076381A2 (en) * 2005-01-12 2006-07-20 Legacy Electronics, Inc. Radial circuit board, system, and methods
KR100730145B1 (ko) * 2005-09-02 2007-06-19 삼성에스디아이 주식회사 디스플레이 모듈용 포장 조립체
US20070054524A1 (en) * 2005-09-02 2007-03-08 Hyun-Ye Lee Packing module and packing assembly comprising the same
US20070215517A1 (en) * 2006-03-16 2007-09-20 Fci Americas Technology, Inc. Tray for component packaging
US7435099B2 (en) * 2006-12-21 2008-10-14 Cinch Connectors, Inc. Electrical connector and packaging assembly
US7891486B2 (en) * 2006-12-26 2011-02-22 Nihon Dempa Kogyo Co., Ltd. Shipping tray for optical elements, and optical element shipped therein
US20080173569A1 (en) * 2007-01-23 2008-07-24 Illinois Tool Works Inc. Pedestal pocket tray containment system for integrated circuit chips
KR101287582B1 (ko) * 2008-07-07 2013-07-19 삼성테크윈 주식회사 칩 마운터 및 칩 마운터의 ｂｇａ 패키지 인식 방법
US20110089079A1 (en) * 2009-10-18 2011-04-21 Yu-Nan Lo Chip Carrying Tray
US8887920B2 (en) * 2011-10-11 2014-11-18 Sunlink Corporation Photovoltaic module carrier
US9082799B2 (en) * 2012-09-20 2015-07-14 Varian Semiconductor Equipment Associates, Inc. System and method for 2D workpiece alignment
CN103928407A (zh) * 2013-01-15 2014-07-16 西安永电电气有限责任公司 一次焊接倒封装工装结构
CN103950616A (zh) * 2014-05-15 2014-07-30 国网上海市电力公司 一种兼容终端和集中器的周转箱
CN105667949B (zh) * 2016-04-15 2018-07-03 武汉华星光电技术有限公司 液晶面板包装箱
US10189601B2 (en) * 2017-03-16 2019-01-29 Caterpillar Inc. Adjustable pallet
JP2018202271A (ja) * 2017-05-30 2018-12-27 日本電産株式会社 洗浄用保持具
US10046884B1 (en) * 2017-05-31 2018-08-14 Lean Manufacturing Products, Inc. Returnable shipping cartridge and rack
WO2022204588A1 (en) * 2021-03-26 2022-09-29 Bae Systems Information And Electronic Systems Integration Inc. Clip and lid system for a chip tray
EP4092721A1 (en) * 2021-05-21 2022-11-23 STMicroelectronics S.r.l. Containment and transportation tray for electronic components having small dimensions and low weight

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US5080228A (en) * 1990-12-27 1992-01-14 R. H. Murphy Co., Inc. Integral carrier and system for electrical components
GB2264696B (en) * 1992-02-28 1995-10-04 Murphy R H Co Inc Tray for integrated circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7059476B2 (en) 2000-03-16 2006-06-13 Kabushiki Kaisha Toshiba Tray for electronic parts

Also Published As

Publication number Publication date
GB2282798B (en) 1997-05-07
KR0166983B1 (ko) 1999-02-01
KR950012669A (ko) 1995-05-16
MY112372A (en) 2001-05-31
US5400904C1 (en) 2001-01-16
JP2852872B2 (ja) 1999-02-03
JPH07112785A (ja) 1995-05-02
GB9414470D0 (en) 1994-09-07
US5400904A (en) 1995-03-28
GB2282798A (en) 1995-04-19

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Legal Events

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