JP7385053B2 - 粘着テープ - Google Patents

粘着テープ Download PDF

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Publication number
JP7385053B2
JP7385053B2 JP2022552652A JP2022552652A JP7385053B2 JP 7385053 B2 JP7385053 B2 JP 7385053B2 JP 2022552652 A JP2022552652 A JP 2022552652A JP 2022552652 A JP2022552652 A JP 2022552652A JP 7385053 B2 JP7385053 B2 JP 7385053B2
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JP
Japan
Prior art keywords
adhesive layer
weight
meth
less
molecular weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022552652A
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English (en)
Japanese (ja)
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JPWO2023013532A5 (enrdf_load_stackoverflow
JPWO2023013532A1 (enrdf_load_stackoverflow
Inventor
友也 川本
雄大 緒方
智基 戸田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JPWO2023013532A1 publication Critical patent/JPWO2023013532A1/ja
Publication of JPWO2023013532A5 publication Critical patent/JPWO2023013532A5/ja
Priority to JP2023191259A priority Critical patent/JP2024016206A/ja
Application granted granted Critical
Publication of JP7385053B2 publication Critical patent/JP7385053B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2022552652A 2021-08-05 2022-07-29 粘着テープ Active JP7385053B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023191259A JP2024016206A (ja) 2021-08-05 2023-11-09 粘着テープ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021129139 2021-08-05
JP2021129139 2021-08-05
PCT/JP2022/029239 WO2023013532A1 (ja) 2021-08-05 2022-07-29 粘着テープ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023191259A Division JP2024016206A (ja) 2021-08-05 2023-11-09 粘着テープ

Publications (3)

Publication Number Publication Date
JPWO2023013532A1 JPWO2023013532A1 (enrdf_load_stackoverflow) 2023-02-09
JPWO2023013532A5 JPWO2023013532A5 (enrdf_load_stackoverflow) 2023-09-08
JP7385053B2 true JP7385053B2 (ja) 2023-11-21

Family

ID=85154708

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022552652A Active JP7385053B2 (ja) 2021-08-05 2022-07-29 粘着テープ
JP2023191259A Pending JP2024016206A (ja) 2021-08-05 2023-11-09 粘着テープ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023191259A Pending JP2024016206A (ja) 2021-08-05 2023-11-09 粘着テープ

Country Status (3)

Country Link
JP (2) JP7385053B2 (enrdf_load_stackoverflow)
TW (1) TW202313730A (enrdf_load_stackoverflow)
WO (1) WO2023013532A1 (enrdf_load_stackoverflow)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001234135A (ja) 2000-02-24 2001-08-28 Nitto Denko Corp 感圧性接着シ―ト類および機能性フイルムの固定方法
JP2003034781A (ja) 2001-05-15 2003-02-07 Soken Chem & Eng Co Ltd 光学部材用粘着剤及び該粘着剤を設けた光学部材
JP2003049143A (ja) 2001-05-31 2003-02-21 Soken Chem & Eng Co Ltd 光学フィルム用粘着剤及び該粘着剤を用いた光学フィルム
JP2009173746A (ja) 2008-01-23 2009-08-06 Lintec Corp 粘着シートおよび液晶表示装置
JP2020122141A (ja) 2019-01-30 2020-08-13 日東電工株式会社 粘着剤層付き光学積層フィルム及び画像表示装置
JP2020158756A (ja) 2019-03-20 2020-10-01 積水化学工業株式会社 粘着テープ及び粘着テープロール
WO2021125247A1 (ja) 2019-12-18 2021-06-24 積水化学工業株式会社 粘着剤、粘着テープ、電化製品、車載部材、及び固定方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001234135A (ja) 2000-02-24 2001-08-28 Nitto Denko Corp 感圧性接着シ―ト類および機能性フイルムの固定方法
JP2003034781A (ja) 2001-05-15 2003-02-07 Soken Chem & Eng Co Ltd 光学部材用粘着剤及び該粘着剤を設けた光学部材
JP2003049143A (ja) 2001-05-31 2003-02-21 Soken Chem & Eng Co Ltd 光学フィルム用粘着剤及び該粘着剤を用いた光学フィルム
JP2009173746A (ja) 2008-01-23 2009-08-06 Lintec Corp 粘着シートおよび液晶表示装置
JP2020122141A (ja) 2019-01-30 2020-08-13 日東電工株式会社 粘着剤層付き光学積層フィルム及び画像表示装置
JP2020158756A (ja) 2019-03-20 2020-10-01 積水化学工業株式会社 粘着テープ及び粘着テープロール
WO2021125247A1 (ja) 2019-12-18 2021-06-24 積水化学工業株式会社 粘着剤、粘着テープ、電化製品、車載部材、及び固定方法

Also Published As

Publication number Publication date
TW202313730A (zh) 2023-04-01
WO2023013532A1 (ja) 2023-02-09
JPWO2023013532A1 (enrdf_load_stackoverflow) 2023-02-09
JP2024016206A (ja) 2024-02-06

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