TW202313730A - 黏著帶 - Google Patents

黏著帶 Download PDF

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Publication number
TW202313730A
TW202313730A TW111128612A TW111128612A TW202313730A TW 202313730 A TW202313730 A TW 202313730A TW 111128612 A TW111128612 A TW 111128612A TW 111128612 A TW111128612 A TW 111128612A TW 202313730 A TW202313730 A TW 202313730A
Authority
TW
Taiwan
Prior art keywords
adhesive layer
weight
mentioned
meth
molecular weight
Prior art date
Application number
TW111128612A
Other languages
English (en)
Chinese (zh)
Inventor
川本友也
緒方雄大
戶田智基
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202313730A publication Critical patent/TW202313730A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW111128612A 2021-08-05 2022-07-29 黏著帶 TW202313730A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-129139 2021-08-05
JP2021129139 2021-08-05

Publications (1)

Publication Number Publication Date
TW202313730A true TW202313730A (zh) 2023-04-01

Family

ID=85154708

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111128612A TW202313730A (zh) 2021-08-05 2022-07-29 黏著帶

Country Status (3)

Country Link
JP (2) JP7385053B2 (enrdf_load_stackoverflow)
TW (1) TW202313730A (enrdf_load_stackoverflow)
WO (1) WO2023013532A1 (enrdf_load_stackoverflow)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3819661B2 (ja) * 2000-02-24 2006-09-13 日東電工株式会社 感圧性接着シ―ト類および機能性フイルムの固定方法
JP4803524B2 (ja) * 2001-05-15 2011-10-26 綜研化学株式会社 光学部材用粘着剤及び該粘着剤を設けた光学部材
JP2003049143A (ja) * 2001-05-31 2003-02-21 Soken Chem & Eng Co Ltd 光学フィルム用粘着剤及び該粘着剤を用いた光学フィルム
JP5351420B2 (ja) * 2008-01-23 2013-11-27 リンテック株式会社 粘着シートおよび液晶表示装置
CN116640523A (zh) * 2019-01-30 2023-08-25 日东电工株式会社 带粘合剂层的光学层叠膜及图像显示装置
JP6749464B1 (ja) * 2019-03-20 2020-09-02 積水化学工業株式会社 粘着テープ及び粘着テープロール
JP7203244B2 (ja) * 2019-12-18 2023-01-12 積水化学工業株式会社 粘着剤、粘着テープ、電化製品、車載部材、及び固定方法

Also Published As

Publication number Publication date
JPWO2023013532A1 (enrdf_load_stackoverflow) 2023-02-09
JP7385053B2 (ja) 2023-11-21
JP2024016206A (ja) 2024-02-06
WO2023013532A1 (ja) 2023-02-09

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