TW202329230A - 基板處理模組、基板處理裝置及基板處理單元 - Google Patents

基板處理模組、基板處理裝置及基板處理單元 Download PDF

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Publication number
TW202329230A
TW202329230A TW111147829A TW111147829A TW202329230A TW 202329230 A TW202329230 A TW 202329230A TW 111147829 A TW111147829 A TW 111147829A TW 111147829 A TW111147829 A TW 111147829A TW 202329230 A TW202329230 A TW 202329230A
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TW
Taiwan
Prior art keywords
tank
aforementioned
module
substrate processing
chemical
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TW111147829A
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English (en)
Chinese (zh)
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出口泰紀
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日商東邦化成股份有限公司
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Publication of TW202329230A publication Critical patent/TW202329230A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Cleaning Or Drying Semiconductors (AREA)
TW111147829A 2021-12-23 2022-12-13 基板處理模組、基板處理裝置及基板處理單元 TW202329230A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2021/047990 WO2023119584A1 (ja) 2021-12-23 2021-12-23 基板処理モジュール、基板処理装置、および基板処理ユニット
WOPCT/JP2021/047990 2021-12-23

Publications (1)

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TW202329230A true TW202329230A (zh) 2023-07-16

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TW111147829A TW202329230A (zh) 2021-12-23 2022-12-13 基板處理模組、基板處理裝置及基板處理單元

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JP (1) JP7814417B2 (https=)
CN (1) CN118435322A (https=)
TW (1) TW202329230A (https=)
WO (1) WO2023119584A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0316341U (https=) * 1989-06-29 1991-02-19
JPH0521414A (ja) * 1991-07-13 1993-01-29 Sony Corp 処理装置
JP3163221B2 (ja) * 1993-08-25 2001-05-08 東京エレクトロン株式会社 プローブ装置
JPH0817872A (ja) * 1994-06-24 1996-01-19 Fujitsu Ltd 部品搭載装置
JPH0864570A (ja) * 1994-08-19 1996-03-08 Hitachi Ltd ウエハ洗浄装置
JPH08170935A (ja) * 1994-12-19 1996-07-02 Hitachi Ltd 車体の重心測定装置及び方法
JP2000301082A (ja) * 1999-04-20 2000-10-31 Tokyo Electron Ltd 処理装置
JP3789824B2 (ja) * 2002-01-22 2006-06-28 東京エレクトロン株式会社 液処理装置、および液処理方法
JP2016136580A (ja) * 2015-01-23 2016-07-28 株式会社荏原製作所 基板処理装置、ハウジングおよび処理ユニット

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JPWO2023119584A1 (https=) 2023-06-29
JP7814417B2 (ja) 2026-02-16
CN118435322A (zh) 2024-08-02
WO2023119584A1 (ja) 2023-06-29

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