JP2013520571A - 高強度、高伝導性銅合金及びその製造方法 - Google Patents
高強度、高伝導性銅合金及びその製造方法 Download PDFInfo
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- JP2013520571A JP2013520571A JP2012554889A JP2012554889A JP2013520571A JP 2013520571 A JP2013520571 A JP 2013520571A JP 2012554889 A JP2012554889 A JP 2012554889A JP 2012554889 A JP2012554889 A JP 2012554889A JP 2013520571 A JP2013520571 A JP 2013520571A
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- weight
- copper alloy
- tensile strength
- present
- aging treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000011282 treatment Methods 0.000 claims abstract description 32
- 230000032683 aging Effects 0.000 claims abstract description 26
- 238000005098 hot rolling Methods 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 19
- 238000005097 cold rolling Methods 0.000 claims abstract description 14
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 239000012535 impurity Substances 0.000 claims abstract description 4
- 239000002244 precipitate Substances 0.000 claims description 18
- 229910019819 Cr—Si Inorganic materials 0.000 claims description 7
- 229910019064 Mg-Si Inorganic materials 0.000 claims description 6
- 229910019406 Mg—Si Inorganic materials 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 238000000137 annealing Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 239000000203 mixture Substances 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 14
- 238000005266 casting Methods 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000011159 matrix material Substances 0.000 abstract description 6
- 229910052718 tin Inorganic materials 0.000 abstract description 6
- 238000004904 shortening Methods 0.000 abstract description 5
- 230000007423 decrease Effects 0.000 abstract description 4
- 238000006392 deoxygenation reaction Methods 0.000 abstract description 2
- 230000001590 oxidative effect Effects 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 description 14
- 239000000243 solution Substances 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 229910052748 manganese Inorganic materials 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000003483 aging Methods 0.000 description 3
- 229910052790 beryllium Inorganic materials 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 2
- 229910017813 Cu—Cr Inorganic materials 0.000 description 2
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 2
- 229910017985 Cu—Zr Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
【選択図】図1
Description
上記結果から分かるように、いくつかの特性に関して比較例は本発明に比べて劣っている。
Claims (7)
- 100重量%として、Cr0.2〜0.4重量%、Sn0.05〜0.15重量%、Zn0.05〜0.15重量%、Mg0.01〜0.30重量%、Si0.03〜0.07重量%であり、残部がCu及び不可避的不純物で組成されることを特徴とする、高引張強度、高加工性、高伝導性を有する銅合金。
- Cr、Mg及びSiの比率が(Cr+Mg)/Si=2〜10であることを特徴とする、請求項1に記載の高引張強度、高加工性、高伝導性を有する銅合金。
- 高引張強度が490〜570N/mm2、高伝導性が78〜89%IACS、延伸率が10〜12%であることを特徴とする、請求項1に記載の高引張強度、高加工性、高伝導性を有する銅合金。
- 100重量%として、Cr0.2〜0.4重量%、Sn0.05〜0.15重量%、Zn0.05〜0.15重量%、Mg0.01〜0.30重量%、Si0.03〜0.07重量%であり、残部がCu及び不可避的不純物で組成された溶湯を得るステップと、鋳塊を得るステップと、前記鋳塊を900〜1000℃で加熱して熱間圧延するステップと、冷間圧延するステップと、400〜500℃で2〜8時間1次時効処理するステップと、冷間圧延するステップと、370〜450℃で2〜8時間2次時効処理するステップと、からなることを特徴とする、高引張強度、高加工性、高伝導性を有する銅合金の製造方法。
- 前記熱間圧延後に水冷処理し、冷間圧延することを特徴とする、請求項4に記載の高引張強度、高加工性、高伝導性を有する銅合金の製造方法。
- 前記1次時効処理及び2次時効処理が、バッチ(batch)式焼鈍炉にて行われることを特徴とする、請求項4に記載の高引張強度、高加工性、高伝導性を有する銅合金の製造方法。
- 前記1次時効処理及び2次時効処理を通じてCr−Si系析出物及びMg−Si系析出物を形成させることで、高引張強度を確保することを特徴とする、請求項4又は6に記載の高引張強度、高加工性、高伝導性を有する銅合金の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0016516 | 2010-02-24 | ||
KR1020100016516A KR101185548B1 (ko) | 2010-02-24 | 2010-02-24 | 고강도, 고전도성 동합금 및 그 제조방법 |
PCT/KR2010/008698 WO2011105686A2 (ko) | 2010-02-24 | 2010-12-07 | 고강도, 고전도성 동합금 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
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JP2013520571A true JP2013520571A (ja) | 2013-06-06 |
JP5439610B2 JP5439610B2 (ja) | 2014-03-12 |
Family
ID=44507324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012554889A Active JP5439610B2 (ja) | 2010-02-24 | 2010-12-07 | 高強度、高伝導性銅合金及びその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8652274B2 (ja) |
EP (1) | EP2540847A4 (ja) |
JP (1) | JP5439610B2 (ja) |
KR (1) | KR101185548B1 (ja) |
CN (1) | CN102918172B (ja) |
WO (1) | WO2011105686A2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5802150B2 (ja) * | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | 銅合金 |
KR102363597B1 (ko) * | 2018-03-13 | 2022-02-15 | 후루카와 덴키 고교 가부시키가이샤 | 구리 합금 판재 및 그 제조 방법 및 전기 전자기기용 방열 부품 및 실드 케이스 |
CN110252972B (zh) * | 2019-07-06 | 2021-11-30 | 湖北精益高精铜板带有限公司 | 高强高导微合金铜箔及其加工方法 |
CN114203358B (zh) * | 2021-12-15 | 2023-08-15 | 有研工程技术研究院有限公司 | 一种超高强度高导电铜合金导体材料及其制备方法和应用 |
CN114318055B (zh) * | 2022-01-07 | 2022-12-09 | 江西省科学院应用物理研究所 | 一种高强高导高韧铜合金及其制备方法 |
CN115044846B (zh) * | 2022-06-23 | 2023-06-02 | 中国科学院宁波材料技术与工程研究所 | CuCrSn合金及其变形热处理方法 |
CN116179887A (zh) * | 2023-03-08 | 2023-05-30 | 福州大学 | 一种用于大电流电连接器的Cu-Cr-Zr合金及其制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4822560A (en) | 1985-10-10 | 1989-04-18 | The Furukawa Electric Co., Ltd. | Copper alloy and method of manufacturing the same |
JPH0784631B2 (ja) * | 1986-10-23 | 1995-09-13 | 古河電気工業株式会社 | 電子機器用銅合金 |
JPH01180932A (ja) * | 1988-01-11 | 1989-07-18 | Kobe Steel Ltd | ピン・グリッド・アレイicリードピン用高力高導電性銅合金 |
JP2501275B2 (ja) | 1992-09-07 | 1996-05-29 | 株式会社東芝 | 導電性および強度を兼備した銅合金 |
JPH06108212A (ja) * | 1992-09-30 | 1994-04-19 | Furukawa Electric Co Ltd:The | 析出型銅合金の製造法 |
JPH11323463A (ja) * | 1998-05-14 | 1999-11-26 | Kobe Steel Ltd | 電気・電子部品用銅合金 |
JP3735005B2 (ja) * | 1999-10-15 | 2006-01-11 | 古河電気工業株式会社 | 打抜加工性に優れた銅合金およびその製造方法 |
DE10117447B4 (de) | 2000-04-10 | 2016-10-27 | The Furukawa Electric Co., Ltd. | Ein stanzbares Kupferlegierungsblech und ein Verfahren zur Herstellung desselben |
JP4460037B2 (ja) * | 2000-07-21 | 2010-05-12 | 古河電気工業株式会社 | 電気接続部材用銅合金の加工熱処理方法及び電気接続部材用銅合金 |
US6749699B2 (en) * | 2000-08-09 | 2004-06-15 | Olin Corporation | Silver containing copper alloy |
JP2003089832A (ja) | 2001-09-18 | 2003-03-28 | Nippon Mining & Metals Co Ltd | めっき耐熱剥離性に優れた銅合金箔 |
JP4177221B2 (ja) * | 2003-10-06 | 2008-11-05 | 古河電気工業株式会社 | 電子機器用銅合金 |
JP2007126739A (ja) * | 2005-11-07 | 2007-05-24 | Nikko Kinzoku Kk | 電子材料用銅合金 |
JP2008081762A (ja) | 2006-09-26 | 2008-04-10 | Nikko Kinzoku Kk | 電子材料用Cu−Cr系銅合金 |
JP5367271B2 (ja) | 2007-01-26 | 2013-12-11 | 古河電気工業株式会社 | 圧延板材 |
US7936871B2 (en) | 2007-06-28 | 2011-05-03 | Samsung Electronics Co., Ltd. | Altering the size of windows in public key cryptographic computations |
-
2010
- 2010-02-24 KR KR1020100016516A patent/KR101185548B1/ko active IP Right Grant
- 2010-12-07 US US13/580,954 patent/US8652274B2/en active Active
- 2010-12-07 WO PCT/KR2010/008698 patent/WO2011105686A2/ko active Application Filing
- 2010-12-07 JP JP2012554889A patent/JP5439610B2/ja active Active
- 2010-12-07 EP EP10846713.5A patent/EP2540847A4/en not_active Withdrawn
- 2010-12-07 CN CN201080064496.9A patent/CN102918172B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
WO2011105686A3 (ko) | 2011-11-03 |
KR20110096941A (ko) | 2011-08-31 |
CN102918172A (zh) | 2013-02-06 |
WO2011105686A2 (ko) | 2011-09-01 |
US20120312431A1 (en) | 2012-12-13 |
JP5439610B2 (ja) | 2014-03-12 |
KR101185548B1 (ko) | 2012-09-24 |
EP2540847A4 (en) | 2014-08-13 |
EP2540847A2 (en) | 2013-01-02 |
US8652274B2 (en) | 2014-02-18 |
CN102918172B (zh) | 2015-06-10 |
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