JPWO2024204710A5 - - Google Patents
Info
- Publication number
- JPWO2024204710A5 JPWO2024204710A5 JP2025511261A JP2025511261A JPWO2024204710A5 JP WO2024204710 A5 JPWO2024204710 A5 JP WO2024204710A5 JP 2025511261 A JP2025511261 A JP 2025511261A JP 2025511261 A JP2025511261 A JP 2025511261A JP WO2024204710 A5 JPWO2024204710 A5 JP WO2024204710A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sealing layer
- mounting
- mounting board
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023057852 | 2023-03-31 | ||
| PCT/JP2024/013038 WO2024204710A1 (ja) | 2023-03-31 | 2024-03-29 | マルチチップモジュール基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024204710A1 JPWO2024204710A1 (https=) | 2024-10-03 |
| JPWO2024204710A5 true JPWO2024204710A5 (https=) | 2025-12-05 |
Family
ID=92906883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025511261A Pending JPWO2024204710A1 (https=) | 2023-03-31 | 2024-03-29 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024204710A1 (https=) |
| KR (1) | KR20250159198A (https=) |
| CN (1) | CN120981918A (https=) |
| TW (1) | TW202505713A (https=) |
| WO (1) | WO2024204710A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7764986B1 (ja) * | 2025-04-04 | 2025-11-06 | ａｒｔｉｅｎｃｅ株式会社 | 中空電子部品封止用樹脂シートおよび中空電子部品 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4464693B2 (ja) | 2004-01-20 | 2010-05-19 | 東海カーボン株式会社 | 半導体封止材用カーボンブラック着色剤およびその製造方法 |
| JP2014183085A (ja) | 2013-03-18 | 2014-09-29 | Dainippon Printing Co Ltd | マルチチップモジュール用基板、マルチチップモジュール用多層配線基板、マルチチップモジュール及びマルチチップ多層配線モジュール |
| JP6981024B2 (ja) * | 2017-03-24 | 2021-12-15 | 住友ベークライト株式会社 | 封止用樹脂組成物および半導体装置 |
-
2024
- 2024-03-29 KR KR1020257032443A patent/KR20250159198A/ko active Pending
- 2024-03-29 WO PCT/JP2024/013038 patent/WO2024204710A1/ja not_active Ceased
- 2024-03-29 TW TW113111954A patent/TW202505713A/zh unknown
- 2024-03-29 CN CN202480023349.9A patent/CN120981918A/zh active Pending
- 2024-03-29 JP JP2025511261A patent/JPWO2024204710A1/ja active Pending
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