MY108750A - Chip carrier with protective coating for circuitized surface - Google Patents
Chip carrier with protective coating for circuitized surfaceInfo
- Publication number
- MY108750A MY108750A MYPI93001105A MYPI19931105A MY108750A MY 108750 A MY108750 A MY 108750A MY PI93001105 A MYPI93001105 A MY PI93001105A MY PI19931105 A MYPI19931105 A MY PI19931105A MY 108750 A MY108750 A MY 108750A
- Authority
- MY
- Malaysia
- Prior art keywords
- encapsulant
- chip carrier
- circuitized surface
- composition
- cracks
- Prior art date
Links
Classifications
-
- H10W74/121—
-
- H10W72/071—
-
- H10W74/012—
-
- H10W74/15—
-
- H10W74/47—
-
- H10W72/07251—
-
- H10W72/20—
-
- H10W72/856—
-
- H10W72/877—
-
- H10W90/724—
-
- H10W90/734—
-
- H10W90/736—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Epoxy Resins (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Dicing (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/909,368 US5249101A (en) | 1992-07-06 | 1992-07-06 | Chip carrier with protective coating for circuitized surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY108750A true MY108750A (en) | 1996-11-30 |
Family
ID=25427125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI93001105A MY108750A (en) | 1992-07-06 | 1993-06-08 | Chip carrier with protective coating for circuitized surface |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US5249101A (env) |
| EP (1) | EP0578307B1 (env) |
| JP (1) | JP2501287B2 (env) |
| KR (1) | KR960015924B1 (env) |
| CN (1) | CN1028937C (env) |
| AT (1) | ATE143529T1 (env) |
| CA (1) | CA2091910C (env) |
| DE (1) | DE69305012T2 (env) |
| ES (1) | ES2092216T3 (env) |
| MY (1) | MY108750A (env) |
| SG (1) | SG44362A1 (env) |
| TW (1) | TW230272B (env) |
Families Citing this family (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04291948A (ja) * | 1991-03-20 | 1992-10-16 | Fujitsu Ltd | 半導体装置及びその製造方法及び放熱フィン |
| JPH0538479U (ja) * | 1991-10-25 | 1993-05-25 | 曙ブレーキ工業株式会社 | ブレーキ制御機構の電磁弁装置 |
| US5288944A (en) * | 1992-02-18 | 1994-02-22 | International Business Machines, Inc. | Pinned ceramic chip carrier |
| US5390082A (en) * | 1992-07-06 | 1995-02-14 | International Business Machines, Corp. | Chip carrier with protective coating for circuitized surface |
| KR100280762B1 (ko) * | 1992-11-03 | 2001-03-02 | 비센트 비.인그라시아 | 노출 후부를 갖는 열적 강화된 반도체 장치 및 그 제조방법 |
| US5403783A (en) * | 1992-12-28 | 1995-04-04 | Hitachi, Ltd. | Integrated circuit substrate with cooling accelerator substrate |
| US5379187A (en) * | 1993-03-25 | 1995-01-03 | Vlsi Technology, Inc. | Design for encapsulation of thermally enhanced integrated circuits |
| US5539545A (en) * | 1993-05-18 | 1996-07-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of making LCD in which resin columns are cured and the liquid crystal is reoriented |
| JPH0722722A (ja) * | 1993-07-05 | 1995-01-24 | Mitsubishi Electric Corp | 樹脂成形タイプの電子回路装置 |
| US5410806A (en) * | 1993-09-15 | 1995-05-02 | Lsi Logic Corporation | Method for fabricating conductive epoxy grid array semiconductors packages |
| US5506756A (en) * | 1994-01-25 | 1996-04-09 | Intel Corporation | Tape BGA package die-up/die down |
| US6232152B1 (en) | 1994-05-19 | 2001-05-15 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures |
| US6359335B1 (en) | 1994-05-19 | 2002-03-19 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures |
| US5776796A (en) * | 1994-05-19 | 1998-07-07 | Tessera, Inc. | Method of encapsulating a semiconductor package |
| US5834339A (en) * | 1996-03-07 | 1998-11-10 | Tessera, Inc. | Methods for providing void-free layers for semiconductor assemblies |
| US5706174A (en) * | 1994-07-07 | 1998-01-06 | Tessera, Inc. | Compliant microelectrionic mounting device |
| US5688716A (en) * | 1994-07-07 | 1997-11-18 | Tessera, Inc. | Fan-out semiconductor chip assembly |
| MY112145A (en) * | 1994-07-11 | 2001-04-30 | Ibm | Direct attachment of heat sink attached directly to flip chip using flexible epoxy |
| JPH0846098A (ja) * | 1994-07-22 | 1996-02-16 | Internatl Business Mach Corp <Ibm> | 直接的熱伝導路を形成する装置および方法 |
| US5659952A (en) | 1994-09-20 | 1997-08-26 | Tessera, Inc. | Method of fabricating compliant interface for semiconductor chip |
| US6169328B1 (en) | 1994-09-20 | 2001-01-02 | Tessera, Inc | Semiconductor chip assembly |
| US6870272B2 (en) * | 1994-09-20 | 2005-03-22 | Tessera, Inc. | Methods of making microelectronic assemblies including compliant interfaces |
| US5915170A (en) * | 1994-09-20 | 1999-06-22 | Tessera, Inc. | Multiple part compliant interface for packaging of a semiconductor chip and method therefor |
| US5757620A (en) * | 1994-12-05 | 1998-05-26 | International Business Machines Corporation | Apparatus for cooling of chips using blind holes with customized depth |
| US5604978A (en) * | 1994-12-05 | 1997-02-25 | International Business Machines Corporation | Method for cooling of chips using a plurality of materials |
| US6046076A (en) * | 1994-12-29 | 2000-04-04 | Tessera, Inc. | Vacuum dispense method for dispensing an encapsulant and machine therefor |
| GB9502178D0 (en) * | 1995-02-03 | 1995-03-22 | Plessey Semiconductors Ltd | MCM-D Assemblies |
| US5798909A (en) * | 1995-02-15 | 1998-08-25 | International Business Machines Corporation | Single-tiered organic chip carriers for wire bond-type chips |
| US6211572B1 (en) * | 1995-10-31 | 2001-04-03 | Tessera, Inc. | Semiconductor chip package with fan-in leads |
| US6284563B1 (en) * | 1995-10-31 | 2001-09-04 | Tessera, Inc. | Method of making compliant microelectronic assemblies |
| US5744383A (en) * | 1995-11-17 | 1998-04-28 | Altera Corporation | Integrated circuit package fabrication method |
| KR19990067623A (ko) | 1995-11-28 | 1999-08-25 | 가나이 쓰도무 | 반도체장치와 그 제조방법 및 실장기판 |
| US6007349A (en) * | 1996-01-04 | 1999-12-28 | Tessera, Inc. | Flexible contact post and post socket and associated methods therefor |
| US5977629A (en) * | 1996-01-24 | 1999-11-02 | Micron Technology, Inc. | Condensed memory matrix |
| JP3527350B2 (ja) * | 1996-02-01 | 2004-05-17 | 株式会社ルネサステクノロジ | 半導体装置 |
| US5851311A (en) * | 1996-03-29 | 1998-12-22 | Sophia Systems Co., Ltd. | Polymerizable flux composition for encapsulating the solder in situ |
| US5700723A (en) * | 1996-05-15 | 1997-12-23 | Lsi Logic Corporation | Method of packaging an integrated circuit |
| US5895976A (en) * | 1996-06-03 | 1999-04-20 | Motorola Corporation | Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same |
| US6686015B2 (en) | 1996-12-13 | 2004-02-03 | Tessera, Inc. | Transferable resilient element for packaging of a semiconductor chip and method therefor |
| US5891753A (en) | 1997-01-24 | 1999-04-06 | Micron Technology, Inc. | Method and apparatus for packaging flip chip bare die on printed circuit boards |
| US5798563A (en) | 1997-01-28 | 1998-08-25 | International Business Machines Corporation | Polytetrafluoroethylene thin film chip carrier |
| US6639155B1 (en) | 1997-06-11 | 2003-10-28 | International Business Machines Corporation | High performance packaging platform and method of making same |
| US6403882B1 (en) * | 1997-06-30 | 2002-06-11 | International Business Machines Corporation | Protective cover plate for flip chip assembly backside |
| US6495083B2 (en) * | 1997-10-29 | 2002-12-17 | Hestia Technologies, Inc. | Method of underfilling an integrated circuit chip |
| US6038136A (en) * | 1997-10-29 | 2000-03-14 | Hestia Technologies, Inc. | Chip package with molded underfill |
| US6324069B1 (en) | 1997-10-29 | 2001-11-27 | Hestia Technologies, Inc. | Chip package with molded underfill |
| US5969947A (en) | 1997-12-17 | 1999-10-19 | International Business Machines Corporation | Integral design features for heatsink attach for electronic packages |
| JP3017485B2 (ja) * | 1998-01-23 | 2000-03-06 | アピックヤマダ株式会社 | 半導体装置の樹脂封止方法及び樹脂封止装置 |
| US6224711B1 (en) | 1998-08-25 | 2001-05-01 | International Business Machines Corporation | Assembly process for flip chip package having a low stress chip and resulting structure |
| US6117797A (en) * | 1998-09-03 | 2000-09-12 | Micron Technology, Inc. | Attachment method for heat sinks and devices involving removal of misplaced encapsulant |
| US6008074A (en) | 1998-10-01 | 1999-12-28 | Micron Technology, Inc. | Method of forming a synchronous-link dynamic random access memory edge-mounted device |
| US6214640B1 (en) | 1999-02-10 | 2001-04-10 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages |
| US20020014688A1 (en) * | 1999-03-03 | 2002-02-07 | Suresh Ramalingam | Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials |
| US6507101B1 (en) * | 1999-03-26 | 2003-01-14 | Hewlett-Packard Company | Lossy RF shield for integrated circuits |
| US6077766A (en) * | 1999-06-25 | 2000-06-20 | International Business Machines Corporation | Variable thickness pads on a substrate surface |
| DE60025489T2 (de) * | 1999-07-08 | 2006-08-03 | Sunstar Giken K.K., Takatsuki | Unterfüllmaterial für halbleitergehäuse |
| US6426545B1 (en) * | 2000-02-10 | 2002-07-30 | Epic Technologies, Inc. | Integrated circuit structures and methods employing a low modulus high elongation photodielectric |
| US6570259B2 (en) | 2001-03-22 | 2003-05-27 | International Business Machines Corporation | Apparatus to reduce thermal fatigue stress on flip chip solder connections |
| US6974765B2 (en) * | 2001-09-27 | 2005-12-13 | Intel Corporation | Encapsulation of pin solder for maintaining accuracy in pin position |
| US20050049334A1 (en) * | 2003-09-03 | 2005-03-03 | Slawomir Rubinsztain | Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications |
| US20040222518A1 (en) * | 2003-02-25 | 2004-11-11 | Tessera, Inc. | Ball grid array with bumps |
| EP1851798B1 (en) * | 2005-02-25 | 2016-08-03 | Tessera, Inc. | Microelectronic assemblies having compliancy |
| DE102005029407B4 (de) * | 2005-06-24 | 2008-06-19 | Mühlbauer Ag | Verfahren und Vorrichtung zum dauerhaften Verbinden integrierter Schaltungen mit einem Substrat |
| US7749886B2 (en) | 2006-12-20 | 2010-07-06 | Tessera, Inc. | Microelectronic assemblies having compliancy and methods therefor |
| US8710618B2 (en) * | 2007-03-12 | 2014-04-29 | Honeywell International Inc. | Fibrous laminate interface for security coatings |
| TW201025467A (en) * | 2008-12-25 | 2010-07-01 | United Test Ct Inc | Ball implantation method and ball implantation system applying the method |
| JP6386746B2 (ja) * | 2014-02-26 | 2018-09-05 | 株式会社ジェイデバイス | 半導体装置 |
| JP7358857B2 (ja) * | 2019-09-04 | 2023-10-11 | 富士通株式会社 | 電子ユニット、電子ユニットの製造方法及び電子機器 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3365773D1 (en) * | 1982-02-26 | 1986-10-09 | Ciba Geigy Ag | Coloured photo-hardenable composition |
| US4633573A (en) * | 1982-10-12 | 1987-01-06 | Aegis, Inc. | Microcircuit package and sealing method |
| JPS6032807A (ja) * | 1983-07-30 | 1985-02-20 | Matsushita Electric Works Ltd | 光硬化型樹脂組成物 |
| DE3471486D1 (de) * | 1983-08-15 | 1988-06-30 | Ciba Geigy Ag | Photocurable compositions |
| DE3442131A1 (de) * | 1984-11-17 | 1986-05-22 | Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn | Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen |
| US4806574A (en) * | 1985-07-22 | 1989-02-21 | Desoto, Inc. | Ultraviolet curable coatings for optical glass fiber based on a polyfunctional core |
| JP2568421B2 (ja) * | 1987-03-24 | 1997-01-08 | 株式会社スリーボンド | 嫌気硬化性接着シール剤組成物 |
| US5039715A (en) * | 1987-04-13 | 1991-08-13 | Dymax Corporation | Photocurable acrylate adhesive containing perester/tautomeric acid adhesion promoter |
| EP0335019B1 (en) * | 1988-03-29 | 1993-05-26 | Director General, Agency of Industrial Science and Technology | Semiconductor chip bonded to a substrate |
| US4973611A (en) * | 1988-04-04 | 1990-11-27 | Uvexs Incorporated | Optical fiber buffer coating with Tg |
| EP0340492A3 (en) * | 1988-05-02 | 1990-07-04 | International Business Machines Corporation | Conformal sealing and interplanar encapsulation of electronic device structures |
| US4915167A (en) * | 1988-08-05 | 1990-04-10 | Westinghouse Electric Corp. | Thermal coupling to enhance heat transfer |
| JPH0269945A (ja) * | 1988-09-05 | 1990-03-08 | Hitachi Ltd | 半導体装置及びその製造方法 |
| US5053357A (en) * | 1989-12-27 | 1991-10-01 | Motorola, Inc. | Method of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereon |
| US5121190A (en) * | 1990-03-14 | 1992-06-09 | International Business Machines Corp. | Solder interconnection structure on organic substrates |
| US5089440A (en) * | 1990-03-14 | 1992-02-18 | International Business Machines Corporation | Solder interconnection structure and process for making |
| US4999699A (en) * | 1990-03-14 | 1991-03-12 | International Business Machines Corporation | Solder interconnection structure and process for making |
| JP2843658B2 (ja) * | 1990-08-02 | 1999-01-06 | 東レ・ダウコーニング・シリコーン株式会社 | フリップチップ型半導体装置 |
| US5128746A (en) * | 1990-09-27 | 1992-07-07 | Motorola, Inc. | Adhesive and encapsulant material with fluxing properties |
| US5120678A (en) * | 1990-11-05 | 1992-06-09 | Motorola Inc. | Electrical component package comprising polymer-reinforced solder bump interconnection |
| US5173764A (en) * | 1991-04-08 | 1992-12-22 | Motorola, Inc. | Semiconductor device having a particular lid means and encapsulant to reduce die stress |
-
1992
- 1992-07-06 US US07/909,368 patent/US5249101A/en not_active Expired - Lifetime
-
1993
- 1993-03-18 CA CA002091910A patent/CA2091910C/en not_active Expired - Fee Related
- 1993-04-26 TW TW082103193A patent/TW230272B/zh active
- 1993-06-07 JP JP5136147A patent/JP2501287B2/ja not_active Expired - Lifetime
- 1993-06-08 MY MYPI93001105A patent/MY108750A/en unknown
- 1993-06-28 KR KR1019930011870A patent/KR960015924B1/ko not_active Expired - Fee Related
- 1993-06-28 CN CN93108062A patent/CN1028937C/zh not_active Expired - Fee Related
- 1993-07-01 EP EP93201907A patent/EP0578307B1/en not_active Expired - Lifetime
- 1993-07-01 AT AT93201907T patent/ATE143529T1/de not_active IP Right Cessation
- 1993-07-01 ES ES93201907T patent/ES2092216T3/es not_active Expired - Lifetime
- 1993-07-01 DE DE69305012T patent/DE69305012T2/de not_active Expired - Fee Related
- 1993-07-01 SG SG1995002312A patent/SG44362A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2501287B2 (ja) | 1996-05-29 |
| CN1081787A (zh) | 1994-02-09 |
| EP0578307B1 (en) | 1996-09-25 |
| CA2091910A1 (en) | 1994-01-07 |
| TW230272B (env) | 1994-09-11 |
| ATE143529T1 (de) | 1996-10-15 |
| DE69305012T2 (de) | 1997-04-03 |
| ES2092216T3 (es) | 1996-11-16 |
| CA2091910C (en) | 1996-07-30 |
| DE69305012D1 (de) | 1996-10-31 |
| US5249101A (en) | 1993-09-28 |
| EP0578307A2 (en) | 1994-01-12 |
| KR960015924B1 (ko) | 1996-11-23 |
| EP0578307A3 (en) | 1994-08-24 |
| CN1028937C (zh) | 1995-06-14 |
| KR940002031A (ko) | 1994-02-16 |
| JPH0697309A (ja) | 1994-04-08 |
| SG44362A1 (en) | 1997-12-19 |
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