WO2011105686A2 - 고강도, 고전도성 동합금 및 그 제조방법 - Google Patents
고강도, 고전도성 동합금 및 그 제조방법 Download PDFInfo
- Publication number
- WO2011105686A2 WO2011105686A2 PCT/KR2010/008698 KR2010008698W WO2011105686A2 WO 2011105686 A2 WO2011105686 A2 WO 2011105686A2 KR 2010008698 W KR2010008698 W KR 2010008698W WO 2011105686 A2 WO2011105686 A2 WO 2011105686A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper alloy
- tensile strength
- conductivity
- present
- workability
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Definitions
- Cu-Cr alloys which are excellent as high-conductivity copper alloys, are difficult to manufacture and include problems that cannot be easily manufactured at low cost, high quality, and high yield.
- the molten metal thus formed is subjected to hot rolling, solution treatment, intermetallic rolling, aging treatment, intermetallic rolling, annealing, and the material obtained through the above process to meet the required thickness.
- the product is obtained by processing.
- Zr targets Zr which has high electrical conductivity but lacks tensile strength and maintains tensile strength, while the physical properties of the elongation required for workability are unclear, and all the above physical properties are maintained. It is not known at all how the hardness appeared.
- It is hot rolled by heating at 880 ⁇ 980 ° C, it is manufactured by cold rolling, but before or after the cold rolling to aging treatment at a temperature of 360 ⁇ 470 ° C to produce excellent copper alloy for punchability.
- the above-mentioned technologies secure properties such as strength and conductivity by controlling the solid solution and precipitation of Cr or Cr-Si based compounds mainly through processes such as hot rolling, cold rolling, solutionization, and aging treatment.
- the molten metal of the above composition is used as an ingot to produce precipitates through processes such as hot rolling, hot rolling, solutionization, and aging treatment to improve strength and electrical conductivity.
- Line 3 above describes 25 other elements.
- the group ( ⁇ ) shown in the periodic table includes groups of 1-8 to ⁇ 111 (8 families) and
- IA alkaline metal
- ⁇ alkaline earth metals: 4 elements except Be, Mg
- the elements belong to Group 10 except for Group VII A (Halogen), Group VI I (Oxygen) and Group VA (Nitrogen).
- Group VII A Halogen
- Group VI I Oxygen
- Group VA Nirogen
- Table 1 shows the examples of Cu—Cr or Cu—Zr, Cu—Cr_Zr, and Ni, B, Fe, and P as Cu-Cr (Examples 1 to 5).
- Cu-Zr type (Examples 6 to 9) are Mg, Ag, Be as other elements, and Cu-Cr-Zr type (Examples 10 to 22) as one element (Examples 11 to 15) 'Example 22), 2 types (Examples 16 to 17) and 3 types (Examples 18 to 21), as well as no information on tensile strength, and very unclear about the conductivity Is shown.
- the present invention has been made to solve the above-mentioned conventional problems, and promotes deoxidation using Si used in the Shindong plant, and does not cause any inconvenience in manufacturing even if it contains an element constituting an alloy such as Cr and Sn, In addition, it is formulated with components that can be melt cast even in non-oxidizing or reducing atmospheres. It has high conductivity without sacrificing tensile strength and has appropriate high processability. Also, Cr is layered on Cu matrix in preparing copper alloy materials. It is an object of the present invention to provide a copper alloy composition and a method for producing the same, which are suitable for making a low production cost by shortening the process without performing a high temperature solution after the end of hot rolling for a satisfactory solution.
- the present invention for achieving the above object is 100% by weight, Cr
- the balance consists of a highly conductive copper alloy characterized by being composed of Cu and unavoidable impurities.
- the Cr is limited to 0.2 to 0.4% by weight because it does not satisfy the tensile strength of less than 0.2% by weight, and when it exceeds 0.4% by weight, Cr or Cr compound increases in the Cu base, which adversely affects the plating property. to be.
- Sn is limited to 0.05 to 0.15% by weight, less than 0.05% by weight has no effect of inhibiting Cr precipitation or improving tensile strength at high temperature, and when it exceeds 0.15% by weight, the conductivity is greatly reduced and the stress corrosion resistance is inferior. Because.
- Zn is limited to 0.05 to 0.15% by weight, less than 0.05% by weight does not have an effect of improving the heat release peelability of degassing and plating in dissolution casting, and when it exceeds 0.15% by weight, there is no further improvement effect on the above effects. This is because the decrease in electrical conductivity increases at the same time.
- the Si is limited to 0.03 to 0.07% by weight in the manufacturing process after deoxidation and ingot heating at the time of melt casting at 0.03% by weight ⁇ 3 ⁇ 4
- the amount of Mg in the range of 0.01 to 0.30 ⁇ 3 ⁇ 4 is limited to 0. If the content is less than 0% by weight, Mg-based precipitates are inadequate and do not contribute to the strength improvement. This is because there is a problem that the Mg content decreases toward the end of the casting according to the casting time.
- the present invention also describes a manufacturing process for obtaining the desired strength and high conductivity for the above materials.
- the present invention is the step of dissolving, casting to obtain an ingot to the above composition, the step of hot rolling by heating the ingot 900 ⁇ 1000 ° C, the cold rolling step, the first 2 to 8 hours at 400 ⁇ 500 ° C It consists of a step of aging, a cold rolling step, and a second aging process for 2 to 8 hours at 370 to 450 ° C.
- the high-conductivity copper alloy of the present invention can be manufactured without any problems since the Sindong plant, which has a conventional modern equipment, is within the range of using an ingot heating furnace or a hot rolling mill.
- the aging time is long and less economical at less than 370 ° C., and over 45 CTC is not easy to overage, so optimum aging hardening cannot be realized.
- Figure 1 shows a Cr-Si-based precipitates and Mg-Si-based precipitates scanning electron micrograph
- Figure 2 is an EDS analysis of the Cr-Si-based precipitates
- Figure 3 shows the EDS analysis for the Mg-Si-based precipitates.
- the present invention uses Zn, Sn, Si, and Mg used in the Shindong plant to obtain tensile strength, which is the final alloy characteristic, without surface defects.
- 1 is a scanning electron micrograph of Cr-Si precipitates and Mg-Si precipitates.
- 2 is an EDS analysis of Cr-Si precipitates.
- An alloy having the composition shown in Table 1 was dissolved in a high frequency melting furnace to coat the molten metal with charcoal or argon gas to prevent oxidation, thereby producing an ingot having a thickness of 200 mm * width 600 mm * length 7000 mm using a semi-continuous casting apparatus. .
- the unstable casting part of the top and bottom of the ingot was cut and hot rolled at 96C C after hot rolling.
- Hot rolling end The hot rolling mill of thickness 12mm was rapidly cooled by spray water, cooled to room temperature, and wound up to coil shape. Thereafter, 1 mm of both sides were ground to remove the surface scale. Cold rolling was performed to a thickness of 0.2 mm, aging at 475 ° C. * 6 hours, cold rolling to a thickness of 0.2 mm, and tensile annealing was performed at 425 t> 4 hours to prepare a rolling bath.
- pickling and polishing were also performed after the selective aging treatment for surface cleaning, and after the first heat treatment, a straightening was performed using a tension leverler.
- the present invention is not limited to the manufacturing process according to the above embodiment, cold rolling, aging treatment, surface cleaning (hot pickling) after hot rolling, as is usually carried out in the Shindong plant to meet the individual customer requirements quality ), Tensile annealing, tension beveling and the like may be selected and combined as necessary.
- Tensile strength and elongation were specified according to KS B0802, and electrical conductivity related to thermal and electrical conductivity was specified according to KS D0240.
- Samples 1 to 10 of the present invention are Comparative Examples 1 to 10 and Example Nos. (1) to (4) of Korean Patent No. 10-2009-0004626 of the present invention. Strength and (10) to (13)
- the tensile strength of the present invention is shown below the lower than 490N / mm 2 of the comparative example and the sample number of the invention (13), (14), (16), the minimum Vickers hardness of the present invention Sample Nos. (10), (13) to (16) of the present invention below 164, and Comparative Examples and Sample Nos. (11) and (12) of the invention below the minimum conductivity of 78% IACS of the present invention. ), (15) and (16).
- the comparative example and the conventional invention were inferior to the present invention with respect to some characteristics.
- Japanese Patent Application Laid-Open No. 2003-89832 is inferior in electrical conductivity to the present invention, but the strength is found to be somewhat superior. This is shown by the characteristics according to the present invention and other element additions. Moreover, the data about elongation which require hardness and workability shown in this invention are not shown.
- Japanese Patent Application Laid-Open No. 2003-89832 has a problem in that an increase in manufacturing cost is accompanied by a solution treatment process.
- the present invention combines the elongation required for high conductivity and high workability while increasing or maintaining tensile strength, and in the manufacture of copper alloy material, after hot rolling to completely dissolve Cr in the Cu matrix. It is characterized by having a cheap copper alloy composition and its manufacturing process by shortening the process without performing high temperature solution.
- the comparative example was inferior to the present invention with respect to some characteristics.
- the entire sample of Japanese Patent Application Laid-Open No. 2003-89832 does not correspond to the composition range of the present invention, and the sample numbers (14), (15), and (18), which are examples using P or Mn, respectively, In contrast to the invention.
- Japanese Patent Application Laid-Open No. 2003-89832 is inferior in electrical conductivity to the present invention, but the strength is found to be somewhat superior. This is shown by the characteristics according to the present invention and other element additions. Moreover, the data about elongation which require hardness and workability shown in this invention are not shown.
- Japanese Patent Application Laid-Open No. 2003-89832 has a problem that the manufacturing cost is accompanied by a solution treatment process.
- the present invention combines the elongation required for high conductivity and high processability while increasing or maintaining tensile strength, and in the manufacture of a copper alloy material, after hot rolling to completely dissolve Cr in a Cu matrix. It is characterized by having a cheap copper alloy composition and its manufacturing process by shortening the process without performing high temperature solution.
- the present invention can be widely used in copper alloy materials having elongation required for high conductivity and workability without dropping tensile strength with respect to electrical and electronic materials such as semiconductor leadframe materials, terminals and connector materials.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012554889A JP5439610B2 (ja) | 2010-02-24 | 2010-12-07 | 高強度、高伝導性銅合金及びその製造方法 |
CN201080064496.9A CN102918172B (zh) | 2010-02-24 | 2010-12-07 | 具有高强度和高传导性的铜合金及其制造方法 |
US13/580,954 US8652274B2 (en) | 2010-02-24 | 2010-12-07 | Copper alloy with high strength and high conductibility, and method for manufacturing same |
EP10846713.5A EP2540847A4 (en) | 2010-02-24 | 2010-12-07 | HIGH-PERFORMANCE AND HIGHLY CONDUCTIVE COPPER ALLOY AND METHOD OF MANUFACTURING THEREOF |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0016516 | 2010-02-24 | ||
KR1020100016516A KR101185548B1 (ko) | 2010-02-24 | 2010-02-24 | 고강도, 고전도성 동합금 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011105686A2 true WO2011105686A2 (ko) | 2011-09-01 |
WO2011105686A3 WO2011105686A3 (ko) | 2011-11-03 |
Family
ID=44507324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2010/008698 WO2011105686A2 (ko) | 2010-02-24 | 2010-12-07 | 고강도, 고전도성 동합금 및 그 제조방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8652274B2 (ko) |
EP (1) | EP2540847A4 (ko) |
JP (1) | JP5439610B2 (ko) |
KR (1) | KR101185548B1 (ko) |
CN (1) | CN102918172B (ko) |
WO (1) | WO2011105686A2 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5802150B2 (ja) * | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | 銅合金 |
KR102363597B1 (ko) * | 2018-03-13 | 2022-02-15 | 후루카와 덴키 고교 가부시키가이샤 | 구리 합금 판재 및 그 제조 방법 및 전기 전자기기용 방열 부품 및 실드 케이스 |
CN110252972B (zh) * | 2019-07-06 | 2021-11-30 | 湖北精益高精铜板带有限公司 | 高强高导微合金铜箔及其加工方法 |
CN114203358B (zh) * | 2021-12-15 | 2023-08-15 | 有研工程技术研究院有限公司 | 一种超高强度高导电铜合金导体材料及其制备方法和应用 |
CN114318055B (zh) * | 2022-01-07 | 2022-12-09 | 江西省科学院应用物理研究所 | 一种高强高导高韧铜合金及其制备方法 |
CN115044846B (zh) * | 2022-06-23 | 2023-06-02 | 中国科学院宁波材料技术与工程研究所 | CuCrSn合金及其变形热处理方法 |
CN116179887A (zh) * | 2023-03-08 | 2023-05-30 | 福州大学 | 一种用于大电流电连接器的Cu-Cr-Zr合金及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0754079A (ja) | 1992-09-07 | 1995-02-28 | Toshiba Corp | 導電性および強度を兼備した銅合金 |
JP2001181757A (ja) | 1999-10-15 | 2001-07-03 | Furukawa Electric Co Ltd:The | 打抜加工性に優れた銅合金およびその製造方法 |
JP2003089832A (ja) | 2001-09-18 | 2003-03-28 | Nippon Mining & Metals Co Ltd | めっき耐熱剥離性に優れた銅合金箔 |
KR20090004626A (ko) | 2007-06-28 | 2009-01-12 | 삼성전자주식회사 | 공개키 암호화 연산에서의 윈도우의 크기를 변경하는 방법 |
Family Cites Families (12)
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US4822560A (en) | 1985-10-10 | 1989-04-18 | The Furukawa Electric Co., Ltd. | Copper alloy and method of manufacturing the same |
JPH0784631B2 (ja) * | 1986-10-23 | 1995-09-13 | 古河電気工業株式会社 | 電子機器用銅合金 |
JPH01180932A (ja) * | 1988-01-11 | 1989-07-18 | Kobe Steel Ltd | ピン・グリッド・アレイicリードピン用高力高導電性銅合金 |
JPH06108212A (ja) * | 1992-09-30 | 1994-04-19 | Furukawa Electric Co Ltd:The | 析出型銅合金の製造法 |
JPH11323463A (ja) * | 1998-05-14 | 1999-11-26 | Kobe Steel Ltd | 電気・電子部品用銅合金 |
DE10117447B4 (de) | 2000-04-10 | 2016-10-27 | The Furukawa Electric Co., Ltd. | Ein stanzbares Kupferlegierungsblech und ein Verfahren zur Herstellung desselben |
JP4460037B2 (ja) * | 2000-07-21 | 2010-05-12 | 古河電気工業株式会社 | 電気接続部材用銅合金の加工熱処理方法及び電気接続部材用銅合金 |
US6749699B2 (en) * | 2000-08-09 | 2004-06-15 | Olin Corporation | Silver containing copper alloy |
JP4177221B2 (ja) * | 2003-10-06 | 2008-11-05 | 古河電気工業株式会社 | 電子機器用銅合金 |
JP2007126739A (ja) * | 2005-11-07 | 2007-05-24 | Nikko Kinzoku Kk | 電子材料用銅合金 |
JP2008081762A (ja) * | 2006-09-26 | 2008-04-10 | Nikko Kinzoku Kk | 電子材料用Cu−Cr系銅合金 |
JP5367271B2 (ja) | 2007-01-26 | 2013-12-11 | 古河電気工業株式会社 | 圧延板材 |
-
2010
- 2010-02-24 KR KR1020100016516A patent/KR101185548B1/ko active IP Right Grant
- 2010-12-07 EP EP10846713.5A patent/EP2540847A4/en not_active Withdrawn
- 2010-12-07 CN CN201080064496.9A patent/CN102918172B/zh active Active
- 2010-12-07 US US13/580,954 patent/US8652274B2/en active Active
- 2010-12-07 JP JP2012554889A patent/JP5439610B2/ja active Active
- 2010-12-07 WO PCT/KR2010/008698 patent/WO2011105686A2/ko active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0754079A (ja) | 1992-09-07 | 1995-02-28 | Toshiba Corp | 導電性および強度を兼備した銅合金 |
JP2001181757A (ja) | 1999-10-15 | 2001-07-03 | Furukawa Electric Co Ltd:The | 打抜加工性に優れた銅合金およびその製造方法 |
JP2003089832A (ja) | 2001-09-18 | 2003-03-28 | Nippon Mining & Metals Co Ltd | めっき耐熱剥離性に優れた銅合金箔 |
KR20090004626A (ko) | 2007-06-28 | 2009-01-12 | 삼성전자주식회사 | 공개키 암호화 연산에서의 윈도우의 크기를 변경하는 방법 |
Non-Patent Citations (1)
Title |
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See also references of EP2540847A4 |
Also Published As
Publication number | Publication date |
---|---|
WO2011105686A3 (ko) | 2011-11-03 |
JP5439610B2 (ja) | 2014-03-12 |
US20120312431A1 (en) | 2012-12-13 |
CN102918172B (zh) | 2015-06-10 |
EP2540847A2 (en) | 2013-01-02 |
CN102918172A (zh) | 2013-02-06 |
US8652274B2 (en) | 2014-02-18 |
KR101185548B1 (ko) | 2012-09-24 |
EP2540847A4 (en) | 2014-08-13 |
JP2013520571A (ja) | 2013-06-06 |
KR20110096941A (ko) | 2011-08-31 |
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