JPWO2023100831A1 - - Google Patents
Info
- Publication number
- JPWO2023100831A1 JPWO2023100831A1 JP2023564980A JP2023564980A JPWO2023100831A1 JP WO2023100831 A1 JPWO2023100831 A1 JP WO2023100831A1 JP 2023564980 A JP2023564980 A JP 2023564980A JP 2023564980 A JP2023564980 A JP 2023564980A JP WO2023100831 A1 JPWO2023100831 A1 JP WO2023100831A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021193779 | 2021-11-30 | ||
PCT/JP2022/043849 WO2023100831A1 (fr) | 2021-11-30 | 2022-11-29 | Appareil de décollement de périphérie de puce, appareil d'alimentation de puce, système d'alimentation de puce, système de liaison de puce, appareil de capture, procédé de décollement de périphérie de puce, procédé d'alimentation de puce, procédé de liaison de puce et procédé de capture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023100831A1 true JPWO2023100831A1 (fr) | 2023-06-08 |
Family
ID=86612265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023564980A Pending JPWO2023100831A1 (fr) | 2021-11-30 | 2022-11-29 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2023100831A1 (fr) |
TW (1) | TW202341318A (fr) |
WO (1) | WO2023100831A1 (fr) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06302630A (ja) * | 1993-04-16 | 1994-10-28 | Sumitomo Electric Ind Ltd | ダイボンディング方法及び装置 |
JP2000252305A (ja) * | 1999-03-02 | 2000-09-14 | Toshiba Corp | チップマウント装置 |
JP4128319B2 (ja) * | 1999-12-24 | 2008-07-30 | 株式会社新川 | マルチチップボンディング方法及び装置 |
JP4599631B2 (ja) * | 2003-05-12 | 2010-12-15 | 株式会社東京精密 | 板状部材の分割方法及び分割装置 |
JP2011216529A (ja) * | 2010-03-31 | 2011-10-27 | Furukawa Electric Co Ltd:The | 半導体装置の製造方法 |
JP5648512B2 (ja) * | 2011-02-08 | 2015-01-07 | トヨタ自動車株式会社 | エキスパンド方法、エキスパンド装置、粘着シート |
JP2020177963A (ja) * | 2019-04-16 | 2020-10-29 | 株式会社デンソー | 半導体チップの製造方法 |
CN114730714A (zh) * | 2019-11-21 | 2022-07-08 | 邦德泰克株式会社 | 部件安装系统、部件供给装置以及部件安装方法 |
-
2022
- 2022-11-29 JP JP2023564980A patent/JPWO2023100831A1/ja active Pending
- 2022-11-29 WO PCT/JP2022/043849 patent/WO2023100831A1/fr unknown
- 2022-11-30 TW TW111145840A patent/TW202341318A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202341318A (zh) | 2023-10-16 |
WO2023100831A1 (fr) | 2023-06-08 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240514 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240514 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20240514 |