TW201003674A - Cu-ni-si-co copper alloy for electronic material and process for producing the same - Google Patents

Abstract

A Cu-Ni-Si-Co alloy is provided which has mechanical and electrical properties which render the alloy suitable as a copper alloy for electronic materials. The alloy is even in mechanical properties. This copper alloy for electronic materials contains 1.0-2.5 mass% nickel, 0.5-2.5 mass% cobalt, and 0.3-1.2 mass% silicon, with the remainder being copper and incidental impurities. This alloy has an average crystal-grain diameter of 15-30 μm, and the average difference between a maximum crystal-grain diameter and a minimum crystal-grain diameter for examination fields of view each having an area of 0.5 mm2 is 10 μm or less.

Description

201003674 VI. Description of the Invention: [The technical field to which the invention pertains is in particular to a copper alloy. The invention relates to a handle shank, a precipitation hardening type copper alloy, a Cu-Ni-Si-Co system which is suitable for various electronic machines and loves micro-parts, and has no technology. For the connector, the opening, the relay, the ' , electric 1111', pick-up, terminal, wire, various electronic machine parts, such as the estimated field of dark wood, etc. # i A # e ^ ^ jin used in the use of copper alloys, characteristics. , the main charge, the electrical conductivity (or thermal conductivity) as a basic character. In recent years, the hoarding and miniaturization of the electronic love/earth and #ISV parts, and the development of the thin-walled strips, in response to this, the enthusiasm for the preservation of the soil is in the electronic machine parts. The use of the steel mouth is not up to standard. According to the viewpoint of high strength and high end f ^ and interconductivity, the former copper alloy of phosphorous bronze is used as an alloy for electronic materials, and the solid solution-reinforced niobium gold represented by the cup mountain* 'precipitates the hardened copper alloy. In the case of a copper alloy, it is added. For the precipitation of hard aging treatment, and the fine money and solid solution into the ~ ah uniform uniformity while improving, copper Yin's solid solution element ' & Jin Zhiqiang this 'available strength, elasticity, etc.', Oh, the conductivity is improved. Materials with good conductivity. Bellows/, and conductive, heat-transferred hardened copper alloy, commonly known as the Carson-based copper alloy with high electrical conductivity, strong production, and: Cu-N1-Si copper Alloy, and the industry is in the positive: the test of the processing of the generation of copper alloy by making the fine ... ... gold alloy -. The eucalyptus compound particles are precipitated into the 201003674 copper matrix to increase strength and electrical conductivity.目月j is trying to further improve the bean characteristics by adding Co to the Carson alloy. In Japanese Unexamined Patent Publication No. Hei No. 222641 (Patent Document 1), 'Co forms a compound with Si in the same manner as Νι, and the mechanical strength is improved, and when the Cu Co Si system is subjected to aging treatment, its mechanical strength and electrical conductivity are obtained. The properties are only slightly better than the Cu-NA alloy. Among them, it is also revealed that the Co Si system or the Cu Ni C〇_Si system can be selected if the cost permits. In addition, it is also disclosed that the method of manufacturing the alloy is after cold working, and is subjected to recrystallization treatment by TC for 25% or less of cold working, and 42 〇 to 55 〇. (3 after aging treatment, further advances #25% or less of the cold working and the low temperature annealing method (Patent Application No. 1). 曰Patent No. 2005-532477 (Patent Document 2) discloses a hot copper alloy 'by weight, which includes Record: 1%~2.5%, drill: 〇·5~2.0%, 矽: 0.5%~1.5% and the remainder consisting of copper and unavoidable impurities, the total content of nickel and cobalt is 1.7%~4.3% , (Ni + C〇) / Si ratio is 2:1~7:1' The hot copper alloy has conductivity of more than 4〇% ACS. Combining cobalt with yttrium, in order to limit particle growth and improve softening resistance It forms an effective antimony for age hardening. It also reveals that: 乂5 gold is manufactured by performing thermal processing at 850 ° C to 1000 ° C - performing a solution treatment at 800 C to 1000 ° C - 350. (: ~600. (: The temperature of the 30 knives ~ 3 〇 hours of the first aging annealing - implementation to reduce the cross-sectional area of 10 /. 5 % % cold working - a method of performing second aging annealing at a temperature lower than the first aging annealing temperature (Application No. 25, No. 201003674 26) International Publication No. 2006/101 172 According to the specification (Patent Document 3), in the solution treatment, if the cooling rate after heating is intentionally increased, the effect of improving the strength of the Cu-Ni-Si alloy can be further exerted, so that the cooling rate is set to about twice per second. The method of producing a Cn-Ni-Si-Co alloy as follows, which is more than 85% after hot rolling, is disclosed in the above-mentioned Japanese Patent Publication No. Hei 9-20943. Cold rolling, after annealing for 5 to 3 minutes at 450 to 480 tons, cold rolling of 30% or less is carried out, and further aging treatment is performed for 45 〇 to 5 〇 (rc for 3 〇 to minutes) (Applicant's Scope 5) [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. 2, No. 5, No. 5, pp. Specification No. 172 [Patent Document 4] Japanese Patent Publication No. 9-2〇943. SUMMARY OF THE INVENTION In order to improve the strength and electrical conductivity of Cu_Ni_Si alloy by adding c〇, the prior Cu_Ni_Si_c lanthanum alloy has the following problems. In the same material, mechanical properties such as strength, stress relaxation characteristics, and bending thickness are also likely to vary depending on the measurement site. Therefore, one of the problems of the present invention is to provide a mechanical property having uniform mechanical properties and electrical properties. The Cu_Ni_si_c lanthanide alloy is used as the alloy for electronic materials 201003674. Further, another object of the present invention is to provide a method for producing the above Cu_Nb Si_co alloy. The problem is that the first inventor discovered: Cu_N "si c〇 system up to now" The size of the crystal grains of the alloy is smaller than A, and large particles and small particles are mixed, and it has been found that the heterogeneity of the crystal grain size is related to the deviation of the mechanical properties. In the U Ni Si Co-based alloy, since 彳c〇 is added, it is necessary to carry out a solution treatment at a temperature higher than that of a usual Cu-NhS!-based alloy, and further, the granules are easily coarsened. On the other hand, the second phase particles such as crystals or precipitates precipitated in the previous stage of the solution treatment step become obstacles and hinder the growth of the crystal grains. Therefore, the Cu_Ni_Si_c lanthanum alloy tends to have a large variation in recrystallized grains as compared with the conventional S i series & Therefore, the inventors of the present invention conducted intensive studies on the method of reducing the deviation of recrystallized grains, and obtained the following findings: in the stage before the solution treatment step, the fine second phase particles are preliminarily precipitated at equal intervals as much as possible. In the copper matrix, borrowing, 匕' even if the solution is treated at a higher temperature, the crystal grains do not become too large due to the pinning effect of the second phase particles, and the pinning effect is uniform. It acts on the entire steel matrix, so that the size of the growing recrystallized grains can also be uniformized. Further, it is known that Cu_Ni_Si_c having a small variation in mechanical properties can be obtained. Alloy. The present invention, which is completed in the light of the above-mentioned findings, is a copper alloy for an electronic material which contains Ni: [Ο~2.5% by mass, c〇: 〇.5 to 2.5 mass. /〇, Si : (^~丨2% by mass, the remainder is composed of α and not < avoided 6 201003674 two impurities; the average crystal grain size of the steel alloy for electronic materials is # m ' #视视〇5. The average value of the difference between the maximum crystal grain size and the minimum two crystal grain size is 1 〇 Am or less. In a specific embodiment, the copper alloy of the present invention is 0.5% by mass of Cr. In another embodiment, the copper alloy of the present invention further comprises a total of 0.5% by mass selected from the group consisting of Mg, Mn, yttrium and yttrium or above.

In still another specific embodiment, the copper alloy of the present invention further comprises a total of 42.0% by mass selected from & and (either species or two. In yet another specific embodiment, the copper alloy of the present invention further comprises The total amount is 2.0 mass. /〇 is selected from one or more of As, Sb, Be, B, Ti, Zr, phantom and Fe. In another embodiment, the present invention is a copper alloy. The method comprises the steps of: step 1 'melting casting an ingot having a desired composition; step 2' at 95 CTC to 1050. (: heating after 1 hour, hot rolling, at the end of hot rolling The temperature is set to 85 〇 or more, and the average cooling rate from 850 ° C to 400 C is set to 丨 5 乞 / s or more for cooling; Step 3 'The cold rolling is performed with a working degree of 85% or more; Step 4 ' Perform aging treatment with 35〇~5〇〇乞 for 1~24 hours; Step 5' with 95 0X:~l〇5 (TC for solution treatment, the material temperature is lowered from 850 °C to 400X: average cooling The speed is set to 15 ° C / s or more and 201003674 is cooled; Step 6 ' Arbitrarily cold rolling; v7' to carry out aging treatment; and V to 8 to carry out random cold rolling. In the case of - in the form, the present invention is a copper with a top grade alloy in another form, The present invention relates to an electronic machine component having a wounded alloy. According to the present invention, Cu_Ni_Si_C having uniform mechanical properties can be obtained, and the alloy is uniform in the alloy. [Embodiment]

Ni and CUSi can be made high in strength without deteriorating the conductivity by performing appropriate combination. The amount of Ni, Co, and Si between the metals is formed, and the amount of addition is Nn.

Co : Not full 〇 _5 quality. /〇, 10% by mass, (1). Not full 〇·3 mass. The strength required, conversely, if Ni: '彳 can not get the quality...-%%=; Quantity:,. : ~ The electrical conductivity is significantly reduced, and the thermal processing is now two-strength, but the amount of lead is Ni · 1.0~2.5% by mass, c. Nl, C〇 and Si 〇·3~1.2% by mass. Ni, c〇 and 2. 5 mass. /〇, Si: Quality. /❶, C〇..0.5~2.〇t4 —N1:1.5~2〇 !· 〇·5~ to sage. /" 201003674 Bounds, L will be preferentially precipitated into crystal grains during the cooling process of the tears, which can suppress the grain boundary. It is not easy to crack when hot processing, and the yield is reduced. That is, use Solution-solution treatment, etc., for melting, and then, from a compound having a bcc structure containing Cr as a main component, for ", the resulting precipitated particles or with S! Dan" is for the usual CU-Nl_Sl alloy. In the added Sl, the Si that does not contribute to the aging precipitation will be in the solid solution to induce the lightning rate 夕μ 1 Τ < sorrow, lower one liter, but by adding the dicing forming element & The precipitation of y yttrium can reduce the amount of solid solution Si and increase the conductivity. Iron, from the right without compromising the strength ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, In the Ni-Si-Co alloy, % α is in the Q-Q gold, and it can be added to the 〇 5

Cr. However, if it is less than 3% by mass, the effect is 0.03 to 0.5% by mass, more preferably ', heart, 'so it is better to add 〇.〇9~〇.3 mass% . Force retardation = =Mg, Mn, A", Wl η characteristics without impairing electrical conductivity. Mainly by making the above Mg, Mn, A "p solid soluble in the parent phase, can be achieved by making the second phase particles" The above Mg, =: a further effect. However, if M is more than 0.5%, the characteristic improves the total of the inferiority of Ag and P. Therefore, in the present invention, Cu_Ni_Si ... Λ 〇 c , A / r σ In the gold, the attack can add a total of .5 shells, which is selected from the "eight" or two or more types. 9 201003674 ..., and the right is less than 0.01 mass, adding 0.01~〇 5, and /, the government is smaller' so it is better to total

It is preferable to add 〇. (M~02 蜃 总计 / / / / / / / / / / / / / / / / / / / / / / / / / / / 应力 应力 应力 应力 应力 应力 应力 应力 应力 应力 应力 应力 应力 应力 应力 应力 应力 应力 应力 应力Dissolved in the parent phase = the total conductivity and the total amount of Zn exceed 2 〇 mass.:, the effect of addition. However, if Sn will impair manufacturability, the characteristic improvement effect will be saturated, and the maximum addable amount is 2· Quality:: Cu-Nl_Sl-C0 alloy in the 'species. However, if not full.. 〇5 mass °., one of the selected from 11 or 2 for the total addition of 0'05~2.0 quality ° The effect is small, so the preferred amount is %, 〇, preferably 0.5~1 in total. The enamel is for As, Sb, Be, B, Ti φ, -b ^ 0 .. .A Zr, A1 and In the case of Fe, the additive strength is adjusted according to the required σ characteristics, thereby improving conductivity, twist, stress relaxation characteristics, plating properties, and product characteristics. Sb, Be, bismuth, Ti, 7 from;, Γ, A1 and solid solution in the mother phase to exert the effect of addition, but also by including the above-mentioned As in the first phase particles , Sb,

Be ' B, Ti, Zr, A1 b c 丄, e ' or a second phase particle forming a new composition exerts a further effect. m w and ' If the total of these elements exceeds 2.0 vol%, the property improving effect will be saturated and the manufacturability will be impaired. Therefore, among the W-based alloys, a maximum of 2·〇 of a negative amount can be added and selected from the group consisting of As, Sb, Be, and .. ^ One or more kinds of B, Ti, Zr, A1, and Fe. However, if it is less than 1% by mass, the effect is small. 10 201003674 This is preferably a total of 4 Λ 0.001 to 2.0% by mass, more preferably 〇 5 to 1.0% by mass. Right above Mg, Mn, Ag, yttrium, Sn, Zn, As, Sb, Be, Β,

Ti, Zr, A1, and Fe, * L θ . , x < When the total amount of addition exceeds 3%, the manufacturing property is liable to be impaired, and the hinge of the mouth and the like is preferably 2.0% by mass or less, more preferably for! · 5 mass% or less. 〇 Crystal grain size The crystal grain has an effect on the strength. The intensity is proportional to the -1/2 power of the crystal grain size, that is, the Hall-Petch equation is generally established. Further, the fact that the coarse crystal grains deteriorate the bending workability is a cause of surface roughness during bending. Therefore, regarding copper alloys, generally ^:. It is preferred that the fineness of the granules can increase the strength. In the case of the I body, it is preferably 3 〇 " m or less 'more preferably 23 " m or less. On the other hand, the Cu-Nl-Si_Co-based alloy of the present invention is the gold of the precipitation strengthening i. Therefore, it is necessary to pay attention to the precipitation state of the second phase particles. Timeliness

The second phase particles which are precipitated into the crystal grains during the treatment contribute to the improvement of the strength, but the second phase particles which are precipitated to the crystal grain boundaries hardly contribute to the improvement of the strength. Because: In order to increase the strength, it is preferred to precipitate the second phase particles into the crystal grains. When the crystal grain size becomes small, the grain boundary area becomes large, and when the aging treatment is desired, the second phase particles are preferentially precipitated to the grain boundary. In order to precipitate the second phase particles = within the grain, (4) must have a certain degree of size. Specifically, it is preferably 15#m or more, and more preferably 18#m or more. 15~30#m##Average crystal grain size In the present invention, the average crystal grain size is controlled. The average crystal grain size is preferably 18 to 23 #m. By controlling the range of 11 201003674, it is possible to obtain a balance between the strong entanglement caused by the crystallization of the crystal grains and the strength-increasing effect by precipitation hardening. Further, when the crystal grain size is in this range, excellent bending workability and stress relaxation properties can be obtained. In the present month, the δ-grain crystal grain size refers to the straightness of the circle surrounded by the crystals in the direction of the thickness direction of the direction of the direction of the == direction. The above average value. < In the present invention, the average value of the difference between the maximum crystal grain size and the minimum crystal grain size per observation field of 55 mm 2 is 1 G/m or less, preferably 7 cm or less. The average of the difference is ideally ambiguous, but it is actually difficult to achieve, and thus the actual minimum signal is limited to i ^ , value. Also 3#m, typically 3 to 7 in m. Here, the so-called maximum crystal grain size, which is obtained by Jm nc? ^ is buckled in a 〇.5mm2 observation _ the largest gentleman found in you. Take AI day and day diameter 'the so-called minimum crystallization The particle size is the same as that of the Shih Tzu, J, and α, which are observed in the same field of view. In the present invention, in the observation field of the plurality of points, the difference between the large crystal grain size and the minimum crust particle size is taken by the beam-T-knife, and the average value of the difference is obtained. The average of the difference between the smallest crystallite sizes. ° The maximum crystal grain size is the same as the minimum crystal grain sinking, and the difference between the granules and the grain size is small. This refers to the size of the crucible particle size _, which is the same as -4; J- Ψΐί rin y*- / The deviation of the mechanical properties of the measured portion of the material in the material is reduced. As a result, the quality stability of the copper alloy or the electronic component parts to which the copper alloy of the present invention is twisted is improved. Manufacture method of Casson copper alloy 裎 Φ, Α Α The first use of atmospheric melting furnace, 12 201003674 will be electrolytic copper, Ni, Si, c. Wait for the raw material to dissolve you. The melt is then cast into a cast chain. It;::,: melted into it and repeated cold rolling and heat treatment, 仃...calendering, strip or box of sex.敎Processing package..."has the required thickness and speciality...in solution treatment and aging treatment. The solid solution is heated at a high temperature of about 700~1000. The particles are solid-dissolved in the Cu matrix. At the same time, :- phase heat is used for solid solution treatment. In the aging treatment, the temperature range of (4) 35〇~= 55〇C is heated for more than 丨 hours, so that the second phase particle material has been solidified in the solution treatment. In the aging treatment, the strength and electrical conductivity are increased. In order to obtain higher strength, cold rolling is sometimes performed before the aging treatment and/or after the aging treatment. Then, in the case of cold rolling, stress relief annealing (low temperature annealing) is performed after cold rolling. In the interval of the above steps, the grinding, grinding, and beading of the rust scale for removing the surface are appropriately performed (sh〇 Tblast) pickling, etc. The copper alloy of the present invention is basically also subjected to the above-described process, but in order to control the deviation of the average crystal grain size and the crystal grain size within the range specified in the present invention, as described above, it is important In the preceding stage of the solution treatment step, the fine second phase particles are preliminarily precipitated into the copper matrix phase at equal intervals as much as possible. In order to obtain the copper alloy of the present invention, it is particularly necessary to pay attention to the following viewpoints. First of all, 'the coarse crystals will inevitably be produced during the solidification process during casting'. In the cooling process during casting, coarse precipitates will inevitably occur. Therefore, in the subsequent steps, the crystals must be crystallized. Solid solution 13 201003674 In the parent phase, if 950 ° C ~ 105 (rc is held for more than hrs after rc, and the temperature at the end of hot rolling is set to 85 (rc or more), even if Co is added Further, when it is added, the crystal may be dissolved in the matrix phase. 95 (The temperature condition above TC is higher than that of other Carson-based alloys. If hot rolling If the temperature is less than 950 °C, the solid solution will be insufficient. If it exceeds 1〇5〇t, the material may melt. If the temperature at the end of hot rolling is less than 85〇t, it will be solid solution. The elements will be precipitated again. Therefore, it is difficult to obtain high strength. Therefore, in order to obtain high strength, it is preferable to heat-calender at 85 (TC) and rapidly cool. At this time, if the cooling rate is slow, the si-based compound containing c〇 or Cr will be precipitated again. When the heat treatment (aging treatment) for increasing the strength is carried out by using such a composition, the precipitate which precipitated during the cooling process is the core and grows into a coarse precipitate which does not contribute to the improvement of strength, so that high strength cannot be obtained. Therefore, it is necessary to increase the cooling rate as much as possible, specifically, Η ° C / s or more. However, at a temperature of up to about 40 rc, the precipitation of the second phase particles is significant, so it is less than 4 〇. The cooling rate in the case of 〇 is not a problem. Therefore, in the present invention, the material temperature is from 85 (TC to 400. (The average cooling rate is set to 15 ° C / s or more, preferably 20 〇 C / s or more. And cooling. The so-called "average cooling rate from 850t: down to 4001" is measured by cooling the material temperature from 850 ° C to 650 T: and by "(850-400 ) ( t: ) / cooling Time (s), and the calculated value (t / s). As a way to speed up cooling, water cooling is most effective. However, the cooling rate varies depending on the temperature of the water used for water cooling, so that the cooling can be accelerated by performing the water temperature 14 201003674 management. If the soil is more than 25 c, the helmet will sometimes be given the required cooling rate, so the material will be kept below 25 °C. If the material is put into the tank of the water storage and becomes 25y m " then the temperature of the water will rise and the temperature is more than 2 5 C, so it is better to use the mist rod 喰 + service (shower or mist) In order to prevent the water from rising, the material is cooled according to the fixed water temperature (2 ^ ^ M), or the constant low temperature water is allowed to flow in the water tank. Also, the water-cooled nozzle of the 曰 right increases the speed per unit time. In the water of the crucible, it is also possible to cool the crucible: cold calendering is carried out after hot rolling. In order to precipitate the precipitates and apply the cold rolling to increase the distortion at the deposition position, it is preferable to carry out the cold reduction at a rolling reduction ratio of 85 / 〇 or more, and to perform cold rolling at 95% or more. Calendering. If the film is not pushed, the person is two, and the solution is cold-rolled and the solution treatment is carried out shortly after the hot rolling, the precipitates are precipitated uniformly. The combination of hot rolling and subsequent cold rolling can also be appropriately repeated. The first aging treatment is performed after the cold rolling. If you implement this step

Before the second phase particles remain, it is a luxury. A Ding Tian knows that in this step, the second phase particles will grow further, because the second phase particles and particle size will be precipitated in the first step. There is a difference, but in the steps of the previous paragraph,

The one-phase particles are almost eliminated, and 闵仏, WA, so that the fine second phase particles can be uniformly precipitated in a uniform size. ',', and when the temperature is too low at the time of the right first treatment, the amount of precipitation of the second phase particles which causes the pinning effect is reduced, and only the nailing effect produced by the solution treatment can be partially obtained. Therefore, the size of the crystal grains becomes different. If the aging temperature is too high, the second phase particles become coarse, 15 201003674, and since the second phase particles are precipitated unevenly, the particle size of the second phase particles The size will become uneven. Further, the longer the aging time is, the longer the second phase particles grow. Therefore, it is necessary to set an appropriate aging time. The first aging treatment is performed at 350 to 50 (TC for 1 to 24 hours, preferably at a temperature of 350 C or higher and less than 400 ° C for the first aging treatment for 12 to 24 hours, and for 40 (TC or higher and not The first aging treatment is carried out at a temperature of 45 〇t for 6 to 12 hours, and the first aging treatment is performed at a temperature of 45 (TC or more and less than 5 〇〇 ti for 3 to 6 hours), thereby making the second fine : The particles are uniformly precipitated into the matrix phase. If the composition is such a composition, the growth of the recrystallized grains produced by the solution treatment in the next step can be similarly pinned, so that the deviation of the crystal grain size can be obtained. After the first aging treatment, the solution treatment is carried out. Here, the second phase particles are allowed to grow, and the fine and uniform recrystallized grains are grown. Therefore, the solution temperature must be set to 95 (rc) ~1〇5〇乞. Here, the recrystallized grain grows first and then the second phase particles precipitated in the HI first aging treatment are solid-solved, so that the growth of the recrystallized grain can be controlled by the pinning effect. Because the pinning effect disappears after the second phase particles are solid solution, if it is long When the solid solution treatment is continued, the recrystallized grains will become larger. Therefore, the time for the appropriate solution treatment is 60 seconds to 300 seconds at a temperature above 95 CTC and less than 1 〇〇〇t. Preferably, it is 120 to 180 seconds; at 1 〇〇 (rc is above and not deleted) (: the temperature is 3 sec seconds ~ just seconds, preferably seconds ~ 1200 seconds. Even after solution treatment During the cooling process, in order to avoid precipitation of the first phase particles, the material temperature is reduced from 85 (rc to 4 〇 (the average cooling time when rc is 16 201003674 郃 speed should be 15% / s or more, preferably should be 2 〇. /s or more. After the mouth/glutination treatment, the second aging treatment is carried out. The condition of the second aging treatment may be a condition that is useful for the miniaturization of the precipitates, but the staff and the time are set so that The precipitates are not coarsened. One of the conditions for aging treatment is, for example, a temperature range i J牿 of 35 〇, more preferably 400 to 500. (: The temperature range is 1 to 24 hours. The subsequent cooling rate will hardly cause the size of the precipitate; the situation before the first day of ruling When the precipitation position is increased, the precipitation position is used to promote age hardening, and the strength is improved. In the second case, the precipitate is used to promote work hardening, thereby increasing the strength, and the second aging effect. Cold rolling is performed before and/or after the treatment.

The "Cu-Ni-S Bu Co series and alloys of the present invention can be processed into various copper-stretching products. For example, the sheets can be used as plates, strips, posts, rods and wires. In addition, the Cu_Ni_Si_c-based copper alloy of the present invention can be used for Electronic components such as lead frames, connectors, pins, terminals, relays, switches, and foils for secondary batteries. [Embodiment] Hereinafter, the embodiments of the present invention and comparative examples are defined to further define the present invention, but the present invention and its advantages are provided by the present invention, and are not provided in the south. In the unheating furnace, the copper composition of the composition disclosed in Table 1 (Examples and Table 2) was obtained by 130 (rc), and the prayer was made into a casting having a maximum degree of 3 mm. Next, the casting spin was heated to 100 (after TC, the weight was increased until the sheet thickness was 1 Gmm, and the rising temperature (temperature at which the hot rolling 17 201003674 was completed) was set to 900. (:: hot rolling After the end, the average cooling rate when the material temperature was lowered from 850 ° C to 400 ° C was set to 18 ° C / s, and then water-cooled, and then placed in the air for cooling. Second, in order to remove the surface rust The surface was cut to a thickness of 9 mm, and then a plate having a thickness of 〇15 mm was formed by cold rolling. Then, after performing the first aging treatment for 3 to 12 hours at various aging temperatures, The solution treatment was carried out at a melting temperature for 1 20 seconds, and immediately after the temperature of the material was lowered from 850 ° C to 400 ° C, the average cooling rate was set to 18. (: / s, water-cooled, and then placed in the air. Cooling is carried out. Secondly, cold rolling is carried out until the thickness is 0.1 〇mm, and the second aging treatment is carried out in an inert atmosphere at 45 ° C for 3 hours, and finally cold rolling is performed until the thickness is 0.08 mm. Manufacturing test In the following, various characteristics of each test piece obtained in the above manner were evaluated. (1) Average crystal grain size Regarding the crystal grain size, the sample was observed to have a cross section parallel to the thickness direction of the rolling direction, and the sample was sampled. Buried to a resin towel, using a mechanical ^: observation surface for mirror polishing, in a solution of relative water volume of σ ^ 0 罝 之 36 36 36 36 = = = = = 5% by weight of gasified iron. The sample is immersed in the liquid in the above manner for U) seconds to cause the metal composition to appear. Secondly, the lens is enlarged (10) times the composition of the above metal. 'Evaluate the average value of all the surrounding nodes for each observation field, and observe 18 201003674 as the average crystal grain size. (2) The average value of the difference between the maximum crystal grain size and the minimum crystal grain size is about obtaining the average crystal grain. The crystal grain size measured at the time of the diameter is determined by the difference between the maximum value and the minimum value of the needle and the parent field, and the average value of the observed field of view is taken as the average value of the difference between the maximum crystal grain size and the minimum crystal grain size. C 3 ) Intensity off In the strength, the tensile test in the parallel direction of rolling is performed, and the endurance of the test piece (YS: MPa) is measured. The deviation of the strength of the measured portion is the difference between the maximum strength and the minimum intensity at the river, and the average strength is the 3 () (4) Conductivity The conductivity (EC.% IACS) is determined by measuring the volume resistivity of the double bridge. The deviation of the conductivity of the measurement site is the maximum intensity. The difference between the minimum strength and the average conductivity is the average value. (5) The stress relaxation property is about the stress relaxation property as shown in Fig. 1. It is processed to a width of 10 mm X length HHhnm thickness t = 0.18 mm On each test piece, the gauge length is 25, and the load stress on the height is 〇2%. The height is determined by the way of the force, and the bending stress is applied, and 15 〇 is applied. . The amount of permanent deformation (height) y shown in Fig. 2 after heating for 1 hour is measured to calculate the stress relaxation rate {[1- (y-yi) (mm) / (y〇syi) (mm)] xl 〇〇(%)}. Furthermore, y! is the initial warpage height before the load stress. The deviation of the stress relaxation rate at the measurement site is the difference between the maximum strength and the minimum strength at 30 points, and the average 19 201003674 stress relaxation rate is the average of the 30 points. (6) Bending workability · Regarding the bending process 忖 / ^ , it is estimated by the rough surface of the curved part. According to jiS H 3130 $ / τ chair degree - direction into the Badway (bending axis and rolling direction is the same as the measured W bending test, using a conjugate focal laser microscope to analyze the curved surface 3, find JIS B _1 specifies the Ra (the deviation of the bending thickness of the 疋 part is the maximum Ra at the 3 〇 - the most / the difference 'the average bending thickness is the average of the Ra of the 30. 20 201003674 [I丨I ΐ

1 bending thickness deviation 〇V*) οο ο r-d ο CN 00 ο οο, 0.74 00 ο § o CN 〇CN 00 o 〇\ o 〇〇d OO o in Ό 〇ίο ogo 00 Ό 〇oo 1 00寸·— CN inch· οο inch σ\ CN inch _ 00 CO 〇\ i〇cn one Γ inch inch m ro On ΓΊ Ό ΓΟ rn \〇CO inch inch strength deviation 〇Ό 沄 ΓΛm ΓΛ (Ν m (N m On (N 00 IT) r〇r〇m CN m ό m Pan OS <NP; Average Bending (Aim) 〇(Ν ι〇Ο) 丨, _·镐On 00 00 ΟΝ Ο) 1—^ Ο) » —< SS S oi —_H CT\ 1—^ o δ 1—H 00 On to O) 1 HO) ss 〇rs o <N Average stress relaxation rate (%) Ό OO 00 \〇00 C4 ΟΝ cn ON (S On 00 OO ss v〇00 vo OO VO OO <N ON Average Conductivity (%IACS) Swallowing 沄σ; 〇> 妄 妄 »ri £ 〇00 in Ό 00 Ό 00 ο 〇 ο ΟΝ 00 Ό Os 00 00 om CTs CN On g 00 OO ^r> ss jn 00 ori 〇\ o Os vn <N On WJ rN On o 〇\ 〇〇\ Maximum particle size - Minimum particle size (//m) 〇\ ν〇 inch\Τ\ m inch 呀tn OO inch ΓΛ inch Ό inch vr> average Crystal grain size (//m) 00 (Ν <N οο (Ν ο m fN 〇\ Ό €N m (N 2 卜m CN σ\ OO \〇<N <N 00 solution temperature (°C 〇σ\ Ο ν〇On ο ν〇Os ο νη 〇\ 1000 1000 ο ν〇Ον 〇vr> 1000 1000 〇\ 沄Os oi/Ί 〇\ oi〇〇\ 1000 1000 Pan ON On Pan 1000 1000 aging temperature (°C) 沄m 〇 inch Ο ο ι〇ο $ ο ιη Ο 4 ο oo rn 〇 inch ool〇oo in o 〇i〇om inch o 1/Ί composition (mass%) Other 0.1 Mg 0.1 Mg O.lMg O.lMg O.lMg 1 O.lMg O.lMg O.lMg <N (N 〇(M o (N o rN o CN o <N 〇CN 〇<N 〇(N 〇VD Ο o Ό ο Ιη Ό Ο ι/Ί Ο ιη ν〇ο VO ο Ό oo vo oo \〇o' Ό 〇o V〇Ό 〇vo o' VO o VO o V~) o Vi 'O o Ο o ο Ο Ο ο ο Oooooqoo 〇ooo S p οο 00 οο 00 οο οο οο OO OO OO OO 〇〇OO 00 00 00 00 00 00 00 00 〇Γ*Η (N Γ〇 inch ο 00 00 as ◦ y ^ & N N N N N N N N 00 On »—H 13 201003674 [z_l bending deviation 0.82 0,70 0.79 0,0 o' IT) ^vO o' I- , 0.64 o (N o 0.77 o 1—^ Γ- o 0.76 甽 inch' (Ν inch·rn inch-inch (N inch 〇> m inch 00 ΓΛ rW ΓΛ* rn inch m* r- r〇m * Strength deviation ro mm ΓΟ <N ΓΟ (N m 0*\ (N 沄 average bending thickness (βτη) Ο) 00 Ο) (N On 1—^ § g G\ 00 ψ·^ oo oo § ίη 〇 \ § in oo ΓΛ OO FH Average stress relaxation rate (%) Ό ΟΟ Ό 00 £S oo £ 00 00 ss 00 SB Ό 00 OO 00 oo 00 oo 00 00 Average conductivity (%IACS) 沄, etc. m ^ &lt ;Τ) Ο ^Τ) ΟΟ oo 〇fN 〇\ wo r—^ o\ o ΓΟ 〇\ in (N 〇\ § OO § 00 〇oo oo 00 00 oo Maximum particle size - minimum particle size (#m) IT) 寸 inch \r\ IT) inch ir> inch average crystal grain size (Um) CN <Ν Os 00 oo 00 〇\ 宕〇\ oo On oo Solution temperature (°C) ο 〇\ Ο Ον On OS 〇to C*\ 沄ON o 〇\ 沄σ\ o in G\ o to o On o 〇\ 〇»/Ί 0's 〇\ aging temperature (°C): ο Ο Ο ol〇o 〇oo ^T) o VO o 〇o 〇to o Composition (% by mass) Other 0.5Sn 0.5Zn 0.1 Ag 0.5Sn 0.5Zn 0.1 Ag <N 〇(N o CN o CN 〇<N o (N o <N 〇0.54 , -1 0.54 1 0.54 I -1 1 0.54 00 d 1—^ 00 d 00 o OO o 0.65 VO o iri VO o \〇 o 〇ο Ό Ο o 〇in W^i in iy-> 〇ooopz ΟΟ 00 00 00 00 00 oo oo OO 00 00 00 00 〇Z »—I <Ν rs (Ν (N \D iN oo (N The alloy of 〇\rsj <N m 201003674 4 is an embodiment of the present invention, and has an electric power suitable for an electronic material and an electric conductivity of a thunder, and has a small variation in characteristics. , ~ 7 46~48 alloy is not subjected to the first aging treatment, Yugu

At the time of the melting treatment, the crystal grain size becomes coarse, and the strength and the bending workability are deteriorated. Regarding the alloys of Νο·38, 39, 42, 44, 49, 50, since the first effect temperature of the first effect treatment is too low, the second phase particles are less, so that the crystal grain size changes during solution treatment. The coarseness causes deterioration in strength and bending processability. Moreover, the variation in crystal grain size increases. As a result, the variation in characteristics becomes large. In the alloys of Nos. 40, 41, 43, 45, and 51 to 54, since the aging temperature of the first aging treatment was too high, the second phase particles were unevenly grown, and thus the crystal grain size was uneven. As a result, the variation in characteristics becomes large. Regarding No. 55 and 56, since the addition amount of Co is too large, the strength and electrical conductivity are deteriorated. Νο·57~60 was not subjected to the first aging treatment, and the solution heat temperature was low. The first phase particles are not sufficiently solid-solved. Further, since the crystal grains are too small, the strength and stress relaxation characteristics are deteriorated. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an explanatory diagram of a stress relaxation test method. Fig. 2 is an explanatory diagram of the amount of permanent deformation of the stress relaxation test method. [Explanation of main component symbols] 1 gauge length t thickness 23 201003674 y permanent deformation (height) y〇 degree 24

Claims (1)

201003674 VII. Patent application scope: '丨The main electric power is made of copper alloy II? 〇~2.5 mass%, co: 〇.5~2·5 mass%, & 〇3, peas set% 'The remainder is composed of CU and unavoidable impurities; its average crystal grain size is $15~30 /zm, the average value of the difference between the maximum crystal grain size and the minimum crystal grain size of each of the observation fields 〇5 job 2 is as follows. 2. The copper alloy for electronic materials according to the scope of the patent application, wherein one step contains the most 〇·5 Mass % of Cr. 3. The copper alloy for an electronic material according to the first or second aspect of the invention, which further comprises a total of 0 to 5% by mass of one or more selected from the group consisting of Mg, Mn and Ag: P. The steel alloy for electronic materials according to any one of the above-mentioned claims, wherein the total amount is 〇2.0% by mass selected from "and one or two kinds." The copper alloy for electronic materials of any one of items 1 to 4, wherein the towel further contains one selected from the group consisting of As, Sb, Be, B, Τι, Zr, A1, and Fe, or a total of 〇~2.0 mass#% or The method for producing a copper alloy is the copper alloy for electronic materials according to any one of claims 1 to 5, which comprises the following steps: / 1 ' The ingot of the desired composition is subjected to melt casting; in step 2, heat is rolled at 95 (rc~1050 °C for 1 hour), and the temperature at the end of hot rolling is set to 85 (rc or more, which will be from 850 to The average cooling rate of 400 C is set to i5; cooling is performed above t/s; 25 201003674 Step 3, cold rolling with a working degree of 85% or more; Step 4 'heating at 3 50~500 °C i~24 The aging time of the step is 5, solid solution treatment at 950 ° C ~ 1050 ° C, the material temperature is lowered from 85 CTC to 4 0 (the average cooling rate of TC is set to irc/s or more for cooling; step 7, aging treatment; and step 8, for random cold rolling. Item 7: Copper, which has the patent application scope 1 ~5 items of the copper alloy for the electronic material of Beibei. 8. A mine of any one of the electronic devices. It has a copper alloy for electronic materials in the first to fifth pages of the patent application. VIII. As the next page) 26