KR20240134142A - 경화성 퍼플루오로폴리에테르 겔 조성물, 퍼플루오로폴리에테르 겔 경화물, 및 이 경화물로 봉지된 전기·전자부품 - Google Patents

경화성 퍼플루오로폴리에테르 겔 조성물, 퍼플루오로폴리에테르 겔 경화물, 및 이 경화물로 봉지된 전기·전자부품 Download PDF

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Publication number
KR20240134142A
KR20240134142A KR1020247024775A KR20247024775A KR20240134142A KR 20240134142 A KR20240134142 A KR 20240134142A KR 1020247024775 A KR1020247024775 A KR 1020247024775A KR 20247024775 A KR20247024775 A KR 20247024775A KR 20240134142 A KR20240134142 A KR 20240134142A
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KR
South Korea
Prior art keywords
perfluoropolyether
group
component
formula
curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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KR1020247024775A
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English (en)
Korean (ko)
Inventor
히로유키 야스다
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
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Publication of KR20240134142A publication Critical patent/KR20240134142A/ko
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/002—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds
    • C08G65/005—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds containing halogens
    • C08G65/007—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from unsaturated compounds containing halogens containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H01L23/293—
    • H01L23/296—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/46—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing halogen
    • C08G2650/48—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing halogen containing fluorine, e.g. perfluropolyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020247024775A 2022-01-24 2023-01-10 경화성 퍼플루오로폴리에테르 겔 조성물, 퍼플루오로폴리에테르 겔 경화물, 및 이 경화물로 봉지된 전기·전자부품 Pending KR20240134142A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-008714 2022-01-24
JP2022008714 2022-01-24
PCT/JP2023/000243 WO2023140134A1 (ja) 2022-01-24 2023-01-10 硬化性パーフルオロポリエーテルゲル組成物、パーフルオロポリエーテルゲル硬化物、および該硬化物で封止された電気・電子部品

Publications (1)

Publication Number Publication Date
KR20240134142A true KR20240134142A (ko) 2024-09-06

Family

ID=87348719

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247024775A Pending KR20240134142A (ko) 2022-01-24 2023-01-10 경화성 퍼플루오로폴리에테르 겔 조성물, 퍼플루오로폴리에테르 겔 경화물, 및 이 경화물로 봉지된 전기·전자부품

Country Status (6)

Country Link
EP (1) EP4471090A4 (https=)
JP (1) JPWO2023140134A1 (https=)
KR (1) KR20240134142A (https=)
CN (1) CN118715285A (https=)
TW (1) TW202336153A (https=)
WO (1) WO2023140134A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024151871A (ja) * 2023-04-13 2024-10-25 信越化学工業株式会社 硬化性パーフルオロポリエーテルゲル組成物、パーフルオロポリエーテルゲル硬化物、および該硬化物で封止された電子部品

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56143241A (en) 1980-04-11 1981-11-07 Toshiba Silicone Co Ltd Polyorganosiloxane composition
JPS6333475A (ja) 1986-07-22 1988-02-13 バイエル・アクチエンゲゼルシヤフト 軟質シリコ−ンエラストマ−
JPS6335655A (ja) 1986-07-30 1988-02-16 Toshiba Silicone Co Ltd シリコ−ンゲル組成物
JPH07324165A (ja) 1993-06-17 1995-12-12 Shin Etsu Chem Co Ltd チキソ性フルオロシリコーンゲル組成物
JPH11116685A (ja) 1997-10-09 1999-04-27 Shin Etsu Chem Co Ltd 硬化性組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4565714B1 (en) * 1984-06-14 1999-06-29 Minnesota Mining & Mfg Low surface energy material
JP3077536B2 (ja) * 1994-06-23 2000-08-14 信越化学工業株式会社 硬化性組成物
JP2004043590A (ja) * 2002-07-10 2004-02-12 Shin Etsu Chem Co Ltd 硬化性組成物及び電気・電子部品
JP2006022223A (ja) * 2004-07-08 2006-01-26 Shin Etsu Chem Co Ltd 硬化性フルオロポリエーテル組成物
JP2010077267A (ja) * 2008-09-25 2010-04-08 Fujifilm Corp 含フッ素ポリエーテル系化合物を含有する硬化性組成物
JP5245902B2 (ja) * 2009-02-20 2013-07-24 信越化学工業株式会社 微粉末状又はペースト状の重合生成物の製造方法
JP5246212B2 (ja) * 2010-07-14 2013-07-24 信越化学工業株式会社 硬化性パーフルオロポリエーテル系ゲル組成物及びその硬化物を用いたゲル製品
JP5447343B2 (ja) * 2010-11-08 2014-03-19 信越化学工業株式会社 パーフルオロポリエーテルゲル硬化物の耐酸性を向上する方法
JP5621729B2 (ja) * 2011-08-04 2014-11-12 信越化学工業株式会社 コーティング又はポッティング用液剤及びその製造方法、被覆層の形成方法、並びに該被覆層を有する物品
US20230015835A1 (en) * 2019-12-13 2023-01-19 Shin-Etsu Chemical Co., Ltd. Curable perfluoropolyether adhesive composition and adhesive containing cured product thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56143241A (en) 1980-04-11 1981-11-07 Toshiba Silicone Co Ltd Polyorganosiloxane composition
JPS6333475A (ja) 1986-07-22 1988-02-13 バイエル・アクチエンゲゼルシヤフト 軟質シリコ−ンエラストマ−
JPS6335655A (ja) 1986-07-30 1988-02-16 Toshiba Silicone Co Ltd シリコ−ンゲル組成物
JPH07324165A (ja) 1993-06-17 1995-12-12 Shin Etsu Chem Co Ltd チキソ性フルオロシリコーンゲル組成物
JPH11116685A (ja) 1997-10-09 1999-04-27 Shin Etsu Chem Co Ltd 硬化性組成物

Also Published As

Publication number Publication date
TW202336153A (zh) 2023-09-16
EP4471090A4 (en) 2026-01-28
WO2023140134A1 (ja) 2023-07-27
EP4471090A1 (en) 2024-12-04
JPWO2023140134A1 (https=) 2023-07-27
CN118715285A (zh) 2024-09-27

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P11-X000 Amendment of application requested

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P13-X000 Application amended

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PG1501 Laying open of application

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P22-X000 Classification modified

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