TW202336153A - 硬化性全氟聚醚膠組成物、全氟聚醚膠硬化物、及由該硬化物密封而成之電氣及電子構件 - Google Patents

硬化性全氟聚醚膠組成物、全氟聚醚膠硬化物、及由該硬化物密封而成之電氣及電子構件 Download PDF

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Publication number
TW202336153A
TW202336153A TW112101341A TW112101341A TW202336153A TW 202336153 A TW202336153 A TW 202336153A TW 112101341 A TW112101341 A TW 112101341A TW 112101341 A TW112101341 A TW 112101341A TW 202336153 A TW202336153 A TW 202336153A
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Taiwan
Prior art keywords
perfluoropolyether
general formula
component
integer
glue
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TW112101341A
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English (en)
Chinese (zh)
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安田浩之
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日商信越化學工業股份有限公司
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Publication of TW202336153A publication Critical patent/TW202336153A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/002—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds
    • C08G65/005—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds containing halogens
    • C08G65/007—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds containing halogens containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/46—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing halogen
    • C08G2650/48—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing halogen containing fluorine, e.g. perfluropolyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW112101341A 2022-01-24 2023-01-12 硬化性全氟聚醚膠組成物、全氟聚醚膠硬化物、及由該硬化物密封而成之電氣及電子構件 TW202336153A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022008714 2022-01-24
JP2022-008714 2022-01-24

Publications (1)

Publication Number Publication Date
TW202336153A true TW202336153A (zh) 2023-09-16

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TW112101341A TW202336153A (zh) 2022-01-24 2023-01-12 硬化性全氟聚醚膠組成物、全氟聚醚膠硬化物、及由該硬化物密封而成之電氣及電子構件

Country Status (6)

Country Link
EP (1) EP4471090A4 (https=)
JP (1) JPWO2023140134A1 (https=)
KR (1) KR20240134142A (https=)
CN (1) CN118715285A (https=)
TW (1) TW202336153A (https=)
WO (1) WO2023140134A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024151871A (ja) * 2023-04-13 2024-10-25 信越化学工業株式会社 硬化性パーフルオロポリエーテルゲル組成物、パーフルオロポリエーテルゲル硬化物、および該硬化物で封止された電子部品

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056190B2 (ja) 1980-04-11 1985-12-09 東芝シリコ−ン株式会社 ポリオルガノシロキサン組成物
US4565714B1 (en) * 1984-06-14 1999-06-29 Minnesota Mining & Mfg Low surface energy material
DE3624776A1 (de) 1986-07-22 1988-01-28 Bayer Ag Weiche siliconelastomere
JPS6335655A (ja) 1986-07-30 1988-02-16 Toshiba Silicone Co Ltd シリコ−ンゲル組成物
JP3073888B2 (ja) 1993-06-17 2000-08-07 信越化学工業株式会社 チキソ性フルオロシリコーンゲル組成物
JP3077536B2 (ja) * 1994-06-23 2000-08-14 信越化学工業株式会社 硬化性組成物
JP3487744B2 (ja) 1997-10-09 2004-01-19 信越化学工業株式会社 硬化性組成物
JP2004043590A (ja) * 2002-07-10 2004-02-12 Shin Etsu Chem Co Ltd 硬化性組成物及び電気・電子部品
JP2006022223A (ja) * 2004-07-08 2006-01-26 Shin Etsu Chem Co Ltd 硬化性フルオロポリエーテル組成物
JP2010077267A (ja) * 2008-09-25 2010-04-08 Fujifilm Corp 含フッ素ポリエーテル系化合物を含有する硬化性組成物
JP5245902B2 (ja) * 2009-02-20 2013-07-24 信越化学工業株式会社 微粉末状又はペースト状の重合生成物の製造方法
JP5246212B2 (ja) * 2010-07-14 2013-07-24 信越化学工業株式会社 硬化性パーフルオロポリエーテル系ゲル組成物及びその硬化物を用いたゲル製品
JP5447343B2 (ja) * 2010-11-08 2014-03-19 信越化学工業株式会社 パーフルオロポリエーテルゲル硬化物の耐酸性を向上する方法
JP5621729B2 (ja) * 2011-08-04 2014-11-12 信越化学工業株式会社 コーティング又はポッティング用液剤及びその製造方法、被覆層の形成方法、並びに該被覆層を有する物品
US20230015835A1 (en) * 2019-12-13 2023-01-19 Shin-Etsu Chemical Co., Ltd. Curable perfluoropolyether adhesive composition and adhesive containing cured product thereof

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Publication number Publication date
EP4471090A4 (en) 2026-01-28
WO2023140134A1 (ja) 2023-07-27
KR20240134142A (ko) 2024-09-06
EP4471090A1 (en) 2024-12-04
JPWO2023140134A1 (https=) 2023-07-27
CN118715285A (zh) 2024-09-27

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