KR20250159198A - 멀티칩 모듈 기판 - Google Patents

멀티칩 모듈 기판

Info

Publication number
KR20250159198A
KR20250159198A KR1020257032443A KR20257032443A KR20250159198A KR 20250159198 A KR20250159198 A KR 20250159198A KR 1020257032443 A KR1020257032443 A KR 1020257032443A KR 20257032443 A KR20257032443 A KR 20257032443A KR 20250159198 A KR20250159198 A KR 20250159198A
Authority
KR
South Korea
Prior art keywords
substrate
sealing layer
resin
resin composition
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257032443A
Other languages
English (en)
Korean (ko)
Inventor
카즈타카 나카다
유나 카와타
타츠야 스즈키
카즈요시 요네다
Original Assignee
다이요 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 홀딩스 가부시키가이샤 filed Critical 다이요 홀딩스 가부시키가이샤
Publication of KR20250159198A publication Critical patent/KR20250159198A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H01L23/14—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H01L23/13—
    • H01L23/29—
    • H01L23/3107—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020257032443A 2023-03-31 2024-03-29 멀티칩 모듈 기판 Pending KR20250159198A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023057852 2023-03-31
JPJP-P-2023-057852 2023-03-31
PCT/JP2024/013038 WO2024204710A1 (ja) 2023-03-31 2024-03-29 マルチチップモジュール基板

Publications (1)

Publication Number Publication Date
KR20250159198A true KR20250159198A (ko) 2025-11-10

Family

ID=92906883

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257032443A Pending KR20250159198A (ko) 2023-03-31 2024-03-29 멀티칩 모듈 기판

Country Status (5)

Country Link
JP (1) JPWO2024204710A1 (https=)
KR (1) KR20250159198A (https=)
CN (1) CN120981918A (https=)
TW (1) TW202505713A (https=)
WO (1) WO2024204710A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7764986B1 (ja) * 2025-04-04 2025-11-06 ａｒｔｉｅｎｃｅ株式会社 中空電子部品封止用樹脂シートおよび中空電子部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206621A (ja) 2004-01-20 2005-08-04 Tokai Carbon Co Ltd 半導体封止材用カーボンブラック着色剤およびその製造方法
JP2014183085A (ja) 2013-03-18 2014-09-29 Dainippon Printing Co Ltd マルチチップモジュール用基板、マルチチップモジュール用多層配線基板、マルチチップモジュール及びマルチチップ多層配線モジュール

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6981024B2 (ja) * 2017-03-24 2021-12-15 住友ベークライト株式会社 封止用樹脂組成物および半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206621A (ja) 2004-01-20 2005-08-04 Tokai Carbon Co Ltd 半導体封止材用カーボンブラック着色剤およびその製造方法
JP2014183085A (ja) 2013-03-18 2014-09-29 Dainippon Printing Co Ltd マルチチップモジュール用基板、マルチチップモジュール用多層配線基板、マルチチップモジュール及びマルチチップ多層配線モジュール

Also Published As

Publication number Publication date
JPWO2024204710A1 (https=) 2024-10-03
TW202505713A (zh) 2025-02-01
WO2024204710A1 (ja) 2024-10-03
CN120981918A (zh) 2025-11-18

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