JP7814417B2 - 基板処理モジュール、基板処理装置、および基板処理ユニット - Google Patents

基板処理モジュール、基板処理装置、および基板処理ユニット

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Publication number
JP7814417B2
JP7814417B2 JP2023568957A JP2023568957A JP7814417B2 JP 7814417 B2 JP7814417 B2 JP 7814417B2 JP 2023568957 A JP2023568957 A JP 2023568957A JP 2023568957 A JP2023568957 A JP 2023568957A JP 7814417 B2 JP7814417 B2 JP 7814417B2
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Japan
Prior art keywords
tank
chemical
module
substrate processing
substrate
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Active
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JP2023568957A
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English (en)
Japanese (ja)
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JPWO2023119584A1 (https=
Inventor
泰紀 出口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DAIKIN FINETECH, LTD.
Original Assignee
DAIKIN FINETECH, LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by DAIKIN FINETECH, LTD. filed Critical DAIKIN FINETECH, LTD.
Publication of JPWO2023119584A1 publication Critical patent/JPWO2023119584A1/ja
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Publication of JP7814417B2 publication Critical patent/JP7814417B2/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
JP2023568957A 2021-12-23 2021-12-23 基板処理モジュール、基板処理装置、および基板処理ユニット Active JP7814417B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/047990 WO2023119584A1 (ja) 2021-12-23 2021-12-23 基板処理モジュール、基板処理装置、および基板処理ユニット

Publications (2)

Publication Number Publication Date
JPWO2023119584A1 JPWO2023119584A1 (https=) 2023-06-29
JP7814417B2 true JP7814417B2 (ja) 2026-02-16

Family

ID=86901839

Family Applications (1)

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JP2023568957A Active JP7814417B2 (ja) 2021-12-23 2021-12-23 基板処理モジュール、基板処理装置、および基板処理ユニット

Country Status (4)

Country Link
JP (1) JP7814417B2 (https=)
CN (1) CN118435322A (https=)
TW (1) TW202329230A (https=)
WO (1) WO2023119584A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000301082A (ja) 1999-04-20 2000-10-31 Tokyo Electron Ltd 処理装置
JP2003213496A (ja) 2002-01-22 2003-07-30 Tokyo Electron Ltd 液処理装置、および液処理方法
JP2016136580A (ja) 2015-01-23 2016-07-28 株式会社荏原製作所 基板処理装置、ハウジングおよび処理ユニット

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0316341U (https=) * 1989-06-29 1991-02-19
JPH0521414A (ja) * 1991-07-13 1993-01-29 Sony Corp 処理装置
JP3163221B2 (ja) * 1993-08-25 2001-05-08 東京エレクトロン株式会社 プローブ装置
JPH0817872A (ja) * 1994-06-24 1996-01-19 Fujitsu Ltd 部品搭載装置
JPH0864570A (ja) * 1994-08-19 1996-03-08 Hitachi Ltd ウエハ洗浄装置
JPH08170935A (ja) * 1994-12-19 1996-07-02 Hitachi Ltd 車体の重心測定装置及び方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000301082A (ja) 1999-04-20 2000-10-31 Tokyo Electron Ltd 処理装置
JP2003213496A (ja) 2002-01-22 2003-07-30 Tokyo Electron Ltd 液処理装置、および液処理方法
JP2016136580A (ja) 2015-01-23 2016-07-28 株式会社荏原製作所 基板処理装置、ハウジングおよび処理ユニット

Also Published As

Publication number Publication date
JPWO2023119584A1 (https=) 2023-06-29
CN118435322A (zh) 2024-08-02
WO2023119584A1 (ja) 2023-06-29
TW202329230A (zh) 2023-07-16

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