JPWO2023119584A1 - - Google Patents
Info
- Publication number
- JPWO2023119584A1 JPWO2023119584A1 JP2023568957A JP2023568957A JPWO2023119584A1 JP WO2023119584 A1 JPWO2023119584 A1 JP WO2023119584A1 JP 2023568957 A JP2023568957 A JP 2023568957A JP 2023568957 A JP2023568957 A JP 2023568957A JP WO2023119584 A1 JPWO2023119584 A1 JP WO2023119584A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/047990 WO2023119584A1 (ja) | 2021-12-23 | 2021-12-23 | 基板処理モジュール、基板処理装置、および基板処理ユニット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023119584A1 true JPWO2023119584A1 (https=) | 2023-06-29 |
| JP7814417B2 JP7814417B2 (ja) | 2026-02-16 |
Family
ID=86901839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023568957A Active JP7814417B2 (ja) | 2021-12-23 | 2021-12-23 | 基板処理モジュール、基板処理装置、および基板処理ユニット |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7814417B2 (https=) |
| CN (1) | CN118435322A (https=) |
| TW (1) | TW202329230A (https=) |
| WO (1) | WO2023119584A1 (https=) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316341U (https=) * | 1989-06-29 | 1991-02-19 | ||
| JPH0521414A (ja) * | 1991-07-13 | 1993-01-29 | Sony Corp | 処理装置 |
| JPH07231018A (ja) * | 1993-08-25 | 1995-08-29 | Tokyo Electron Ltd | プローブ装置 |
| JPH0817872A (ja) * | 1994-06-24 | 1996-01-19 | Fujitsu Ltd | 部品搭載装置 |
| JPH0864570A (ja) * | 1994-08-19 | 1996-03-08 | Hitachi Ltd | ウエハ洗浄装置 |
| JPH08170935A (ja) * | 1994-12-19 | 1996-07-02 | Hitachi Ltd | 車体の重心測定装置及び方法 |
| JP2000301082A (ja) * | 1999-04-20 | 2000-10-31 | Tokyo Electron Ltd | 処理装置 |
| JP2003213496A (ja) * | 2002-01-22 | 2003-07-30 | Tokyo Electron Ltd | 液処理装置、および液処理方法 |
| JP2016136580A (ja) * | 2015-01-23 | 2016-07-28 | 株式会社荏原製作所 | 基板処理装置、ハウジングおよび処理ユニット |
-
2021
- 2021-12-23 WO PCT/JP2021/047990 patent/WO2023119584A1/ja not_active Ceased
- 2021-12-23 CN CN202180105201.6A patent/CN118435322A/zh active Pending
- 2021-12-23 JP JP2023568957A patent/JP7814417B2/ja active Active
-
2022
- 2022-12-13 TW TW111147829A patent/TW202329230A/zh unknown
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316341U (https=) * | 1989-06-29 | 1991-02-19 | ||
| JPH0521414A (ja) * | 1991-07-13 | 1993-01-29 | Sony Corp | 処理装置 |
| JPH07231018A (ja) * | 1993-08-25 | 1995-08-29 | Tokyo Electron Ltd | プローブ装置 |
| JPH0817872A (ja) * | 1994-06-24 | 1996-01-19 | Fujitsu Ltd | 部品搭載装置 |
| JPH0864570A (ja) * | 1994-08-19 | 1996-03-08 | Hitachi Ltd | ウエハ洗浄装置 |
| JPH08170935A (ja) * | 1994-12-19 | 1996-07-02 | Hitachi Ltd | 車体の重心測定装置及び方法 |
| JP2000301082A (ja) * | 1999-04-20 | 2000-10-31 | Tokyo Electron Ltd | 処理装置 |
| JP2003213496A (ja) * | 2002-01-22 | 2003-07-30 | Tokyo Electron Ltd | 液処理装置、および液処理方法 |
| JP2016136580A (ja) * | 2015-01-23 | 2016-07-28 | 株式会社荏原製作所 | 基板処理装置、ハウジングおよび処理ユニット |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7814417B2 (ja) | 2026-02-16 |
| CN118435322A (zh) | 2024-08-02 |
| WO2023119584A1 (ja) | 2023-06-29 |
| TW202329230A (zh) | 2023-07-16 |
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