KR102770394B1 - 구리은 합금제의 시트재의 제조 방법 및 프로브 카드의 전극용 시트의 제조 방법 - Google Patents

구리은 합금제의 시트재의 제조 방법 및 프로브 카드의 전극용 시트의 제조 방법 Download PDF

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KR102770394B1
KR102770394B1 KR1020247036496A KR20247036496A KR102770394B1 KR 102770394 B1 KR102770394 B1 KR 102770394B1 KR 1020247036496 A KR1020247036496 A KR 1020247036496A KR 20247036496 A KR20247036496 A KR 20247036496A KR 102770394 B1 KR102770394 B1 KR 102770394B1
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South Korea
Prior art keywords
sheet material
copper
sheet
silver alloy
manufacturing
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English (en)
Korean (ko)
Inventor
츠토무 고이즈미
고 오다치
류이치 아라이
Original Assignee
에스더블유씨씨 가부시키가이샤
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/001Continuous casting of metals, i.e. casting in indefinite lengths of specific alloys
    • B22D11/004Copper alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B1/00Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28Electrolytic cell components
    • G01N27/30Electrodes, e.g. test electrodes; Half-cells
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

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  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Biochemistry (AREA)
  • Electrochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Metal Rolling (AREA)
KR1020247036496A 2023-09-28 2023-09-28 구리은 합금제의 시트재의 제조 방법 및 프로브 카드의 전극용 시트의 제조 방법 Active KR102770394B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/035495 WO2025069337A1 (ja) 2023-09-28 2023-09-28 銅銀合金製のシート材の製造方法およびプローブカードの電極用シートの製造方法

Publications (1)

Publication Number Publication Date
KR102770394B1 true KR102770394B1 (ko) 2025-02-21

Family

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Family Applications (1)

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KR1020247036496A Active KR102770394B1 (ko) 2023-09-28 2023-09-28 구리은 합금제의 시트재의 제조 방법 및 프로브 카드의 전극용 시트의 제조 방법

Country Status (6)

Country Link
US (1) US12305269B2 (https=)
JP (2) JP7709624B1 (https=)
KR (1) KR102770394B1 (https=)
CN (1) CN120077158B (https=)
TW (1) TW202513825A (https=)
WO (1) WO2025069337A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000282157A (ja) * 1999-01-29 2000-10-10 Furukawa Electric Co Ltd:The 箔導体
JP2019026921A (ja) * 2017-08-03 2019-02-21 株式会社徳力本店 電気・電子機器用Cu合金及びそれを用いたプローブピン
JP2022028598A (ja) 2020-04-24 2022-02-16 浙江大学 高強度高伝導率銅合金の高効率製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4143086B2 (ja) 2005-12-20 2008-09-03 日立電線株式会社 極細銅合金線、極細銅合金撚線及びそれらの製造方法
JP6155923B2 (ja) * 2013-07-16 2017-07-05 住友電気工業株式会社 銅−銀合金線の製造方法
TWI873415B (zh) * 2017-08-10 2025-02-21 日商田中貴金屬工業股份有限公司 高強度與高導電性的銅合金板材及其製造方法
JP7213083B2 (ja) * 2018-11-05 2023-01-26 Dowaメタルテック株式会社 銅合金板材およびその製造方法
CN114318046A (zh) * 2021-12-03 2022-04-12 中南大学 一种抗菌抑菌的合金型材及其制备方法和应用
CN114645153B (zh) * 2022-03-17 2023-01-24 东北大学 一种高强高导铜银合金丝及其制备方法
JP7322247B1 (ja) * 2022-06-07 2023-08-07 Swcc株式会社 Cu-Ag合金線およびその製造方法
US12148545B2 (en) * 2022-06-08 2024-11-19 Swcc Corporation Conductive wire for electrical properties testing and method for producing the same
CN116287846B (zh) * 2023-02-17 2026-02-24 宁波博威合金材料股份有限公司 一种高强高导铜银合金及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000282157A (ja) * 1999-01-29 2000-10-10 Furukawa Electric Co Ltd:The 箔導体
JP2019026921A (ja) * 2017-08-03 2019-02-21 株式会社徳力本店 電気・電子機器用Cu合金及びそれを用いたプローブピン
JP2022028598A (ja) 2020-04-24 2022-02-16 浙江大学 高強度高伝導率銅合金の高効率製造方法

Also Published As

Publication number Publication date
CN120077158B (zh) 2026-01-23
TW202513825A (zh) 2025-04-01
US20250109470A1 (en) 2025-04-03
CN120077158A (zh) 2025-05-30
WO2025069337A1 (ja) 2025-04-03
JP7789257B2 (ja) 2025-12-19
US12305269B2 (en) 2025-05-20
JP7709624B1 (ja) 2025-07-16
JPWO2025069337A1 (https=) 2025-04-03
JP2025134999A (ja) 2025-09-17

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