JPWO2024204710A1 - - Google Patents
Info
- Publication number
- JPWO2024204710A1 JPWO2024204710A1 JP2025511261A JP2025511261A JPWO2024204710A1 JP WO2024204710 A1 JPWO2024204710 A1 JP WO2024204710A1 JP 2025511261 A JP2025511261 A JP 2025511261A JP 2025511261 A JP2025511261 A JP 2025511261A JP WO2024204710 A1 JPWO2024204710 A1 JP WO2024204710A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023057852 | 2023-03-31 | ||
| PCT/JP2024/013038 WO2024204710A1 (ja) | 2023-03-31 | 2024-03-29 | マルチチップモジュール基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024204710A1 true JPWO2024204710A1 (https=) | 2024-10-03 |
| JPWO2024204710A5 JPWO2024204710A5 (https=) | 2025-12-05 |
Family
ID=92906883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025511261A Pending JPWO2024204710A1 (https=) | 2023-03-31 | 2024-03-29 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024204710A1 (https=) |
| KR (1) | KR20250159198A (https=) |
| CN (1) | CN120981918A (https=) |
| TW (1) | TW202505713A (https=) |
| WO (1) | WO2024204710A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7764986B1 (ja) * | 2025-04-04 | 2025-11-06 | ａｒｔｉｅｎｃｅ株式会社 | 中空電子部品封止用樹脂シートおよび中空電子部品 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4464693B2 (ja) | 2004-01-20 | 2010-05-19 | 東海カーボン株式会社 | 半導体封止材用カーボンブラック着色剤およびその製造方法 |
| JP2014183085A (ja) | 2013-03-18 | 2014-09-29 | Dainippon Printing Co Ltd | マルチチップモジュール用基板、マルチチップモジュール用多層配線基板、マルチチップモジュール及びマルチチップ多層配線モジュール |
| JP6981024B2 (ja) * | 2017-03-24 | 2021-12-15 | 住友ベークライト株式会社 | 封止用樹脂組成物および半導体装置 |
-
2024
- 2024-03-29 KR KR1020257032443A patent/KR20250159198A/ko active Pending
- 2024-03-29 WO PCT/JP2024/013038 patent/WO2024204710A1/ja not_active Ceased
- 2024-03-29 TW TW113111954A patent/TW202505713A/zh unknown
- 2024-03-29 CN CN202480023349.9A patent/CN120981918A/zh active Pending
- 2024-03-29 JP JP2025511261A patent/JPWO2024204710A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250159198A (ko) | 2025-11-10 |
| TW202505713A (zh) | 2025-02-01 |
| WO2024204710A1 (ja) | 2024-10-03 |
| CN120981918A (zh) | 2025-11-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250916 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250916 |