TW202341318A - 晶片周部剝離裝置、晶片供應裝置、晶片供應系統、晶片接合系統、撿拾裝置、晶片周部剝離方法、晶片供應方法、晶片接合方法及撿拾方法 - Google Patents

晶片周部剝離裝置、晶片供應裝置、晶片供應系統、晶片接合系統、撿拾裝置、晶片周部剝離方法、晶片供應方法、晶片接合方法及撿拾方法 Download PDF

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Publication number
TW202341318A
TW202341318A TW111145840A TW111145840A TW202341318A TW 202341318 A TW202341318 A TW 202341318A TW 111145840 A TW111145840 A TW 111145840A TW 111145840 A TW111145840 A TW 111145840A TW 202341318 A TW202341318 A TW 202341318A
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TW
Taiwan
Prior art keywords
wafer
peripheral
wafers
substrate
adhered
Prior art date
Application number
TW111145840A
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English (en)
Chinese (zh)
Inventor
山內朗
Original Assignee
日商邦德科技股份有限公司
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Publication date
Application filed by 日商邦德科技股份有限公司 filed Critical 日商邦德科技股份有限公司
Publication of TW202341318A publication Critical patent/TW202341318A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW111145840A 2021-11-30 2022-11-30 晶片周部剝離裝置、晶片供應裝置、晶片供應系統、晶片接合系統、撿拾裝置、晶片周部剝離方法、晶片供應方法、晶片接合方法及撿拾方法 TW202341318A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021-193779 2021-11-30
JP2021193779 2021-11-30
PCT/JP2022/043849 WO2023100831A1 (fr) 2021-11-30 2022-11-29 Appareil de décollement de périphérie de puce, appareil d'alimentation de puce, système d'alimentation de puce, système de liaison de puce, appareil de capture, procédé de décollement de périphérie de puce, procédé d'alimentation de puce, procédé de liaison de puce et procédé de capture
WOPCT/JP2022/043849 2022-11-29

Publications (1)

Publication Number Publication Date
TW202341318A true TW202341318A (zh) 2023-10-16

Family

ID=86612265

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111145840A TW202341318A (zh) 2021-11-30 2022-11-30 晶片周部剝離裝置、晶片供應裝置、晶片供應系統、晶片接合系統、撿拾裝置、晶片周部剝離方法、晶片供應方法、晶片接合方法及撿拾方法

Country Status (3)

Country Link
CN (1) CN118318289A (fr)
TW (1) TW202341318A (fr)
WO (1) WO2023100831A1 (fr)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302630A (ja) * 1993-04-16 1994-10-28 Sumitomo Electric Ind Ltd ダイボンディング方法及び装置
JP2000252305A (ja) * 1999-03-02 2000-09-14 Toshiba Corp チップマウント装置
JP4128319B2 (ja) * 1999-12-24 2008-07-30 株式会社新川 マルチチップボンディング方法及び装置
WO2004100240A1 (fr) * 2003-05-12 2004-11-18 Tokyo Seimitsu Co., Ltd. Methode et dispositif pour diviser un element de type plaque
JP2011216529A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体装置の製造方法
JP5648512B2 (ja) * 2011-02-08 2015-01-07 トヨタ自動車株式会社 エキスパンド方法、エキスパンド装置、粘着シート
JP2020177963A (ja) * 2019-04-16 2020-10-29 株式会社デンソー 半導体チップの製造方法
EP4064330A4 (fr) * 2019-11-21 2023-08-09 Bondtech Co., Ltd. Système de montage de composants, distributeur de composants, et procédé de montage de composants

Also Published As

Publication number Publication date
WO2023100831A1 (fr) 2023-06-08
CN118318289A (zh) 2024-07-09
JPWO2023100831A1 (fr) 2023-06-08

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