Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
  • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
  • H10W70/69—Insulating materials thereof
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/02—Elements
  • C08K3/04—Carbon
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L101/00—Compositions of unspecified macromolecular compounds
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
  • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
  • H10W70/68—Shapes or dispositions thereof
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
  • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Definitions

• the present invention relates to a mounting board, and more specifically to a mounting board in which a surface of a substrate on which multiple semiconductor chips are mounted is sealed with a sealing layer.
• Sealing of chip-type devices such as semiconductor elements and electronic components has traditionally been performed by transfer molding using a powdered epoxy resin composition, or potting, dispensing, printing, etc. using a liquid epoxy resin composition or silicone resin.
• resin compositions for sealing materials are usually composed of epoxy resin, hardener, hardening accelerator, inorganic filler, colorant, etc., and are colored to prevent electrical defects caused by photoexcited currents generated when light strikes the chip and to suppress the occurrence of die marks (for example, Patent Document 1).
• the main objective of the present invention is therefore to provide a mounting board that can suppress the occurrence of die marks.
• the inventors focused on the thickness of the semiconductor chip and the thickness of the sealing layer and discovered that if the thickness of the semiconductor chip and the thickness of the sealing layer are within a specified range and the colorant contained in the cured product of the curable resin composition that constitutes the sealing layer is mixed in a specified ratio, the occurrence of die marks can be suppressed even on a mounting board.
• the present invention is based on this discovery. That is, the gist of the present invention is as follows.
• a substrate A plurality of semiconductor chips mounted on at least one surface of the substrate; a sealing layer that covers the substrate surface on which the plurality of semiconductor chips are mounted;
• a mounting board comprising: In the thickness direction of the mounting substrate, when the thickness of the sealing layer is T and the distance from the upper surface of each semiconductor chip mounted on the substrate to the surface of the sealing layer is t n , T: tn is 10:1.0 to 10:5.0;
• the mounting substrate wherein the sealing layer is made of a cured product of a curable resin composition containing a colorant in a proportion of 0.60 to 4.0 mass %.
• tn is 50 ⁇ m or more.
• the present invention by setting the thickness of the semiconductor chip and the thickness of the sealing layer within a predetermined range and by setting the colorant contained in the cured product of the curable resin composition that constitutes the sealing layer at a predetermined blend ratio, it is possible to obtain a mounting board that can suppress the occurrence of die marks.
• FIG. 1 is a front view of a mounting board according to an embodiment of the present invention.
• FIG. 2 is a cross-sectional view taken along line X-X' of the front view of FIG.
• FIG. 3 is a schematic cross-sectional view of a dry film used to form the encapsulation layer.
• a mounting board including a substrate, a plurality of semiconductor chips mounted on at least one surface of the substrate, and a sealing layer that covers the substrate surface on which the plurality of semiconductor chips are mounted, In the thickness direction of the mounting substrate, when the thickness of the sealing layer is T and the distance from the upper surface of each semiconductor chip mounted on the substrate to the surface of the sealing layer is t n , T: tn is 10:1.0 to 10:5.0;
• the sealing layer is characterized in that it is made of a cured product of a curable resin composition containing a colorant in a proportion of 0.60 to 4.0 mass %.
• FIG. 1 is a front view of a mounting board according to an embodiment of the present invention
• FIG. 2 is a cross-sectional view of the front view of FIG. 1 taken along the line XX'.
• the mounting board 1 includes a substrate 10 and a sealing layer 30 that covers the main surface of the substrate 1 on which a plurality of semiconductor chips 201, 202, ..., 216 are mounted.
• Three to six (six in FIG. 1) of the plurality of semiconductor chips 201, 202, ..., 216 constitute one unit 20A, 20B.
• the adjacent units 20A and 20B are separated by a predetermined interval.
• a conductor circuit is patterned on the surface of the substrate 10 in addition to the substrate 10 and the semiconductor chips 201, 202, ..., 216.
• the sealing layer 30 is provided to have a predetermined thickness (T) so as to cover the main surface of the substrate 10.
• the sealing layer 30 is provided so as to have distances t1 , t2 , t3 from the upper surfaces of the semiconductor chips 211, 212, 213, ... mounted on the main surface of the substrate 10 to the surface of the sealing layer 30.
• T predetermined thickness
• the substrate used in the mounting board according to the present invention may be a conventionally known one.
• the substrate include printed wiring boards and flexible printed wiring boards on which circuits have been formed in advance using copper or the like, as well as copper-clad laminates for high-frequency circuits using materials such as paper phenol, paper epoxy, glass cloth epoxy, glass polyimide, glass cloth/non-woven cloth epoxy, glass cloth/paper epoxy, synthetic fiber epoxy, fluororesin/polyethylene/polyphenylene ether, polyphenylene oxide/cyanate, and the like, and copper-clad laminates of all grades (such as FR-4), as well as metal substrates, polyimide films, polyethylene terephthalate (PET) films, polyethylene naphthalate (PEN) films, glass substrates, ceramic substrates, and wafers (including wafers before being singulated).
• PET polyethylene terephthalate
• PEN polyethylene naphthalate
• the thickness of the substrate is not particularly limited, but is preferably 3.0 mm or less, more preferably 2.0 mm or less, even more preferably 1.0 mm or less, and is preferably 0.1 mm or more, more preferably 0.2 mm or more, even more preferably 0.5 mm or more. If the thickness of the substrate is within the above range, the thickness of the entire mounting substrate can be reduced while maintaining its strength.
• the semiconductor chips used in the mounting board according to the present invention are not particularly limited in terms of size, thickness, material, color, attachment, function, etc., and any type of semiconductor chip known in the art can be used.
• the semiconductor chips here include, in addition to normal semiconductor chips, surface acoustic wave filter elements (SAW filter elements), crystal oscillator elements, high frequency elements, acceleration sensors, etc.
• the mounting board of the present invention comprises a plurality of (at least two or more) semiconductor chips constituting one unit.
• the number of semiconductor chips contained in one unit is not particularly limited as long as it is at least two or more, but may be 50 or less, and preferably 2 to 10 or less.
• the semiconductor chips contained in one unit may all have different shapes or colors, or some of them may have the same shape or color.
• the distance between adjacent units may be 1 mm or less, or may be 0.4 to 0.7 mm.
• the distance between adjacent semiconductor chips constituting one unit may be 0.1 to 1 mm, or may be 0.2 to 0.6 mm.
• the semiconductor chip mounted on the substrate does not necessarily need to be arranged so that no gap occurs between the substrate and the semiconductor chip.
• the substrate and the semiconductor chip may be arranged so that a certain gap occurs between them.
• the sealing layer is provided to have a predetermined thickness (T) so as to cover the main surface of the substrate.
• the sealing layer is also provided so that the upper surface of each semiconductor chip mounted on the substrate and the upper surface of the sealing layer have a predetermined distance (t n ).
• the thickness of the sealing layer is adjusted so that, in the thickness direction of the mounting substrate, the thickness of the sealing layer is T, and the distance from the upper surface of each semiconductor chip mounted on the substrate to the surface of the sealing layer is t n , and the ratio of T:t n is 10:1.0 to 10:5.0.
• the thickness T of the sealing layer refers to the distance from the surface of the substrate on which the semiconductor chip is mounted to the surface of the sealing layer.
• the cured product of the curable resin composition constituting the sealing layer contains a colorant at a ratio of 0.60 to 4.0 mass %, and the thickness of the sealing layer is adjusted so that the thickness of the semiconductor chip and the thickness of the sealing layer have a predetermined relationship as described above, and even if the mounting substrate has different sizes and colors of the individual semiconductor chips mounted thereon, the occurrence of die marks can be suppressed.
• the preferred range of T: tn is 10:2.0 to 10:4.0.
• the thickness (T) of the sealing layer is adjusted so as to satisfy the above-mentioned relationship, but in a mounting substrate such as a thin package substrate, the thickness (T) of the sealing layer may be set to 500 ⁇ m or less.
• the thickness (T) of the sealing layer is preferably 100 to 500 ⁇ m, more preferably 150 to 400 ⁇ m.
• each semiconductor chip may have a different shape, but the range of tn is preferably 50 ⁇ m or more.
• the sealing layer does not fill the gap (i.e., so that the sealing layer does not creep in).
• the composition of the curable resin composition used to form the sealing layer is not particularly limited, but as described above, it contains a colorant at a ratio of 0.60 to 4.0 mass %.
• the curable resin composition usually contains a thermosetting resin, a curing agent, an inorganic filler, etc. The curable resin composition will be described below.
• thermosetting resin is not particularly limited, and known thermosetting resins such as resins having a cyclic ether group and/or a cyclic thioether group, polyisocyanate compounds, blocked isocyanate compounds, melamine resins, benzoguanamine resins, and other amine resins and their derivatives, bismaleimide, oxazine, cyclocarbonate compounds, carbodiimide resins, etc., can be used.
• epoxy resins can be preferably used.
• the epoxy resin is a resin having an epoxy group, and any of the conventionally known epoxy resins can be used. Examples include bifunctional epoxy resins having two epoxy groups in the molecule, and polyfunctional epoxy resins having three or more epoxy groups in the molecule. Hydrogenated epoxy resins may also be used.
• the curable resin composition contains at least one of semi-solid epoxy resins and crystalline epoxy resins as the epoxy resin. The semi-solid epoxy resins and crystalline epoxy resins can be used alone or in combination of two or more.
• the curable resin composition may also contain a solid epoxy resin or a liquid epoxy resin.
• a solid epoxy resin refers to an epoxy resin that is solid at 40°C
• a semi-solid epoxy resin refers to an epoxy resin that is solid at 20°C and liquid at 40°C
• a liquid epoxy resin refers to an epoxy resin that is liquid at 20°C.
• Semi-solid epoxy resins include bisphenol A type epoxy resins such as Epicron 860, Epicron 900-IM, Epicron EXA-4816, and Epicron EXA-4822 manufactured by DIC Corporation, Araldite AER280 manufactured by Asahi Chiba Corporation, Epotohto YD-134 manufactured by Tohto Kasei Co., Ltd., jER834 and jER872 manufactured by Mitsubishi Chemical Corporation, and ELA-134 manufactured by Sumitomo Chemical Co., Ltd.; naphthalene type epoxy resins such as Epicron HP-4032 manufactured by DIC Corporation; and phenol novolac type epoxy resins such as Epicron N-740 manufactured by DIC Corporation.
• the semi-solid epoxy resin preferably contains at least one selected from the group consisting of bisphenol A type epoxy resin, naphthalene type epoxy resin, and phenol novolac type epoxy resin.
• Tg glass transition temperature
• crystalline epoxy resins having a biphenyl structure, a sulfide structure, a phenylene structure, a naphthalene structure, etc.
• Biphenyl type epoxy resins are provided, for example, as jER YX4000, jER YX4000H, jER YL6121H, jER YL6640, and jER YL6677 manufactured by Mitsubishi Chemical Corporation.
• Diphenyl sulfide type epoxy resins are provided, for example, as Epotohto YSLV-120TE manufactured by Tohto Kasei Co., Ltd.
• Phenylene type epoxy resins are provided, for example, as Epotohto YDC-1312 manufactured by Tohto Kasei Co., Ltd.
• Naphthalene type epoxy resins are provided, for example, as EPICLON HP-4032, EPICLON HP-4032D, and EPICLON HP-4700 manufactured by DIC Corporation.
• crystalline epoxy resins such as Epotohto YSLV-90C manufactured by Tohto Kasei Co., Ltd. and TEPIC-S (triglycidyl isocyanurate) manufactured by Nissan Chemical Industries, Ltd. can also be used.
• Solid epoxy resins include naphthalene-type epoxy resins such as DIC's HP-4700 (naphthalene-type epoxy resin), DIC's EXA4700 (tetrafunctional naphthalene-type epoxy resin), and Nippon Kayaku's NC-7000 (naphthalene skeleton-containing multifunctional solid epoxy resin); epoxidized products of condensation products of phenols and aromatic aldehydes having phenolic hydroxyl groups (trisphenol-type epoxy resins) such as Nippon Kayaku's EPPN-502H (trisphenol epoxy resin); and DIC's Epicron HP-7200H (dicyclopentadiene skeleton-containing multifunctional solid epoxy resin).
• DIC's HP-4700 naphthalene-type epoxy resin
• DIC's EXA4700 tetrafunctional naphthalene-type epoxy resin
• Nippon Kayaku's NC-7000 naphthalene skeleton-containing multifunctional solid epoxy resin
• biphenyl aralkyl type epoxy resins such as NC-3000H (biphenyl skeleton-containing multifunctional solid epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; biphenyl/phenol novolac type epoxy resins such as NC-3000L manufactured by Nippon Kayaku Co., Ltd.; novolac type epoxy resins such as Epicron N660, Epicron N690, and N770 manufactured by DIC Corporation and EOCN-104S manufactured by Nippon Kayaku Co., Ltd.; phosphorus-containing epoxy resins such as TX0712 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.; tris(2,3-epoxypropyl)isocyanurate such as TEPIC manufactured by Nissan Chemical Industries, Ltd., and the like.
• a solid epoxy resin By including a solid epoxy resin, the glass transition temperature of the cured product is increased, resulting in excellent heat resistance.
• Liquid epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AF type epoxy resins, phenol novolac type epoxy resins, tert-butyl-catechol type epoxy resins, glycidylamine type epoxy resins, aminophenol type epoxy resins, alicyclic epoxy resins, etc.
• liquid epoxy resins By including liquid epoxy resins, the dry film has excellent flexibility.
• the total amount of the semi-solid epoxy resin and the crystalline epoxy resin is preferably 5 to 40 mass% based on the total amount of epoxy resin, and more preferably 10 to 30 mass%. If it is within the above range, the curable resin composition will have excellent tackiness and flexibility when made into a dry film.
• thermoplastic resin may also include known and commonly used thermosetting resins such as isocyanate compounds, blocked isocyanate compounds, amino resins, benzoxazine resins, carbodiimide resins, cyclocarbonate compounds, polyfunctional oxetane compounds, and episulfide resins.
• thermosetting resins such as isocyanate compounds, blocked isocyanate compounds, amino resins, benzoxazine resins, carbodiimide resins, cyclocarbonate compounds, polyfunctional oxetane compounds, and episulfide resins.
• the curable resin composition preferably contains a curing agent.
• the curing agent include a compound having a phenolic hydroxyl group, a polycarboxylic acid and its acid anhydride, a compound having a cyanate ester group, a compound having an active ester group, a compound having a maleimide group, and an alicyclic olefin polymer.
• the curing agent can be used alone or in combination of two or more.
• the curable resin composition preferably contains at least one of a compound having a phenolic hydroxyl group, a compound having an active ester group, a compound having a cyanate ester group, and a compound having a maleimide group.
• a compound having a phenolic hydroxyl group and a compound having an active ester group it is possible to obtain a cured product with excellent adhesion to low-roughness substrates and circuits.
• a cyanate ester the Tg of the cured product is increased and heat resistance is improved
• a compound having a maleimide group the Tg of the cured product is increased and heat resistance is improved, and the CTE can be reduced.
• Examples of the compound having a phenolic hydroxyl group include conventionally known compounds such as phenol novolac resin, alkylphenol novolac resin, bisphenol A novolac resin, dicyclopentadiene type phenol resin, Xylok type phenol resin, terpene modified phenol resin, cresol/naphthol resin, polyvinylphenols, phenol/naphthol resin, ⁇ -naphthol skeleton-containing phenol resin, triazine skeleton-containing cresol novolac resin, biphenyl aralkyl type phenol resin, and Xylok type phenol novolac resin.
• conventionally known compounds such as phenol novolac resin, alkylphenol novolac resin, bisphenol A novolac resin, dicyclopentadiene type phenol resin, Xylok type phenol resin, terpene modified phenol resin, cresol/naphthol resin, polyvinylphenols, phenol/nap
• the compounds having a phenolic hydroxyl group those having a hydroxyl group equivalent of 100 g/eq. or more are preferred.
• dicyclopentadiene skeleton phenol novolac resin GDP series, manufactured by Gun-ei Chemical Industry Co., Ltd.
• Zylok type phenol novolac resin MEH-7800, manufactured by Meiwa Kasei Co., Ltd.
• biphenyl aralkyl type novolac resin MEH-7851, manufactured by Meiwa Kasei Co., Ltd.
• naphthol aralkyl type hardener SN series, manufactured by Nippon Steel & Sumitomo Metal Corporation
• triazine skeleton-containing cresol novolac resin LA-3018-50P, manufactured by DIC Corporation
• triazine skeleton-containing phenol novolac resin LA-705N, manufactured by DIC Corporation
• the compounds having a phenolic hydroxyl group those having a hydroxyl group equivalent of 100 g/eq. or more are preferred.
• dicyclopentadiene skeleton phenol novolac resin GDP series, manufactured by Gun-ei Chemical Industry Co., Ltd.
• Zylok type phenol novolac resin MEH-7800, manufactured by Meiwa Kasei Co., Ltd.
• biphenyl aralkyl type novolac resin MEH-7851, manufactured by Meiwa Kasei Co., Ltd.
• naphthol aralkyl type hardener SN series, manufactured by Nippon Steel & Sumitomo Metal Corporation
• triazine skeleton-containing cresol novolac resin LA-3018-50P, manufactured by DIC Corporation
• triazine skeleton-containing phenol novolac resin LA-705N, manufactured by DIC Corporation
• cyanate ester groups include phenol novolac type multifunctional cyanate ester resin (PT30S, manufactured by Lonza Japan), a prepolymer in which part or all of bisphenol A dicyanate has been triazine-converted into a trimer (BA230S75, manufactured by Lonza Japan), and cyanate ester resin containing a dicyclopentadiene structure (DT-4000, DT-7000, manufactured by Lonza Japan).
• the compound having an active ester group is preferably a compound having two or more active ester groups in one molecule.
• a compound having an active ester group can be obtained by a condensation reaction between a carboxylic acid compound and a hydroxy compound.
• a compound having an active ester group obtained by using a phenol compound or a naphthol compound as the hydroxy compound is preferable.
• phenol compounds or naphthol compounds include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, ⁇ -naphthol, ⁇ -naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadienyl diphenol, and phenol novolak.
• the compound having an active ester group may be a naphthalene diol alkyl/benzoic acid type.
• dicyclopentadiene-type diphenol compounds such as HPC8000-65T (DIC), HPC8100-65T (DIC), and HPC8150-65T (DIC).
• the compound having a maleimide group is a compound having a maleimide skeleton, and any of the conventionally known compounds can be used.
• the compound having a maleimide group preferably has two or more maleimide skeletons, and examples thereof include N,N'-1,3-phenylenedimaleimide, N,N'-1,4-phenylenedimaleimide, N,N'-4,4-diphenylmethane bismaleimide, 1,2-bis(maleimide)ethane, 1,6-bismaleimidehexane, 1,6-bismaleimide-(2,2,4-trimethyl)hexane, 2,2'-bis-[4-(4-maleimidephenoxy)phenyl]propionate, and the like.
• the oligomer is at least one of the following: bis(3-ethyl-5-methyl-4-maleimidephenyl)methane, bisphenol A diphenyl ether bismaleimide, polyphenylmethane maleimide, and oligomers thereof, as well as diamine condensates having a maleimide skeleton.
• the oligomer is an oligomer obtained by condensing a compound having a maleimide group, which is a monomer among the above-mentioned compounds having a maleimide group.
• BMI-1000 (4,4'-diphenylmethane bismaleimide, manufactured by Daiwa Chemical Industry Co., Ltd.
• BMI-2300 phenylmethane bismaleimide, manufactured by Daiwa Chemical Industry Co., Ltd.
• BMI-3000 m-phenylene bismaleimide, manufactured by Daiwa Chemical Industry Co., Ltd.
• BMI-5100 (3,3'-dimethyl-5,5'-dimethyl-4,4'-diphenylmethane bismaleimide, manufactured by Daiwa Chemical Industry Co., Ltd.
• BMI-7000 (4-methyl-1,3-phenylene bismaleimide, manufactured by Daiwa Chemical Industry Co., Ltd.
• BMI-TMH ((1,6-bismaleimide-2,2,4-trimethyl)hexane, manufactured by Daiwa Chemical Industry Co., Ltd.).
• the amount of hardener to be added is preferably 20 to 100 parts by mass, and more preferably 25 to 90 parts by mass, per 100 parts by mass of thermosetting resin.
• the curable resin composition may contain a curing accelerator in combination with the curing agent.
• the curing accelerator accelerates the thermosetting reaction and is used to further improve properties such as adhesion, chemical resistance, and heat resistance.
• Specific examples of such curing accelerators include imidazole and its derivatives; guanamines such as acetoguanamine and benzoguanamine; polyamines such as diaminodiphenylmethane, m-phenylenediamine, m-xylylenediamine, diaminodiphenylsulfone, dicyandiamide, urea, urea derivatives, melamine, and polybasic hydrazides; organic acid salts and/or epoxy adducts thereof; amine complexes of boron trifluoride; triazine derivatives such as ethyldiamino-S-triazine, 2,4-diamino-S-triazine, and 2,4-diamino
• the curing accelerator examples include polyphenols such as alkylphenol novolak and alkylphenol novolak; organic phosphines such as tributylphosphine, triphenylphosphine, and tris-2-cyanoethylphosphine; phosphonium salts such as tri-n-butyl(2,5-dihydroxyphenyl)phosphonium bromide and hexadecyltributylphosphonium chloride; quaternary ammonium salts such as benzyltrimethylammonium chloride and phenyltributylammonium chloride; the polybasic acid anhydrides; photocationic polymerization catalysts such as diphenyliodonium tetrafluoroborate, triphenylsulfonium hexafluoroantimonate, and 2,4,6-triphenylthiopyrylium hexafluorophosphate; styrene-maleic anhydride resins
• the curing accelerator can be used alone or in combination of two or more types.
• the use of a curing accelerator is not essential, but when it is particularly important to accelerate curing, it can be used in an amount of preferably 0.01 to 5 parts by mass per 100 parts by mass of epoxy resin.
• the amount is preferably 10 to 550 ppm, more preferably 25 to 200 ppm, calculated as metal per 100 parts by mass of the compound having a cyanate ester group.
• the curable resin composition used to form the sealing layer contains a colorant in a ratio of 0.60 to 4.0 mass% in terms of solid content.
• the ratio of the colorant is 0.60 mass% or more, the occurrence of die marks can be suppressed by adjusting the thickness of the sealing layer.
• the ratio of the colorant is less than 4.0 mass%, the dispersibility of the curable resin composition can be improved.
• the preferred mixing ratio of the colorant is 0.60 to 2.5 mass%.
• colorants known colorants used in conventional sealing materials can be used, such as phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, crystal violet, carbon black, titanium black, naphthalene black, etc.
• carbon black and titanium black are preferably used from the viewpoint of suppressing the occurrence of die marks.
• carbon black and titanium black in combination as colorants.
• the carbon black and titanium black are included in a ratio of 1:1.1 to 1:7 by mass, and particularly preferably in a ratio of 1:2 to 1:4.
• the curable resin composition used to form the sealing layer may further contain a thermoplastic resin in order to improve mechanical strength.
• the thermoplastic resin is preferably soluble in a solvent. When soluble in a solvent, the flexibility of the dry film is improved, and the occurrence of cracks and powder fall can be suppressed.
• thermoplastic resin examples include thermoplastic polyhydroxypolyether resins, phenoxy resins which are condensates of epichlorohydrin and various bifunctional phenolic compounds, or phenoxy resins in which the hydroxyl groups of the hydroxyether moiety present in the skeleton are esterified using various acid anhydrides or acid chlorides, polyvinyl acetal resins, polyamide resins, polyamideimide resins, block copolymers, and the like.
• the thermoplastic resins may be used alone or in combination of two or more.
• the curable resin composition may contain, for example, a thermoplastic resin having a glass transition point of 20°C or less and a weight average molecular weight of 30,000 or more. Since the higher the weight average molecular weight of the polymer resin, the greater the effect of preventing the inorganic filler from settling, it is preferable that the weight average molecular weight is 100,000 or more, and more preferably 200,000 or more. The upper limit is, for example, 1,000,000 or less.
• Thermoplastic resins include polymeric resins having one or more skeletons selected from a butadiene skeleton, an amide skeleton, an imide skeleton, an acetal skeleton, a carbonate skeleton, an ester skeleton, a urethane skeleton, an acrylic skeleton, and a siloxane skeleton.
• Examples include polymer resins having a butadiene skeleton (Nippon Soda's "G-1000", “G-3000”, “GI-1000”, “GI-3000”, Idemitsu Petrochemical's "R-45EPI”, Daicel Chemical Industries' “PB3600”, “Epofriend AT501”, Cray Valley's "Ricon130”, “Ricon142”, “Ricon150”, “Ricon657”, “Ricon130MA”), polymer resins having a butadiene skeleton and a polyimide skeleton (those described in JP 2006-37083 A), polymer resins having an acrylic skeleton (Nagase ChemteX's "SG-P3", “SG-600LB”, “SG-280”, “SG-790", “SG-K2", Negami Chemical Industries' "SN-50", “AS-3000E", “ME-2000”), etc.
• the thermoplastic resin is preferably an acrylic copolymer with a glass transition point of 20°C or less and a weight average molecular weight of 200,000 or more, from the viewpoint of flatness of the cured product. Also, from the viewpoint of adhesion to biaxially oriented polypropylene film (OPP) and adhesion to low-roughness substrates and circuits, it is preferably an acrylic copolymer with a glass transition point of -5 to 15°C and a weight average molecular weight of 200,000 to 500,000.
• OPP biaxially oriented polypropylene film
• the acrylic acid ester copolymer may have a functional group, and examples of the functional group include a carboxyl group, a hydroxyl group, an epoxy group, and an amide group.
• the acrylic acid ester copolymer preferably has an epoxy group, and more preferably has an epoxy group and an amide group. By having an epoxy group, warping of the cured product can be suppressed.
• acrylic acid ester copolymers examples include Teisan Resin SG-70L, SG-708-6, WS-023 EK30, SG-P3, SG-80H, SG-280 EK23, SG-600TEA, and SG-790 manufactured by Nagase ChemteX Corporation.
• the acrylic acid ester copolymers may be obtained by synthesis, and examples of the synthesis method include the synthesis method described in JP 2016-102200 A.
• the thermoplastic resins can be used alone or in combination of two or more types.
• the amount of the polymer is preferably 0.5 to 10 mass% based on the total solid content of the composition, more preferably 1.0 to 7.0 mass%, even more preferably 2.0 to 7.0 mass%, and particularly preferably 4.0 to 7.0 mass%.
• the amount of thermoplastic resin is preferably 0.5 to 20% by mass, and more preferably 0.5 to 10% by mass, based on the total solid content of the curable resin composition.
• the amount of thermoplastic resin is within the above range, a uniform roughened surface condition is easily obtained, and as a result, the occurrence of die marks can be suppressed.
• the curable resin composition may contain rubber particles as necessary.
• rubber particles include polybutadiene rubber, polyisopropylene rubber, urethane-modified polybutadiene rubber, epoxy-modified polybutadiene rubber, acrylonitrile-modified polybutadiene rubber, carboxyl-modified polybutadiene rubber, acrylonitrile-butadiene rubber modified with carboxyl or hydroxyl groups, and crosslinked rubber particles and core-shell type rubber particles thereof.
• One type may be used alone, or two or more types may be used in combination.
• These rubber particles are added to improve the flexibility of the resulting cured film, improve crack resistance, enable surface roughening treatment with an oxidizing agent, and improve adhesion strength with copper foil, etc.
• the average particle size of the rubber-like particles is preferably in the range of 0.005 to 1 ⁇ m, and more preferably in the range of 0.2 to 1 ⁇ m.
• the average particle size of the rubber-like particles in the present invention can be determined by a laser diffraction particle size distribution measuring device.
• the rubber-like particles are uniformly dispersed in a suitable organic solvent using ultrasound or the like, and a particle size distribution of the rubber-like particles is created on a mass basis using a Nanotrac wave manufactured by Nikkiso Co., Ltd., and the median diameter is taken as the average particle size.
• the amount of rubber particles is preferably 0.5 to 10 mass% based on the total solid content of the curable resin composition, and more preferably 1 to 5 mass%. If it is 0.5 mass% or more, crack resistance is obtained and the adhesive strength with the conductor pattern, etc. can be improved. If it is 10 mass% or less, the coefficient of thermal expansion (CTE) decreases and the glass transition temperature increases, improving the curing characteristics.
• CTE coefficient of thermal expansion
• the curable resin composition may contain an inorganic filler as necessary.
• an inorganic filler By blending an inorganic filler, it is possible to suppress the curing shrinkage of the obtained cured product, and improve thermal properties such as adhesion, hardness, and crack resistance by matching the thermal strength with a conductor layer such as copper around the insulating layer.
• the inorganic filler a conventionally known inorganic filler can be used, and is not limited to a specific one.
• silica such as barium sulfate, barium titanate, amorphous silica, crystalline silica, fused silica, and spherical silica, talc, clay, Neuburg silica particles, boehmite, magnesium carbonate, calcium carbonate, titanium oxide, aluminum oxide, aluminum hydroxide, silicon nitride, aluminum nitride, and calcium zirconate are included as extender pigments, and metal powders such as copper, tin, zinc, nickel, silver, palladium, aluminum, iron, cobalt, gold, and platinum are included.
• the inorganic filler is preferably a spherical particle.
• silica is preferable, as it suppresses the curing shrinkage of the cured product of the curable composition, has a lower CTE, and improves properties such as adhesion and hardness.
• inorganic fillers with a large specific gravity such as alumina generally have a high sedimentation rate, but in the present invention, sedimentation can be suppressed and therefore they can be used preferably.
• the average particle size (median size, D50) of the inorganic filler is preferably 0.01 to 10 ⁇ m. From the viewpoint of slit processability, the inorganic filler is preferably silica with an average particle size of 0.01 to 3 ⁇ m.
• the average particle size of the inorganic filler is the average particle size including not only the particle size of the primary particles but also the particle size of the secondary particles (aggregates).
• the average particle size can be determined by a laser diffraction type particle size distribution measuring device.
• An example of a measuring device using the laser diffraction method is the Nanotra wave manufactured by Nikkiso Co., Ltd.
• the inorganic filler may be surface-treated.
• the surface treatment may be a surface treatment using a coupling agent or a surface treatment that does not introduce an organic group, such as alumina treatment.
• There are no particular limitations on the method for treating the surface of the inorganic filler and any known, commonly used method may be used.
• the surface of the inorganic filler may be treated with a surface treatment agent having a curable reactive group, for example, a coupling agent having a curable reactive group as an organic group.
• the surface treatment of the inorganic filler is preferably a surface treatment with a coupling agent.
• a coupling agent silane-based, titanate-based, aluminate-based, zircoaluminate-based, and other coupling agents can be used. Among them, silane-based coupling agents are preferred.
• silane-based coupling agents examples include vinyltrimethoxysilane, vinyltriethoxysilane, N-(2-aminomethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-anilinopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane, which can be used alone or in combination.
• silane-based coupling agents are immobilized in advance on the surface of the inorganic filler by adsorption or reaction.
• the amount of coupling agent to be treated per 100 parts by mass of inorganic filler is, for example, 0.5 to 10 parts by mass.
• the curable reactive group is preferably a thermosetting reactive group.
• the thermosetting reactive group include a hydroxyl group, a carboxyl group, an isocyanate group, an amino group, an imino group, an epoxy group, an oxetanyl group, a mercapto group, a methoxymethyl group, a methoxyethyl group, an ethoxymethyl group, an ethoxyethyl group, and an oxazoline group.
• at least one of an amino group and an epoxy group is preferable.
• the surface-treated inorganic filler may have a photocurable reactive group in addition to the thermosetting reactive group.
• the surface-treated inorganic filler may be contained in the curable resin composition in a surface-treated state.
• the inorganic filler and the surface treatment agent may be separately blended into the curable resin composition forming the sealing layer to surface-treat the inorganic filler in the composition, but it is preferable to blend an inorganic filler that has been surface-treated in advance.
• By blending an inorganic filler that has been surface-treated in advance it is possible to prevent a decrease in crack resistance, etc., due to the surface treatment agent that was not consumed in the surface treatment, which may remain when blended separately.
• pre-disperse the surface-treated inorganic filler in a solvent and blend the pre-dispersion into the composition or to pre-disperse the surface-untreated inorganic filler in a solvent, perform sufficient surface treatment, and then blend the pre-dispersion into the composition.
• the inorganic filler may be mixed with the epoxy resin etc. in a powder or solid state, or may be mixed with a solvent or dispersant to form a slurry and then mixed with the epoxy resin etc.
• the inorganic filler may be used alone or in a mixture of two or more types.
• the amount of inorganic filler is preferably 10 to 90 mass %, more preferably 50 to 90 mass %, and even more preferably 60 to 90 mass %, based on the total solid content of the curable resin composition.
• the amount of inorganic filler is 10 mass % or more, thermal expansion is suppressed and heat resistance is improved, while when it is 90 mass % or less, the occurrence of cracks can be suppressed.
• the problems of adhesion of the protective film and settling of the inorganic filler are particularly pronounced when the content of the inorganic filler is high.
• particularly excellent effects can be obtained when the amount of inorganic filler is high, for example, 50 mass% or more based on the total solid content of the curable resin composition.
• settling of the inorganic filler is particularly pronounced when the amount is 70 mass% or more, but according to the present invention, settling of the inorganic filler is excellently suppressed.
• the curable resin composition may contain an organic solvent.
• the viscosity of the curable resin composition can be adjusted to an appropriate range to improve the coating property.
• the organic solvent is not particularly limited, and examples thereof include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, and petroleum-based solvents.
• ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, isobutyl acetate, ethyl ...
• the solvent examples include esters such as propylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutyl alcohol, isopentyl alcohol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha, as well as N,N-dimethylformamide (DMF), tetrachloroethylene, and turpentine.
• esters such as propylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate,
• organic solvents such as Swazol 1000 and Swazol 1500 manufactured by Maruzen Petrochemical Co., Ltd., Solvesso 100 and Solvesso 150 manufactured by Standard Oil Osaka Sales Co., Ltd., Solvent #100 and Solvent #150 manufactured by Sankyo Chemical Co., Ltd., Shellsol A100 and Shellsol A150 manufactured by Shell Chemicals Japan Co., Ltd., and Ipzol No. 100 and Ipzol No. 150 manufactured by Idemitsu Kosan Co., Ltd. may be used.
• the organic solvent may be used alone or as a mixture of two or more kinds.
• the amount of residual solvent in the curable resin composition is preferably 0.5 to 7.0% by mass. If the residual solvent is 7.0% by mass or less, bumping during thermal curing is suppressed, resulting in better surface flatness. In addition, the melt viscosity is prevented from dropping too low, causing the resin to flow, resulting in good flatness. If the residual solvent is 0.5% by mass or more, the fluidity during lamination is good, resulting in better flatness and embeddability.
• the curable resin composition may further contain, as necessary, conventionally known thickeners such as asbestos, Orben, Bentone, and finely powdered silica; antifoaming agents and/or leveling agents such as silicone-based, fluorine-based, and polymer-based agents; adhesion imparting agents such as thiazole-based, triazole-based, and silane coupling agents; flame retardants; and conventionally known additives such as titanate-based and aluminum-based.
• conventionally known thickeners such as asbestos, Orben, Bentone, and finely powdered silica
• antifoaming agents and/or leveling agents such as silicone-based, fluorine-based, and polymer-based agents
• adhesion imparting agents such as thiazole-based, triazole-based, and silane coupling agents
• flame retardants and conventionally known additives such as titanate-based and aluminum-based.
• FIG. 3 is a schematic cross-sectional view of a dry film used for forming the sealing layer.
• the dry film 40 includes a first film 401, a resin layer 402 provided on one side of the first film, and a second film 403 provided on the opposite side of the resin layer 402 to the first film 401 side so as to contact the resin layer 402.
• An intermediate layer or the like may be provided between the first film 401 and the resin layer 402.
• the second film 403 When using the dry film 40, the second film 403 is peeled off to expose the resin layer 402, and the surface of the resin layer 402 of the dry film 40 is laminated on the main surface of a substrate on which a semiconductor chip or the like is mounted. That is, the second film 403 is provided to prevent dust or the like from adhering to the surface of the resin layer 402 and to take into consideration the handling of the dry film 40, and is scheduled to be peeled off when the dry film 40 is used.
• the first film refers to a film that is at least adhered to the resin layer when the resin layer side of the curable resin composition formed on the dry film is laminated by heating or the like so as to contact a base material such as a substrate and integrally molded.
• the first film may be peeled off from the resin layer in a process after lamination.
• any known film can be used without particular restriction.
• polyester films such as polyethylene terephthalate and polyethylene naphthalate
• films made of thermoplastic resins such as polyimide films, polyamideimide films, polypropylene films, and polystyrene films
• polyester films are preferred from the standpoints of heat resistance, mechanical strength, and ease of handling.
• a laminate of these films can also be used as the first film.
• the surface of the first film on which the resin layer is to be formed may be subjected to a release treatment.
• the release treatment can be performed by applying a coating liquid prepared by dissolving or dispersing a release agent such as wax, silicone wax, or silicone-based resin in an appropriate solvent to the surface of the first film by a known method such as a coating method such as roll coating or spray coating, gravure printing, or screen printing, and drying the coating liquid.
• the thickness of the first film is not particularly limited, but can be, for example, 10 ⁇ m to 150 ⁇ m.
• the resin layer provided on one side of the first film is made of the curable resin composition described above.
• the curable resin composition is applied to a uniform thickness on the surface of the first film using a comma coater, blade coater, lip coater, rod coater, squeeze coater, reverse coater, transfer roll coater, gravure coater, spray coater, or the like, and the resin layer can be formed by drying for 1 to 30 minutes at a temperature of 50 to 130°C.
• the thickness after drying is appropriately selected within the range of 5 to 40 ⁇ m, preferably 10 to 35 ⁇ m.
• polyester film polyethylene film, polytetrafluoroethylene film, polypropylene film, surface-treated paper, etc.
• polypropylene film is preferably used.
• the adhesive strength between the second film and the resin layer is smaller than the adhesive strength between the first film and the resin layer.
• the surface of the second film that comes into contact with the resin layer may be subjected to a release treatment as described above.
• the thickness of the second film is not particularly limited, but is generally selected from the range of 10 to 60 ⁇ m depending on the application.
• the second film 403 of the dry film 40 as shown in Fig. 3 is peeled off to expose the resin layer 402, and the resin layer 402 is laminated under pressure and heat using a vacuum laminator or the like on the main surface of a substrate on which a plurality of semiconductor chips and the like are mounted.
• a vacuum laminator By using a vacuum laminator, the resin layer 402 adheres closely to the substrate, so that even if there are recesses between the semiconductor chips mounted on the substrate surface, air bubbles are unlikely to be trapped, and a smooth sealing layer can be formed.
• the pressure conditions are preferably about 0.1 to 2.0 MPa, and the heating conditions are preferably 40 to 120°C.
• the first film 401 is peeled off to form the sealing layer 30.
• the resin layer 403 is preferably cured by hot and pressure molding.
• a known method such as a vacuum laminator or a vacuum press can be used for the hot and pressure molding.
• the temperature during hot and pressure molding is preferably 60 to 130°C, the pressure is 20 kg/cm2 or less , and the molding time is preferably within 180 seconds.
• the sealing layer 30 is thermally cured to seal. The thermal curing is performed at 100 to 200°C for about 30 to 180 minutes.
• *1 to *11 in Table 1 represent the following components.
• ⁇ Preparation of dry film> The amount of the solvent was adjusted so that the prepared curable resin composition A had a viscosity of 0.5 to 20 dPa ⁇ s (rotational viscometer 5 rpm, 25°C), and each was applied to a release PET film (TN201, manufactured by Toyobo Co., Ltd., thickness 50 ⁇ m, size 30 cm x 30 cm) using a bar coater so that the thickness of the resin layer after drying was 200 ⁇ m. Next, the film was dried at 90°C for 15 minutes in a hot air circulation drying oven to form a resin layer on the release PET film.
• TN201 manufactured by Toyobo Co., Ltd., thickness 50 ⁇ m, size 30 cm x 30 cm
• a fresh airless OPP (Alphan FG-201, manufactured by Oji F-Tex Co., Ltd.) was attached to the surface of the formed resin layer using a roll laminator to produce a dry film 1 having a resin layer thickness of 200 ⁇ m.
• a dry film 2 with a resin layer thickness of 150 ⁇ m was also produced in the same manner as above, except that the amount of curable resin composition A applied was adjusted so that the resin layer thickness after drying would be 150 ⁇ m.
• a dry film 3 with a resin layer thickness of 240 ⁇ m was also produced in the same manner as above, except that the amount of curable resin composition A applied was adjusted so that the resin layer thickness after drying would be 240 ⁇ m.
• dry film 4 with a resin layer thickness of 200 ⁇ m was produced in the same manner as dry film 1, except that curable resin composition A was changed to curable resin composition B.
• Example 1 Three types of chips, 190 ⁇ m, 200 ⁇ m, and 220 ⁇ m thick, were mounted at intervals of 0.5 mm with a gap of 10 to 15 ⁇ m from the substrate.
• a 0.4 mm thick FR-4 substrate on which a 0.2 mm thick cured coating of solder resist ink (PSR-4000 AUS308, manufactured by Taiyo Ink Mfg. Co., Ltd.) was formed was coated with dry film 1, from which the fresh airless OPP had been peeled off to expose the resin layer.
• the dry film 1 was then laminated using a vacuum laminator at a temperature of 55° C., a pressure of 0.5 MPa, and for 60 seconds so that the resin layer was in contact with the FR-4 substrate.
• the resin layer was cured by heating in a hot air circulation drying oven at 100° C. for 30 minutes and then at 180° C. for 30 minutes, and then the release PET film was peeled off to obtain a mounting substrate.
• the resulting mounting board was cut with an ultrasonic cutter, and the cut surface was observed and measured at magnifications of 100 to 1000 times using a field emission scanning electron microscope (FE-SEM), to confirm the thickness of the resin layer from the board and the thickness from the top of each chip.
• FE-SEM field emission scanning electron microscope
• the obtained mounting board was cut with an ultrasonic cutter, and the cut pieces were sealed with resin, and then polished with an ion milling device so that the cut surfaces of the cut pieces were exposed. At this time, polishing was performed so that the cross section of the board was roughly at the center of the chip. Next, the exposed surfaces of the polished cut pieces were observed and measured at a magnification of 100 to 1000 times using an FE-SEM, and the thickness of the sealing layer between the board and the chip (i.e., the amount of the resin layer of the dry film that penetrated between the board and the chip when the sealing layer was formed) was measured.
• ⁇ The thickness of the sealing layer between the substrate and each chip was less than 40 ⁇ m.
• ⁇ The thickness of the sealing layer between the substrate and each chip was 40 ⁇ m or more. The evaluation results were as shown in Table 2 below.
• Example 2 A mounting board was prepared in the same manner as in Example 1, except that dry film 1 in Example 1 was changed to dry film 2, and the die mark suppression evaluation and the penetration of the sealing layer were performed in the same manner as described above. The evaluation results are shown in Table 2 below.
• Example 3 In Example 1, the organic substrate was changed to a 0.4 mm thick organic substrate on which three types of chips, 165 ⁇ m, 220 ⁇ m, and 200 ⁇ m thick, were mounted at 0.5 mm intervals with a gap of 10 to 15 ⁇ m from the substrate, and dry film 1 was changed to dry film 3. Except for this, a mounting substrate was produced in the same manner as in Example 1, and an evaluation of the inhibition of die mark generation and the penetration of the sealing layer were performed in the same manner as above. The evaluation results are shown in Table 2 below.
• Example 1 A mounting board was prepared in the same manner as in Example 1, except that dry film 1 in Example 1 was changed to dry film 4, and the die mark suppression evaluation and the penetration of the sealing layer were performed in the same manner as described above. The evaluation results are shown in Table 2 below.
• Example 2 A mounting board was prepared in the same manner as in Example 1, except that dry film 1 in Example 1 was changed to dry film 5, and the die mark suppression evaluation and the penetration of the sealing layer were performed in the same manner as described above. The evaluation results are shown in Table 2 below.

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