US20110089079A1 - Chip Carrying Tray - Google Patents

Chip Carrying Tray Download PDF

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Publication number
US20110089079A1
US20110089079A1 US12/581,148 US58114809A US2011089079A1 US 20110089079 A1 US20110089079 A1 US 20110089079A1 US 58114809 A US58114809 A US 58114809A US 2011089079 A1 US2011089079 A1 US 2011089079A1
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US
United States
Prior art keywords
chip
carrying
chip carrying
stopping walls
carrying tray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/581,148
Inventor
Yu-Nan Lo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanya Technology Corp
Original Assignee
Nanya Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanya Technology Corp filed Critical Nanya Technology Corp
Priority to US12/581,148 priority Critical patent/US20110089079A1/en
Assigned to NAN YA TECHNOLOGY CORPORATION reassignment NAN YA TECHNOLOGY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LO, YU-NAN
Publication of US20110089079A1 publication Critical patent/US20110089079A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips

Definitions

  • the present invention relates to a semiconductor carrying device; and more particularly to a chip carrying tray.
  • a conventional chip carrying tray A comprises plural matrix-arranged carrying portions A 1 .
  • Each of the carrying portions A 1 includes four stopping walls A 2 around a periphery thereof. Chips X are placed in the respective carrying portions A 1 and restricted by the stopping walls A 2 . Further, each of the carrying portions A 1 is defined with a through hole A 3 for discharge of moisture from the chip carrying tray A to keep the chips X in the chip carrying tray A dry.
  • each of the chips X includes plural solder balls X 1 on a bottom thereof, when the chips X are placed on the respective carrying portions A 1 , the solder balls X 1 will be brought into contact with the through holes A 3 of the carrying portions A 1 , and thus the edges of the through holes A 3 are likely to scratch or damage the solder balls X 1 .
  • another conventional chip carrying tray B comprises plural funnel-shaped carrying portions, and each of the funnel-shaped carrying portions includes four inclined surfaces B 1 and a through hole B 2 , so that the carrying tray B can also have a ventilation function, and the chips X will not be brought into contact with the edges of the through holes B 2 , thus avoiding the occurrence of scratch and damage to the solder balls X 1 .
  • the carrying portions are funnel-shaped and non-planar, so that the chips X must be moved with much carefulness in order to be stably placed on the carrying portions, or else they are prone to inclining and scratching the solder balls X 1 of the chips X.
  • the present invention has arisen to mitigate and/or obviate the afore-described disadvantages.
  • the primary objective of the present invention is to provide a chip carrying tray which can stably carry the chips and substantially discharge the moisture to keep the chips dry.
  • a chip carrying tray in accordance with the present invention comprises plural matrix-arranged carrying portions.
  • Each of the carrying portions is used to carry one chip and provided with two opposite first stopping walls and two opposite second stopping walls.
  • the first and the second stopping walls are alternately arranged.
  • Each of the second stopping walls is defined with a through hole.
  • the stopping walls are used to restrict the slippage of the chips, and the through holes of the stopping walls serve as the channels for discharging the moisture of the chip carrying tray to keep the chips dry.
  • FIG. 1 is a perspective view of a conventional chip carrying tray
  • FIG. 2 is a lateral cross-sectional view of the conventional chip carrying tray of FIG. 1 ;
  • FIG. 3 is a lateral cross-sectional view of another conventional chip carrying tray
  • FIG. 4 is a perspective view of a chip carrying tray in accordance with the present invention.
  • FIG. 5 is a perspective view of the chip carrying tray in accordance with the present invention.
  • FIG. 6 is a lateral view showing that the through holes of the second stopping walls are defined in a direction parallel to the respective carrying portions in accordance with the present invention
  • FIG. 7 is a lateral view showing how the chip carrying trays in accordance with the present invention are piled up one upon another;
  • FIG. 8 is a lateral cross-sectional view showing that the chip carrying tray in accordance with the present invention is formed with a base
  • FIG. 9 is a lateral cross-sectional view showing that how the chip carrying trays formed with the base are piled up one upon another.
  • a chip carrying tray 100 in accordance with a preferred embodiment of the present invention comprises plural matrix-arranged carrying portions 10 .
  • Each of the carrying portions 10 is rectangular and flat and provided for carrying one chip X.
  • Each of the carrying portions 10 is further provided with two opposite first stopping walls 20 and two opposite second stopping walls 30 around a periphery thereof.
  • the first stopping walls 20 and the second stopping walls 30 are alternately arranged, and the first stopping walls 20 are higher than the respective second stopping walls 30 .
  • Each of the second stopping walls 30 is further defined with a through hole 31 in a direction vertical to the carrying portion 10 , and each four connected carrying portions 10 define a through hole 40 therebetween.
  • the chip carrying tray 100 can carry plural chips X.
  • the chips X can be stably placed on the flat carrying portions 10 .
  • the stopping walls 20 , 30 are used to restrict the chips X in the respective carrying portions 10 .
  • the through holes 31 of the respective second stopping walls 30 and the through holes 40 between the respective carrying portions 10 serve as air channels to allow the moisture to be discharged from the respective through holes 31 , 40 , keeping the respective chips X dry.
  • the through holes 31 of the respective second stopping walls 30 can also be defined in the direction parallel to the respective carrying portions 10 to achieve the same function as described above.
  • the first stopping walls 20 of the chip carrying tray 100 are as high as the second stopping walls 30 , and the chip carrying tray 100 is further formed with a base 50 around an outer periphery thereof.
  • the base 50 includes a piling space 51 in a bottom thereof.
  • the base 50 is formed with a protruding ear at one side thereof, so that the user can move the chip carrying tray 100 conveniently.

Abstract

A chip carrying tray comprises plural rectangular flat carrying portions for carrying plural chips. Each of the carrying portions is provided with stopping walls for restricting the slippage of the chip. The stopping walls are defined with through holes for discharging moisture of the chip carrying tray. By such arrangements, the chip carrying tray can stably carry the chips and substantially keep the chips dry.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a semiconductor carrying device; and more particularly to a chip carrying tray.
  • 2. Description of the Prior Art
  • Referring to FIGS. 1-2, a conventional chip carrying tray A comprises plural matrix-arranged carrying portions A1. Each of the carrying portions A1 includes four stopping walls A2 around a periphery thereof. Chips X are placed in the respective carrying portions A1 and restricted by the stopping walls A2. Further, each of the carrying portions A1 is defined with a through hole A3 for discharge of moisture from the chip carrying tray A to keep the chips X in the chip carrying tray A dry. However, each of the chips X includes plural solder balls X1 on a bottom thereof, when the chips X are placed on the respective carrying portions A1, the solder balls X1 will be brought into contact with the through holes A3 of the carrying portions A1, and thus the edges of the through holes A3 are likely to scratch or damage the solder balls X1.
  • Referring to FIG. 3, another conventional chip carrying tray B comprises plural funnel-shaped carrying portions, and each of the funnel-shaped carrying portions includes four inclined surfaces B1 and a through hole B2, so that the carrying tray B can also have a ventilation function, and the chips X will not be brought into contact with the edges of the through holes B2, thus avoiding the occurrence of scratch and damage to the solder balls X1. However, the carrying portions are funnel-shaped and non-planar, so that the chips X must be moved with much carefulness in order to be stably placed on the carrying portions, or else they are prone to inclining and scratching the solder balls X1 of the chips X.
  • The present invention has arisen to mitigate and/or obviate the afore-described disadvantages.
    • SUMMARY OF THE INVENTION
  • The primary objective of the present invention is to provide a chip carrying tray which can stably carry the chips and substantially discharge the moisture to keep the chips dry.
  • In order to achieve the above objective, a chip carrying tray in accordance with the present invention comprises plural matrix-arranged carrying portions. Each of the carrying portions is used to carry one chip and provided with two opposite first stopping walls and two opposite second stopping walls. The first and the second stopping walls are alternately arranged. Each of the second stopping walls is defined with a through hole.
  • The stopping walls are used to restrict the slippage of the chips, and the through holes of the stopping walls serve as the channels for discharging the moisture of the chip carrying tray to keep the chips dry.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of a conventional chip carrying tray;
  • FIG. 2 is a lateral cross-sectional view of the conventional chip carrying tray of FIG. 1;
  • FIG. 3 is a lateral cross-sectional view of another conventional chip carrying tray;
  • FIG. 4 is a perspective view of a chip carrying tray in accordance with the present invention;
  • FIG. 5 is a perspective view of the chip carrying tray in accordance with the present invention;
  • FIG. 6 is a lateral view showing that the through holes of the second stopping walls are defined in a direction parallel to the respective carrying portions in accordance with the present invention;
  • FIG. 7 is a lateral view showing how the chip carrying trays in accordance with the present invention are piled up one upon another;
  • FIG. 8 is a lateral cross-sectional view showing that the chip carrying tray in accordance with the present invention is formed with a base; and
  • FIG. 9 is a lateral cross-sectional view showing that how the chip carrying trays formed with the base are piled up one upon another.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The present invention will be clearer from the following description when viewed together with the accompanying drawings, which show, for purpose of illustrations only, the preferred embodiment in accordance with the present invention.
  • Referring to FIGS. 4-7, a chip carrying tray 100 in accordance with a preferred embodiment of the present invention comprises plural matrix-arranged carrying portions 10. Each of the carrying portions 10 is rectangular and flat and provided for carrying one chip X. Each of the carrying portions 10 is further provided with two opposite first stopping walls 20 and two opposite second stopping walls 30 around a periphery thereof. The first stopping walls 20 and the second stopping walls 30 are alternately arranged, and the first stopping walls 20 are higher than the respective second stopping walls 30. Each of the second stopping walls 30 is further defined with a through hole 31 in a direction vertical to the carrying portion 10, and each four connected carrying portions 10 define a through hole 40 therebetween.
  • The chip carrying tray 100 can carry plural chips X. The chips X can be stably placed on the flat carrying portions 10. The stopping walls 20, 30 are used to restrict the chips X in the respective carrying portions 10. The through holes 31 of the respective second stopping walls 30 and the through holes 40 between the respective carrying portions 10 serve as air channels to allow the moisture to be discharged from the respective through holes 31, 40, keeping the respective chips X dry.
  • As shown in FIG. 6, the through holes 31 of the respective second stopping walls 30 can also be defined in the direction parallel to the respective carrying portions 10 to achieve the same function as described above.
  • When the chips X need carrying, plural chip carrying trays 100 will be piled up one upon another as shown in FIG. 7. When the plural chip carrying trays 100 are piled up, since the first stopping walls 20 are higher than the second stopping walls 30, a clearance D1 will be formed between each two neighboring chip carrying trays 100. The height of the clearance D1 equals the height difference between the first stopping walls 20 and the second stopping walls 30, so that after the chip carrying trays 100 are piled up, the clearances D1, the through holes 31 of the second stopping walls 30 and the though holes 40 can completely discharge the moisture. Therefore, even though the plural chip carrying tray 100 are piled up, the chips X in the chip carrying tray 100 can also be kept dry.
  • Further referring to FIGS. 8 and 9, the first stopping walls 20 of the chip carrying tray 100 are as high as the second stopping walls 30, and the chip carrying tray 100 is further formed with a base 50 around an outer periphery thereof. The base 50 includes a piling space 51 in a bottom thereof. When plural chip carrying trays 100 are piled up one upon another, one of each two neighboring chip carrying trays 100 will be partially disposed in the piling space 51 of the base 50 of the other of the two neighboring chip carrying trays 100, thus forming a ventilating space D2 between each two neighboring chip trays 100 to discharge moisture to keep the chips X dry. Further, the base 50 is formed with a protruding ear at one side thereof, so that the user can move the chip carrying tray 100 conveniently.
  • While we have shown and described various embodiments in accordance with the present invention, it is clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.

Claims (9)

1. A chip carrying tray comprising plural matrix-arranged carrying portions, each of the carrying portions being used to carry one chip and provided with two opposite first stopping walls and two opposite second stopping walls, the first and the second stopping walls being alternately arranged, each of the second stopping walls being defined with a through hole.
2. The chip carrying tray as claimed in claim 1, wherein the respective carrying portions are rectangular and flat.
3. The chip carrying tray as claimed in claim 1, wherein the through holes of the second stopping walls are defined in a direction vertical to the respective carrying portions.
4. The chip carrying tray as claimed in claim 1, wherein the through holes of the second stopping walls are defined in a direction parallel to respective carrying portions.
5. The chip carrying tray as claimed in claim 1, wherein the first stopping walls are higher than the second stopping walls.
6. The chip carrying tray as claimed in claim 1, wherein each four connected carrying portions define a through hole therebetween.
7. The chip carrying tray as claimed in claim 1, wherein the chip carrying tray is further formed with a base around an outer periphery thereof, and the base includes a piling space in a bottom thereof.
8. The chip carrying tray as claimed in claim 7, wherein when plural chip carrying trays are plied up one upon another, a ventilating space will be formed between each two neighboring chip carrying trays.
9. The chip carrying tray as claimed in claim 7, wherein the base is formed with a protruding ear at one side thereof.
US12/581,148 2009-10-18 2009-10-18 Chip Carrying Tray Abandoned US20110089079A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/581,148 US20110089079A1 (en) 2009-10-18 2009-10-18 Chip Carrying Tray

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/581,148 US20110089079A1 (en) 2009-10-18 2009-10-18 Chip Carrying Tray

Publications (1)

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US20110089079A1 true US20110089079A1 (en) 2011-04-21

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013017124A1 (en) * 2011-07-29 2013-02-07 Curamik Electronics Gmbh Packaging for substrates and packaging unit having such packaging
US20130032508A1 (en) * 2010-05-06 2013-02-07 Shinon Corporation Tray for semiconductor integrated circuits
US20130089403A1 (en) * 2011-10-07 2013-04-11 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for holding a plurality of substrates for processing
US20140291340A1 (en) * 2013-03-28 2014-10-02 Keihin Corporation Resin casing
US20170162411A1 (en) * 2015-12-03 2017-06-08 Nanya Technology Corporation Tray
US10309012B2 (en) * 2014-07-03 2019-06-04 Tesla, Inc. Wafer carrier for reducing contamination from carbon particles and outgassing
US10672919B2 (en) 2017-09-19 2020-06-02 Tesla, Inc. Moisture-resistant solar cells for solar roof tiles
US11190128B2 (en) 2018-02-27 2021-11-30 Tesla, Inc. Parallel-connected solar roof tile modules

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3640379A (en) * 1970-02-26 1972-02-08 Marshall L Weingarden Cassette album
US3651976A (en) * 1970-04-01 1972-03-28 Keyes Fibre Co Molded packaging tray
US3667647A (en) * 1969-03-26 1972-06-06 Plastic Ind Van Daalen Nv Holder for a number of associated individual containers
US4207980A (en) * 1978-03-01 1980-06-17 Slidex Corporation Slide file sheet
US5022183A (en) * 1989-07-31 1991-06-11 Kord Products Limited Flower pot carrying tray with restraining means for plural pots
US5109981A (en) * 1990-03-19 1992-05-05 R. H. Murphy Company, Inc. Carrier and carrier system for flatpack integrated circuits
US5400904A (en) * 1993-10-15 1995-03-28 R. H. Murphy Co., Inc. Tray for ball terminal integrated circuits
US6036023A (en) * 1997-07-10 2000-03-14 Teradyne, Inc. Heat-transfer enhancing features for semiconductor carriers and devices
US6179127B1 (en) * 1996-10-18 2001-01-30 Shin-Etsu Polymer Co., Ltd. Carrier tape and die apparatus for forming same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3667647A (en) * 1969-03-26 1972-06-06 Plastic Ind Van Daalen Nv Holder for a number of associated individual containers
US3640379A (en) * 1970-02-26 1972-02-08 Marshall L Weingarden Cassette album
US3651976A (en) * 1970-04-01 1972-03-28 Keyes Fibre Co Molded packaging tray
US4207980A (en) * 1978-03-01 1980-06-17 Slidex Corporation Slide file sheet
US5022183A (en) * 1989-07-31 1991-06-11 Kord Products Limited Flower pot carrying tray with restraining means for plural pots
US5109981A (en) * 1990-03-19 1992-05-05 R. H. Murphy Company, Inc. Carrier and carrier system for flatpack integrated circuits
US5400904A (en) * 1993-10-15 1995-03-28 R. H. Murphy Co., Inc. Tray for ball terminal integrated circuits
US5400904C1 (en) * 1993-10-15 2001-01-16 Murphy R H Co Inc Tray for ball terminal integrated circuits
US6179127B1 (en) * 1996-10-18 2001-01-30 Shin-Etsu Polymer Co., Ltd. Carrier tape and die apparatus for forming same
US6036023A (en) * 1997-07-10 2000-03-14 Teradyne, Inc. Heat-transfer enhancing features for semiconductor carriers and devices

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130032508A1 (en) * 2010-05-06 2013-02-07 Shinon Corporation Tray for semiconductor integrated circuits
KR101554088B1 (en) * 2011-07-29 2015-09-17 로저스 저매니 게엠베하 Packaging for substrates and packaging unit having such packaging
JP2014514222A (en) * 2011-07-29 2014-06-19 キュラミーク エレクトロニクス ゲーエムベーハー Packaging for substrates and packaging units comprising such packaging
US9054143B2 (en) 2011-07-29 2015-06-09 Rogers Germany Gmbh Packaging for substrates and packaging unit having such packaging
WO2013017124A1 (en) * 2011-07-29 2013-02-07 Curamik Electronics Gmbh Packaging for substrates and packaging unit having such packaging
DE102012106087B4 (en) * 2011-07-29 2015-10-22 Rogers Germany Gmbh Packaging unit for substrates
US20130089403A1 (en) * 2011-10-07 2013-04-11 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for holding a plurality of substrates for processing
US9218990B2 (en) * 2011-10-07 2015-12-22 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for holding a plurality of substrates for processing
US20140291340A1 (en) * 2013-03-28 2014-10-02 Keihin Corporation Resin casing
US9532470B2 (en) * 2013-03-28 2016-12-27 Keihin Corporation Resin casing
US10309012B2 (en) * 2014-07-03 2019-06-04 Tesla, Inc. Wafer carrier for reducing contamination from carbon particles and outgassing
US20170162411A1 (en) * 2015-12-03 2017-06-08 Nanya Technology Corporation Tray
US10672919B2 (en) 2017-09-19 2020-06-02 Tesla, Inc. Moisture-resistant solar cells for solar roof tiles
US11190128B2 (en) 2018-02-27 2021-11-30 Tesla, Inc. Parallel-connected solar roof tile modules

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Legal Events

Date Code Title Description
AS Assignment

Owner name: NAN YA TECHNOLOGY CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LO, YU-NAN;REEL/FRAME:024926/0548

Effective date: 20100827

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION