JPWO2023013532A1 - - Google Patents

Info

Publication number
JPWO2023013532A1
JPWO2023013532A1 JP2022552652A JP2022552652A JPWO2023013532A1 JP WO2023013532 A1 JPWO2023013532 A1 JP WO2023013532A1 JP 2022552652 A JP2022552652 A JP 2022552652A JP 2022552652 A JP2022552652 A JP 2022552652A JP WO2023013532 A1 JPWO2023013532 A1 JP WO2023013532A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022552652A
Other languages
Japanese (ja)
Other versions
JP7385053B2 (ja
JPWO2023013532A5 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023013532A1 publication Critical patent/JPWO2023013532A1/ja
Publication of JPWO2023013532A5 publication Critical patent/JPWO2023013532A5/ja
Priority to JP2023191259A priority Critical patent/JP2024016206A/ja
Application granted granted Critical
Publication of JP7385053B2 publication Critical patent/JP7385053B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2022552652A 2021-08-05 2022-07-29 粘着テープ Active JP7385053B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023191259A JP2024016206A (ja) 2021-08-05 2023-11-09 粘着テープ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021129139 2021-08-05
JP2021129139 2021-08-05
PCT/JP2022/029239 WO2023013532A1 (ja) 2021-08-05 2022-07-29 粘着テープ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023191259A Division JP2024016206A (ja) 2021-08-05 2023-11-09 粘着テープ

Publications (3)

Publication Number Publication Date
JPWO2023013532A1 true JPWO2023013532A1 (enrdf_load_stackoverflow) 2023-02-09
JPWO2023013532A5 JPWO2023013532A5 (enrdf_load_stackoverflow) 2023-09-08
JP7385053B2 JP7385053B2 (ja) 2023-11-21

Family

ID=85154708

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022552652A Active JP7385053B2 (ja) 2021-08-05 2022-07-29 粘着テープ
JP2023191259A Pending JP2024016206A (ja) 2021-08-05 2023-11-09 粘着テープ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023191259A Pending JP2024016206A (ja) 2021-08-05 2023-11-09 粘着テープ

Country Status (3)

Country Link
JP (2) JP7385053B2 (enrdf_load_stackoverflow)
TW (1) TW202313730A (enrdf_load_stackoverflow)
WO (1) WO2023013532A1 (enrdf_load_stackoverflow)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001234135A (ja) * 2000-02-24 2001-08-28 Nitto Denko Corp 感圧性接着シ―ト類および機能性フイルムの固定方法
JP2003034781A (ja) * 2001-05-15 2003-02-07 Soken Chem & Eng Co Ltd 光学部材用粘着剤及び該粘着剤を設けた光学部材
JP2003049143A (ja) * 2001-05-31 2003-02-21 Soken Chem & Eng Co Ltd 光学フィルム用粘着剤及び該粘着剤を用いた光学フィルム
JP2009173746A (ja) * 2008-01-23 2009-08-06 Lintec Corp 粘着シートおよび液晶表示装置
JP2020122141A (ja) * 2019-01-30 2020-08-13 日東電工株式会社 粘着剤層付き光学積層フィルム及び画像表示装置
JP2020158756A (ja) * 2019-03-20 2020-10-01 積水化学工業株式会社 粘着テープ及び粘着テープロール
WO2021125247A1 (ja) * 2019-12-18 2021-06-24 積水化学工業株式会社 粘着剤、粘着テープ、電化製品、車載部材、及び固定方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001234135A (ja) * 2000-02-24 2001-08-28 Nitto Denko Corp 感圧性接着シ―ト類および機能性フイルムの固定方法
JP2003034781A (ja) * 2001-05-15 2003-02-07 Soken Chem & Eng Co Ltd 光学部材用粘着剤及び該粘着剤を設けた光学部材
JP2003049143A (ja) * 2001-05-31 2003-02-21 Soken Chem & Eng Co Ltd 光学フィルム用粘着剤及び該粘着剤を用いた光学フィルム
JP2009173746A (ja) * 2008-01-23 2009-08-06 Lintec Corp 粘着シートおよび液晶表示装置
JP2020122141A (ja) * 2019-01-30 2020-08-13 日東電工株式会社 粘着剤層付き光学積層フィルム及び画像表示装置
JP2020158756A (ja) * 2019-03-20 2020-10-01 積水化学工業株式会社 粘着テープ及び粘着テープロール
WO2021125247A1 (ja) * 2019-12-18 2021-06-24 積水化学工業株式会社 粘着剤、粘着テープ、電化製品、車載部材、及び固定方法

Also Published As

Publication number Publication date
JP7385053B2 (ja) 2023-11-21
TW202313730A (zh) 2023-04-01
JP2024016206A (ja) 2024-02-06
WO2023013532A1 (ja) 2023-02-09

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