JP7709624B1 - 銅銀合金製のシート材の製造方法およびプローブカードの電極用シートの製造方法 - Google Patents

銅銀合金製のシート材の製造方法およびプローブカードの電極用シートの製造方法

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Publication number
JP7709624B1
JP7709624B1 JP2024561995A JP2024561995A JP7709624B1 JP 7709624 B1 JP7709624 B1 JP 7709624B1 JP 2024561995 A JP2024561995 A JP 2024561995A JP 2024561995 A JP2024561995 A JP 2024561995A JP 7709624 B1 JP7709624 B1 JP 7709624B1
Authority
JP
Japan
Prior art keywords
sheet material
copper
silver alloy
substrate
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2024561995A
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English (en)
Japanese (ja)
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JPWO2025069337A1 (https=
Inventor
勉 小泉
剛 大達
龍一 新井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SWCC Corp
Original Assignee
SWCC Corp
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Filing date
Publication date
Application filed by SWCC Corp filed Critical SWCC Corp
Publication of JPWO2025069337A1 publication Critical patent/JPWO2025069337A1/ja
Priority to JP2025113097A priority Critical patent/JP7789257B2/ja
Application granted granted Critical
Publication of JP7709624B1 publication Critical patent/JP7709624B1/ja
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Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/001—Continuous casting of metals, i.e. casting in indefinite lengths of specific alloys
    • B22D11/004—Copper alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Biochemistry (AREA)
  • Electrochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Metal Rolling (AREA)
JP2024561995A 2023-09-28 2023-09-28 銅銀合金製のシート材の製造方法およびプローブカードの電極用シートの製造方法 Active JP7709624B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025113097A JP7789257B2 (ja) 2023-09-28 2025-07-03 銅銀合金製のシート材の製造方法およびプローブカードの電極用シートの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/035495 WO2025069337A1 (ja) 2023-09-28 2023-09-28 銅銀合金製のシート材の製造方法およびプローブカードの電極用シートの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025113097A Division JP7789257B2 (ja) 2023-09-28 2025-07-03 銅銀合金製のシート材の製造方法およびプローブカードの電極用シートの製造方法

Publications (2)

Publication Number Publication Date
JPWO2025069337A1 JPWO2025069337A1 (https=) 2025-04-03
JP7709624B1 true JP7709624B1 (ja) 2025-07-16

Family

ID=94826211

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024561995A Active JP7709624B1 (ja) 2023-09-28 2023-09-28 銅銀合金製のシート材の製造方法およびプローブカードの電極用シートの製造方法
JP2025113097A Active JP7789257B2 (ja) 2023-09-28 2025-07-03 銅銀合金製のシート材の製造方法およびプローブカードの電極用シートの製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025113097A Active JP7789257B2 (ja) 2023-09-28 2025-07-03 銅銀合金製のシート材の製造方法およびプローブカードの電極用シートの製造方法

Country Status (6)

Country Link
US (1) US12305269B2 (https=)
JP (2) JP7709624B1 (https=)
KR (1) KR102770394B1 (https=)
CN (1) CN120077158B (https=)
TW (1) TW202513825A (https=)
WO (1) WO2025069337A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000282157A (ja) * 1999-01-29 2000-10-10 Furukawa Electric Co Ltd:The 箔導体
JP2019026921A (ja) * 2017-08-03 2019-02-21 株式会社徳力本店 電気・電子機器用Ｃｕ合金及びそれを用いたプローブピン

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4143086B2 (ja) 2005-12-20 2008-09-03 日立電線株式会社 極細銅合金線、極細銅合金撚線及びそれらの製造方法
JP6155923B2 (ja) * 2013-07-16 2017-07-05 住友電気工業株式会社 銅−銀合金線の製造方法
TWI873415B (zh) * 2017-08-10 2025-02-21 日商田中貴金屬工業股份有限公司 高強度與高導電性的銅合金板材及其製造方法
JP7213083B2 (ja) * 2018-11-05 2023-01-26 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
CN111363948B (zh) 2020-04-24 2021-11-09 浙江大学 一种高强高导铜合金的高效短流程制备方法
CN114318046A (zh) * 2021-12-03 2022-04-12 中南大学 一种抗菌抑菌的合金型材及其制备方法和应用
CN114645153B (zh) * 2022-03-17 2023-01-24 东北大学 一种高强高导铜银合金丝及其制备方法
JP7322247B1 (ja) * 2022-06-07 2023-08-07 Ｓｗｃｃ株式会社 Ｃｕ－Ａｇ合金線およびその製造方法
US12148545B2 (en) * 2022-06-08 2024-11-19 Swcc Corporation Conductive wire for electrical properties testing and method for producing the same
CN116287846B (zh) * 2023-02-17 2026-02-24 宁波博威合金材料股份有限公司 一种高强高导铜银合金及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000282157A (ja) * 1999-01-29 2000-10-10 Furukawa Electric Co Ltd:The 箔導体
JP2019026921A (ja) * 2017-08-03 2019-02-21 株式会社徳力本店 電気・電子機器用Ｃｕ合金及びそれを用いたプローブピン

Also Published As

Publication number Publication date
CN120077158B (zh) 2026-01-23
TW202513825A (zh) 2025-04-01
US20250109470A1 (en) 2025-04-03
CN120077158A (zh) 2025-05-30
WO2025069337A1 (ja) 2025-04-03
JP7789257B2 (ja) 2025-12-19
US12305269B2 (en) 2025-05-20
JPWO2025069337A1 (https=) 2025-04-03
KR102770394B1 (ko) 2025-02-21
JP2025134999A (ja) 2025-09-17

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