TW230272B - - Google Patents

Info

Publication number
TW230272B
TW230272B TW082103193A TW82103193A TW230272B TW 230272 B TW230272 B TW 230272B TW 082103193 A TW082103193 A TW 082103193A TW 82103193 A TW82103193 A TW 82103193A TW 230272 B TW230272 B TW 230272B
Authority
TW
Taiwan
Prior art keywords
encapsulant
chip carrier
composition
encapsulated
circuitized surface
Prior art date
Application number
TW082103193A
Other languages
English (en)
Chinese (zh)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW230272B publication Critical patent/TW230272B/zh

Links

Classifications

    • H10W74/121—
    • H10W72/071—
    • H10W74/012—
    • H10W74/15—
    • H10W74/47—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/856—
    • H10W72/877—
    • H10W90/724—
    • H10W90/734—
    • H10W90/736—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Dicing (AREA)
  • Paints Or Removers (AREA)
TW082103193A 1992-07-06 1993-04-26 TW230272B (env)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/909,368 US5249101A (en) 1992-07-06 1992-07-06 Chip carrier with protective coating for circuitized surface

Publications (1)

Publication Number Publication Date
TW230272B true TW230272B (env) 1994-09-11

Family

ID=25427125

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082103193A TW230272B (env) 1992-07-06 1993-04-26

Country Status (12)

Country Link
US (1) US5249101A (env)
EP (1) EP0578307B1 (env)
JP (1) JP2501287B2 (env)
KR (1) KR960015924B1 (env)
CN (1) CN1028937C (env)
AT (1) ATE143529T1 (env)
CA (1) CA2091910C (env)
DE (1) DE69305012T2 (env)
ES (1) ES2092216T3 (env)
MY (1) MY108750A (env)
SG (1) SG44362A1 (env)
TW (1) TW230272B (env)

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JP7358857B2 (ja) * 2019-09-04 2023-10-11 富士通株式会社 電子ユニット、電子ユニットの製造方法及び電子機器

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Also Published As

Publication number Publication date
JP2501287B2 (ja) 1996-05-29
CN1081787A (zh) 1994-02-09
MY108750A (en) 1996-11-30
EP0578307B1 (en) 1996-09-25
CA2091910A1 (en) 1994-01-07
ATE143529T1 (de) 1996-10-15
DE69305012T2 (de) 1997-04-03
ES2092216T3 (es) 1996-11-16
CA2091910C (en) 1996-07-30
DE69305012D1 (de) 1996-10-31
US5249101A (en) 1993-09-28
EP0578307A2 (en) 1994-01-12
KR960015924B1 (ko) 1996-11-23
EP0578307A3 (en) 1994-08-24
CN1028937C (zh) 1995-06-14
KR940002031A (ko) 1994-02-16
JPH0697309A (ja) 1994-04-08
SG44362A1 (en) 1997-12-19

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