TW202513825A - 銅銀合金製之片材之製造方法及探針卡之電極用片之製造方法 - Google Patents
銅銀合金製之片材之製造方法及探針卡之電極用片之製造方法 Download PDFInfo
- Publication number
- TW202513825A TW202513825A TW113136701A TW113136701A TW202513825A TW 202513825 A TW202513825 A TW 202513825A TW 113136701 A TW113136701 A TW 113136701A TW 113136701 A TW113136701 A TW 113136701A TW 202513825 A TW202513825 A TW 202513825A
- Authority
- TW
- Taiwan
- Prior art keywords
- sheet
- substrate
- thickness
- copper
- silver alloy
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/001—Continuous casting of metals, i.e. casting in indefinite lengths of specific alloys
- B22D11/004—Copper alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
Landscapes
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Biochemistry (AREA)
- Electrochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Metal Rolling (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/035495 WO2025069337A1 (ja) | 2023-09-28 | 2023-09-28 | 銅銀合金製のシート材の製造方法およびプローブカードの電極用シートの製造方法 |
| WOPCT/JP2023/035495 | 2023-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202513825A true TW202513825A (zh) | 2025-04-01 |
Family
ID=94826211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113136701A TW202513825A (zh) | 2023-09-28 | 2024-09-26 | 銅銀合金製之片材之製造方法及探針卡之電極用片之製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12305269B2 (https=) |
| JP (2) | JP7709624B1 (https=) |
| KR (1) | KR102770394B1 (https=) |
| CN (1) | CN120077158B (https=) |
| TW (1) | TW202513825A (https=) |
| WO (1) | WO2025069337A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000282157A (ja) * | 1999-01-29 | 2000-10-10 | Furukawa Electric Co Ltd:The | 箔導体 |
| JP4143086B2 (ja) | 2005-12-20 | 2008-09-03 | 日立電線株式会社 | 極細銅合金線、極細銅合金撚線及びそれらの製造方法 |
| JP6155923B2 (ja) * | 2013-07-16 | 2017-07-05 | 住友電気工業株式会社 | 銅−銀合金線の製造方法 |
| JP6654608B2 (ja) * | 2017-08-03 | 2020-02-26 | 株式会社徳力本店 | 電気・電子機器用Ｃｕ合金及びそれを用いたプローブピン |
| TWI873415B (zh) * | 2017-08-10 | 2025-02-21 | 日商田中貴金屬工業股份有限公司 | 高強度與高導電性的銅合金板材及其製造方法 |
| JP7213083B2 (ja) * | 2018-11-05 | 2023-01-26 | Ｄｏｗａメタルテック株式会社 | 銅合金板材およびその製造方法 |
| CN111363948B (zh) | 2020-04-24 | 2021-11-09 | 浙江大学 | 一种高强高导铜合金的高效短流程制备方法 |
| CN114318046A (zh) * | 2021-12-03 | 2022-04-12 | 中南大学 | 一种抗菌抑菌的合金型材及其制备方法和应用 |
| CN114645153B (zh) * | 2022-03-17 | 2023-01-24 | 东北大学 | 一种高强高导铜银合金丝及其制备方法 |
| JP7322247B1 (ja) * | 2022-06-07 | 2023-08-07 | Ｓｗｃｃ株式会社 | Ｃｕ－Ａｇ合金線およびその製造方法 |
| US12148545B2 (en) * | 2022-06-08 | 2024-11-19 | Swcc Corporation | Conductive wire for electrical properties testing and method for producing the same |
| CN116287846B (zh) * | 2023-02-17 | 2026-02-24 | 宁波博威合金材料股份有限公司 | 一种高强高导铜银合金及其制备方法 |
-
2023
- 2023-09-28 WO PCT/JP2023/035495 patent/WO2025069337A1/ja active Pending
- 2023-09-28 KR KR1020247036496A patent/KR102770394B1/ko active Active
- 2023-09-28 CN CN202380036168.5A patent/CN120077158B/zh active Active
- 2023-09-28 JP JP2024561995A patent/JP7709624B1/ja active Active
-
2024
- 2024-09-26 TW TW113136701A patent/TW202513825A/zh unknown
- 2024-10-31 US US18/932,615 patent/US12305269B2/en active Active
-
2025
- 2025-07-03 JP JP2025113097A patent/JP7789257B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN120077158B (zh) | 2026-01-23 |
| US20250109470A1 (en) | 2025-04-03 |
| CN120077158A (zh) | 2025-05-30 |
| WO2025069337A1 (ja) | 2025-04-03 |
| JP7789257B2 (ja) | 2025-12-19 |
| US12305269B2 (en) | 2025-05-20 |
| JP7709624B1 (ja) | 2025-07-16 |
| JPWO2025069337A1 (https=) | 2025-04-03 |
| KR102770394B1 (ko) | 2025-02-21 |
| JP2025134999A (ja) | 2025-09-17 |
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