US20140339235A1 - Materials tray - Google Patents

Materials tray Download PDF

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Publication number
US20140339235A1
US20140339235A1 US14/280,378 US201414280378A US2014339235A1 US 20140339235 A1 US20140339235 A1 US 20140339235A1 US 201414280378 A US201414280378 A US 201414280378A US 2014339235 A1 US2014339235 A1 US 2014339235A1
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US
United States
Prior art keywords
materials
holding surface
receiving
receiving portion
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/280,378
Inventor
Tao Zhao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ZHAO, TAO
Publication of US20140339235A1 publication Critical patent/US20140339235A1/en
Abandoned legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D1/00Containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material, by deep-drawing operations performed on sheet material
    • B65D1/34Trays or like shallow containers
    • B65D1/36Trays or like shallow containers with moulded compartments or partitions

Definitions

  • Embodiments of the present disclosure relate to a materials tray for holding materials of a production line.
  • Materials trays are widely used to hold materials such as printed circuit boards in a production line.
  • a materials tray can include a plurality of recessed grooves for receiving materials. Each groove has a shape matching the shapes of the materials to be received and the groove is close-fitting around the material.
  • FIG. 1 is a schematic view of a materials tray including a plurality of receiving grooves.
  • FIG. 2 is similar to FIG. 1 , but viewed from another angle.
  • FIG. 3 is similar to FIG. 2 , but viewed from a reverse angle.
  • FIG. 4 is an enlarged view of receiving grooves of the materials tray of FIG. 1 .
  • FIG. 5 is schematic view of the receiving grooves of FIG. 4 with materials received therein.
  • a materials tray 100 can be used in a production line for holding different materials, such as a first material 201 , a second material 202 , and a third material 203 , all having different dimensions.
  • the materials 201 , 202 , 203 are printed circuit boards (PCB).
  • the materials tray 100 includes a main body 10 , a plurality of receiving grooves 20 located on the main body 10 , and a plurality of spacing portions 30 .
  • Each spacing portion 30 is located between two adjacent receiving grooves 20 to separate the two adjacent receiving grooves 20 from each other.
  • a number of the spacing portions 30 are equal to a number of the receiving grooves 20 minus one.
  • the main body 10 is substantially rectangular.
  • the main body 10 includes an upper surface 15 ( FIG. 1 ) and a bottom surface 16 ( FIG. 3 ) opposite to the upper surface 15 .
  • the first, second, third, and fourth sidewalls 11 , 12 , 13 , 14 are connected in turn to form an enclosure.
  • At least one recess portion 17 is defined on one or more of the first, second, third, and fourth sidewalls 11 , 12 , 13 , 14 , to facilitate handling of the materials tray 100 .
  • a connection portion between the first sidewall 11 and the fourth side wall 14 is recessed towards the enclosure to form an identification portion 18 .
  • the identification portion 18 identifies an orientation of the materials tray 100 .
  • one materials tray 100 can be interleaved with another materials tray 100 .
  • a plurality of materials trays 100 can be piled together. When the plurality of materials trays 100 are perpendicularly piled, the identification portions 18 of each of the materials trays 100 are in a single vertical line.
  • each of the receiving grooves 20 is recessed from the top surface 15 towards the bottom surface 16 .
  • Each receiving groove 20 includes a first receiving portion 21 , a second receiving portion 22 , and a third receiving portion 13 respectively configured for receiving the first, second, and third materials 201 , 202 , 203 .
  • the first receiving portion 21 includes a first holding surface 211 having a first height and a first positioning side 212 located on the first holding surface 211 .
  • the first holding surface 211 is configured to hold the first material 201 in place when the first material 201 is received in the first receiving portion 21 .
  • the first positioning side 212 is configured to limit any movement of the first material 201 within the first receiving portion 21 .
  • the second receiving portion 22 includes a second holding surface 221 having a second height and a second positioning side 222 located on the second holding surface 221 .
  • the second holding surface 221 adjoins the first holding surface 211 and the second height is greater than the first height.
  • the second holding surface 221 is configured to hold the second material 202 in place when the second material 202 is received in the second receiving portion 22 .
  • the second positioning side 222 is configured to limit any movement of the second material 202 within the second receiving portion 22 .
  • the third receiving portion 23 includes a third holding surface 231 having a third height and a third positioning side 232 located on the third holding surface 231 .
  • the third holding surface 231 adjoins the second holding surface 221 and the third height is greater than the second height.
  • the third holding surface 231 is configured to hold the third material 203 in place when the third material 203 is received in the third receiving portion 23 .
  • the third positioning side 232 is configured to limit any movement of the third material 203 within the third receiving portion 23 .
  • each spacing portion 30 is between two adjacent receiving grooves 20 to space materials respectively received in the two adjacent receiving grooves 20 .
  • the spacing portion 30 defines at least one gap 31 to make the two adjacent receiving grooves 20 communicate with each other via the at least one gap 31 , thereby facilitating the extraction of the materials from the receiving grooves 20 via the at least one gap 31 .
  • a height of the at least one gap 31 is equal to a height of the receiving groove 20 .

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pallets (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Stackable Containers (AREA)

Abstract

A materials tray for holding materials for a production line includes a main body, a plurality of receiving grooves located on the main body, and a plurality of spacing portions. Each spacing portion is between two adjacent receiving grooves to separate materials respectively received in the two adjacent receiving grooves, and each spacing portion defines at least one gap creating intercommunication between the two adjacent receiving grooves to ease extraction of the materials by the user.

Description

    FIELD
  • Embodiments of the present disclosure relate to a materials tray for holding materials of a production line.
  • BACKGROUND
  • Materials trays are widely used to hold materials such as printed circuit boards in a production line. A materials tray can include a plurality of recessed grooves for receiving materials. Each groove has a shape matching the shapes of the materials to be received and the groove is close-fitting around the material.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic view of a materials tray including a plurality of receiving grooves.
  • FIG. 2 is similar to FIG. 1, but viewed from another angle.
  • FIG. 3 is similar to FIG. 2, but viewed from a reverse angle.
  • FIG. 4 is an enlarged view of receiving grooves of the materials tray of FIG. 1.
  • FIG. 5 is schematic view of the receiving grooves of FIG. 4 with materials received therein.
  • DETAILED DESCRIPTION
  • The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.” The reference “a plurality of” means “at least two.”
  • Referring to FIGS. 1 to 3, a materials tray 100 can be used in a production line for holding different materials, such as a first material 201, a second material 202, and a third material 203, all having different dimensions. In this embodiment, the materials 201, 202, 203 are printed circuit boards (PCB).
  • The materials tray 100 includes a main body 10, a plurality of receiving grooves 20 located on the main body 10, and a plurality of spacing portions 30. Each spacing portion 30 is located between two adjacent receiving grooves 20 to separate the two adjacent receiving grooves 20 from each other. In this embodiment, a number of the spacing portions 30 are equal to a number of the receiving grooves 20 minus one.
  • The main body 10 is substantially rectangular. The main body 10 includes an upper surface 15 (FIG. 1) and a bottom surface 16 (FIG. 3) opposite to the upper surface 15. There is a first sidewall 11, a second sidewall 12, a third sidewall 13, and a fourth sidewall 14 perpendicularly connected between the upper surface 15 and the bottom surface 16. The first, second, third, and fourth sidewalls 11, 12, 13, 14 are connected in turn to form an enclosure. At least one recess portion 17 is defined on one or more of the first, second, third, and fourth sidewalls 11, 12, 13, 14, to facilitate handling of the materials tray 100. A connection portion between the first sidewall 11 and the fourth side wall 14 is recessed towards the enclosure to form an identification portion 18. The identification portion 18 identifies an orientation of the materials tray 100. In this embodiment, one materials tray 100 can be interleaved with another materials tray 100. Thus, a plurality of materials trays 100 can be piled together. When the plurality of materials trays 100 are perpendicularly piled, the identification portions 18 of each of the materials trays 100 are in a single vertical line.
  • Referring to FIG. 4 and FIG. 5, each of the receiving grooves 20 is recessed from the top surface 15 towards the bottom surface 16. Each receiving groove 20 includes a first receiving portion 21, a second receiving portion 22, and a third receiving portion 13 respectively configured for receiving the first, second, and third materials 201, 202, 203. The first receiving portion 21 includes a first holding surface 211 having a first height and a first positioning side 212 located on the first holding surface 211. The first holding surface 211 is configured to hold the first material 201 in place when the first material 201 is received in the first receiving portion 21. The first positioning side 212 is configured to limit any movement of the first material 201 within the first receiving portion 21.
  • The second receiving portion 22 includes a second holding surface 221 having a second height and a second positioning side 222 located on the second holding surface 221. The second holding surface 221 adjoins the first holding surface 211 and the second height is greater than the first height. The second holding surface 221 is configured to hold the second material 202 in place when the second material 202 is received in the second receiving portion 22. The second positioning side 222 is configured to limit any movement of the second material 202 within the second receiving portion 22.
  • The third receiving portion 23 includes a third holding surface 231 having a third height and a third positioning side 232 located on the third holding surface 231. The third holding surface 231 adjoins the second holding surface 221 and the third height is greater than the second height. The third holding surface 231 is configured to hold the third material 203 in place when the third material 203 is received in the third receiving portion 23. The third positioning side 232 is configured to limit any movement of the third material 203 within the third receiving portion 23.
  • In this embodiment, each spacing portion 30 is between two adjacent receiving grooves 20 to space materials respectively received in the two adjacent receiving grooves 20. The spacing portion 30 defines at least one gap 31 to make the two adjacent receiving grooves 20 communicate with each other via the at least one gap 31, thereby facilitating the extraction of the materials from the receiving grooves 20 via the at least one gap 31. A height of the at least one gap 31 is equal to a height of the receiving groove 20.
  • Although certain embodiments of the present disclosure have been specifically described, the present disclosure is not to be construed as being limited thereto. Various changes or modifications may be made to the present disclosure without departing from the scope thereof. The embodiments described herein are illustrative only, and are not intended to limit the scope of the following claims.

Claims (10)

What is claimed is:
1. A materials tray for holding materials, comprising:
a main body;
a plurality of receiving grooves located on the main body; and
a plurality of spacing portions;
wherein each spacing portion is between two adjacent receiving grooves to separate materials respectively received in the two adjacent receiving grooves, and each spacing portion defines at least one gap to make the two adjacent receiving grooves to communicate with each other via the at least one gap.
2. The materials tray according to claim 1, wherein the main body comprises an upper surface, a bottom surface opposite to the upper surface, and a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall perpendicularly connected between the upper surface and the bottom surface; the first, second, third, and fourth sidewalls are connected in turn to form an enclosure.
3. The materials tray according to claim 2, wherein at least one recess portion is defined on one or more of the first, second, third, and fourth sidewalls.
4. The materials tray according to claim 2, wherein a connection portion between the first sidewall and the fourth side wall is recessed towards the enclosure to form an identification portion to identify an orientation of the materials tray.
5. The materials tray according to claim 1, wherein each receiving groove comprises a first receiving portion and a second receiving portion respectively configured for receiving a first material and a second material having different dimensions.
6. The materials tray according to claim 5, wherein the first receiving portion comprises a first holding surface having a first height and a first positioning side located on the first holding surface; the first holding surface is configured to hold the first material in place when the first material is received in the first receiving portion, and the first positioning side is configured to limit any movement of the first material within the first receiving portion.
7. The materials tray according to claim 6, wherein the second receiving portion comprises a second holding surface having a second height and a second positioning side located on the second holding surface; the second holding surface is configured to hold the second material in place when the second material is received in the second receiving portion, and the second positioning side is configured to limit any movement of the second material within the second receiving portion.
8. The materials tray according to claim 7, wherein the second holding surface adjoins the first holding surface and the second height is greater than the first height.
9. The materials tray according to claim 8, wherein each receiving groove further comprises a third receiving portion configured for receiving a third material; the third receiving portion comprises a third holding surface having a third height and a third positioning side located on the third holding surface; the third holding surface is configured to hold the third material in place when the third material is received in the third receiving portion, and the third positioning side is configured to limit any movement of the third material within the third receiving portion.
10. The materials tray according to claim 9, wherein the third holding surface adjoins the second holding surface and the third height is greater than the second height.
US14/280,378 2013-05-17 2014-05-16 Materials tray Abandoned US20140339235A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2013202689715U CN203294461U (en) 2013-05-17 2013-05-17 Tray
CN2013202689715 2013-05-17

Publications (1)

Publication Number Publication Date
US20140339235A1 true US20140339235A1 (en) 2014-11-20

Family

ID=49570493

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/280,378 Abandoned US20140339235A1 (en) 2013-05-17 2014-05-16 Materials tray

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US (1) US20140339235A1 (en)
CN (1) CN203294461U (en)
TW (1) TWM472942U (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104469650A (en) * 2014-12-08 2015-03-25 惠州市联韵电子科技有限公司 Loudspeaker tray
TWI554443B (en) * 2014-12-18 2016-10-21 Usun Technology Co Ltd Workpiece carrying tray structure
CN108500534B (en) * 2017-02-24 2020-11-27 深圳市朗能电池有限公司 Clamp apparatus
CN114273954A (en) * 2021-12-22 2022-04-05 深圳灵创智能有限公司 Machining machine tool using tray for loading materials and automatic loading and unloading machining method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5791486A (en) * 1997-01-07 1998-08-11 Fluoroware, Inc. Integrated circuit tray with self aligning pocket
US6375408B1 (en) * 1996-12-31 2002-04-23 Intel Corporation Die-level burn-in and test flipping tray

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375408B1 (en) * 1996-12-31 2002-04-23 Intel Corporation Die-level burn-in and test flipping tray
US5791486A (en) * 1997-01-07 1998-08-11 Fluoroware, Inc. Integrated circuit tray with self aligning pocket

Also Published As

Publication number Publication date
CN203294461U (en) 2013-11-20
TWM472942U (en) 2014-02-21

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Date Code Title Description
AS Assignment

Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ZHAO, TAO;REEL/FRAME:032918/0064

Effective date: 20140507

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ZHAO, TAO;REEL/FRAME:032918/0064

Effective date: 20140507

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION