DE29717254U1 - Eine vor Bruch schützende Verpackung für mit Wafern bestückte Waferboxen - Google Patents

Eine vor Bruch schützende Verpackung für mit Wafern bestückte Waferboxen

Info

Publication number
DE29717254U1
DE29717254U1 DE29717254U DE29717254U DE29717254U1 DE 29717254 U1 DE29717254 U1 DE 29717254U1 DE 29717254 U DE29717254 U DE 29717254U DE 29717254 U DE29717254 U DE 29717254U DE 29717254 U1 DE29717254 U1 DE 29717254U1
Authority
DE
Germany
Prior art keywords
wafers
break
proof packaging
wafer boxes
boxes equipped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29717254U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ISL Schaumstoff Technik GmbH
Original Assignee
ISL Schaumstoff Technik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ISL Schaumstoff Technik GmbH filed Critical ISL Schaumstoff Technik GmbH
Priority to DE29717254U priority Critical patent/DE29717254U1/de
Publication of DE29717254U1 publication Critical patent/DE29717254U1/de
Priority to DE29722658U priority patent/DE29722658U1/de
Priority to US09/076,652 priority patent/US6131739A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
DE29717254U 1997-09-26 1997-09-26 Eine vor Bruch schützende Verpackung für mit Wafern bestückte Waferboxen Expired - Lifetime DE29717254U1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE29717254U DE29717254U1 (de) 1997-09-26 1997-09-26 Eine vor Bruch schützende Verpackung für mit Wafern bestückte Waferboxen
DE29722658U DE29722658U1 (de) 1997-09-26 1997-12-29 Eine vor Bruch schützende Verpackung für mit Wafern bestückte Waferboxen
US09/076,652 US6131739A (en) 1997-09-26 1998-05-12 Fracture-proof container for wafer discs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29717254U DE29717254U1 (de) 1997-09-26 1997-09-26 Eine vor Bruch schützende Verpackung für mit Wafern bestückte Waferboxen

Publications (1)

Publication Number Publication Date
DE29717254U1 true DE29717254U1 (de) 1997-12-18

Family

ID=8046512

Family Applications (2)

Application Number Title Priority Date Filing Date
DE29717254U Expired - Lifetime DE29717254U1 (de) 1997-09-26 1997-09-26 Eine vor Bruch schützende Verpackung für mit Wafern bestückte Waferboxen
DE29722658U Expired - Lifetime DE29722658U1 (de) 1997-09-26 1997-12-29 Eine vor Bruch schützende Verpackung für mit Wafern bestückte Waferboxen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE29722658U Expired - Lifetime DE29722658U1 (de) 1997-09-26 1997-12-29 Eine vor Bruch schützende Verpackung für mit Wafern bestückte Waferboxen

Country Status (2)

Country Link
US (1) US6131739A (de)
DE (2) DE29717254U1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040098949A1 (en) * 2002-11-21 2004-05-27 Taiwan Semiconductor Manufacturing Co., Ltd Packaging method for wafers
DE102004063912B4 (de) * 2004-04-22 2007-09-20 Siltronic Ag Verfahren zum versandfertigen Verpacken von Halbleiterscheiben
DE102004019664B4 (de) * 2004-04-22 2006-02-02 Siltronic Ag Versandfertige Verpackung für Halbleiterscheiben
US20070289896A1 (en) * 2006-06-19 2007-12-20 International Business Machines Corporation Method for packaging contamination vulnerable articles and package therefore
JP4947410B2 (ja) * 2006-10-10 2012-06-06 株式会社Ｓｕｍｃｏ カセットケース梱包用緩衝体
JP6119287B2 (ja) * 2013-02-14 2017-04-26 株式会社Sumco ウェーハ収納容器梱包用緩衝材
US10299792B2 (en) 2014-04-16 2019-05-28 Ethicon Llc Fastener cartridge comprising non-uniform fasteners
CN109037125A (zh) * 2018-08-22 2018-12-18 盐城大丰阿特斯阳光电力科技有限公司 料盒

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3191791A (en) * 1961-05-22 1965-06-29 Expandolite Inc Container
US5203452A (en) * 1992-03-13 1993-04-20 Illinois Tool Works, Inc. Shipping tray
JPH0736345B2 (ja) * 1992-11-11 1995-04-19 山一電機株式会社 リードフリー形ｉｃキャリア
US5400904C1 (en) * 1993-10-15 2001-01-16 Murphy R H Co Inc Tray for ball terminal integrated circuits
US5366080A (en) * 1993-10-21 1994-11-22 Seagate Technology, Inc. Molded ridge tolerance compensator
JP2803567B2 (ja) * 1994-05-11 1998-09-24 信越半導体株式会社 半導体ウエーハ収納容器の梱包構造体
US5418692A (en) * 1994-08-22 1995-05-23 Shinon Denkisangyo Kabushiki-Kaisha Tray for semiconductor devices
US5875896A (en) * 1996-11-05 1999-03-02 Taiwan Semiconductor Manufacturing Company, Ltd. Unified semiconductor wafer packaging system to unify irregular shape buffer materials
US5794783A (en) * 1996-12-31 1998-08-18 Intel Corporation Die-level burn-in and test flipping tray
US5791486A (en) * 1997-01-07 1998-08-11 Fluoroware, Inc. Integrated circuit tray with self aligning pocket

Also Published As

Publication number Publication date
DE29722658U1 (de) 1998-03-12
US6131739A (en) 2000-10-17

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19980205

R156 Lapse of ip right after 3 years

Effective date: 20010601