TW202412018A - 導電糊、rfid嵌體、rfid嵌體之製造方法、用以接著晶片之導電糊之用途、及用以獲得rfid嵌體之導電糊之用途 - Google Patents
導電糊、rfid嵌體、rfid嵌體之製造方法、用以接著晶片之導電糊之用途、及用以獲得rfid嵌體之導電糊之用途 Download PDFInfo
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- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
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- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
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JP2022110459 | 2022-07-08 | ||
JP2022-110459 | 2022-07-08 |
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TW112125295A TW202412018A (zh) | 2022-07-08 | 2023-07-06 | 導電糊、rfid嵌體、rfid嵌體之製造方法、用以接著晶片之導電糊之用途、及用以獲得rfid嵌體之導電糊之用途 |
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WO (1) | WO2024010060A1 (ja) |
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JP2005236040A (ja) * | 2004-02-19 | 2005-09-02 | Sekisui Chem Co Ltd | 導電性微粒子の配置方法 |
KR20170090353A (ko) * | 2014-11-20 | 2017-08-07 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 입자, 도전성 입자의 제조 방법, 도전 재료 및 접속 구조체 |
EP3853894A4 (en) * | 2018-09-17 | 2023-03-08 | 3M Innovative Properties Company | FLEXIBLE DEVICE INCLUDING CONDUCTIVE TRACKS WITH ENHANCED STRETCHABILITY |
JP7413024B2 (ja) * | 2020-01-07 | 2024-01-15 | 日本化学工業株式会社 | 導電性接着剤、それを用いた接着構造体及び電子部品 |
JP2021191820A (ja) * | 2020-06-05 | 2021-12-16 | 出光興産株式会社 | 硬化性組成物、射出成形用金型及び熱硬化性組成物の射出成形方法 |
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2023
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