TW202505713A - 多晶片模組基板 - Google Patents

多晶片模組基板 Download PDF

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Publication number
TW202505713A
TW202505713A TW113111954A TW113111954A TW202505713A TW 202505713 A TW202505713 A TW 202505713A TW 113111954 A TW113111954 A TW 113111954A TW 113111954 A TW113111954 A TW 113111954A TW 202505713 A TW202505713 A TW 202505713A
Authority
TW
Taiwan
Prior art keywords
substrate
sealing layer
resin
mounting substrate
manufactured
Prior art date
Application number
TW113111954A
Other languages
English (en)
Chinese (zh)
Inventor
仲田和貴
河田優奈
鈴木達也
米田一善
Original Assignee
日商太陽控股股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商太陽控股股份有限公司 filed Critical 日商太陽控股股份有限公司
Publication of TW202505713A publication Critical patent/TW202505713A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW113111954A 2023-03-31 2024-03-29 多晶片模組基板 TW202505713A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-057852 2023-03-31
JP2023057852 2023-03-31

Publications (1)

Publication Number Publication Date
TW202505713A true TW202505713A (zh) 2025-02-01

Family

ID=92906883

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113111954A TW202505713A (zh) 2023-03-31 2024-03-29 多晶片模組基板

Country Status (5)

Country Link
JP (1) JPWO2024204710A1 (https=)
KR (1) KR20250159198A (https=)
CN (1) CN120981918A (https=)
TW (1) TW202505713A (https=)
WO (1) WO2024204710A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7764986B1 (ja) * 2025-04-04 2025-11-06 ａｒｔｉｅｎｃｅ株式会社 中空電子部品封止用樹脂シートおよび中空電子部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4464693B2 (ja) 2004-01-20 2010-05-19 東海カーボン株式会社 半導体封止材用カーボンブラック着色剤およびその製造方法
JP2014183085A (ja) 2013-03-18 2014-09-29 Dainippon Printing Co Ltd マルチチップモジュール用基板、マルチチップモジュール用多層配線基板、マルチチップモジュール及びマルチチップ多層配線モジュール
JP6981024B2 (ja) * 2017-03-24 2021-12-15 住友ベークライト株式会社 封止用樹脂組成物および半導体装置

Also Published As

Publication number Publication date
JPWO2024204710A1 (https=) 2024-10-03
KR20250159198A (ko) 2025-11-10
WO2024204710A1 (ja) 2024-10-03
CN120981918A (zh) 2025-11-18

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