TW202311563A - 銅構件 - Google Patents

銅構件 Download PDF

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Publication number
TW202311563A
TW202311563A TW111111931A TW111111931A TW202311563A TW 202311563 A TW202311563 A TW 202311563A TW 111111931 A TW111111931 A TW 111111931A TW 111111931 A TW111111931 A TW 111111931A TW 202311563 A TW202311563 A TW 202311563A
Authority
TW
Taiwan
Prior art keywords
copper
copper member
resin substrate
resin
layer
Prior art date
Application number
TW111111931A
Other languages
English (en)
Chinese (zh)
Inventor
小畠直貴
佐藤牧子
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202311563A publication Critical patent/TW202311563A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
TW111111931A 2021-04-20 2022-03-29 銅構件 TW202311563A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-071460 2021-04-20
JP2021071460 2021-04-20

Publications (1)

Publication Number Publication Date
TW202311563A true TW202311563A (zh) 2023-03-16

Family

ID=83722285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111111931A TW202311563A (zh) 2021-04-20 2022-03-29 銅構件

Country Status (5)

Country Link
JP (1) JPWO2022224684A1 (https=)
KR (1) KR20230170899A (https=)
CN (1) CN116670326A (https=)
TW (1) TW202311563A (https=)
WO (1) WO2022224684A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822620B (zh) * 2023-03-24 2023-11-11 景碩科技股份有限公司 銅箔基板的前處理方法
TWI876554B (zh) * 2023-09-26 2025-03-11 南亞塑膠工業股份有限公司 銅箔的表面處理方法、抗氧化銅箔、及鋰電池的負極

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000036660A (ja) * 1998-07-17 2000-02-02 Hitachi Chem Co Ltd ビルドアップ多層配線板の製造方法
CN109951964A (zh) * 2013-07-23 2019-06-28 Jx日矿日石金属株式会社 表面处理铜箔、附载体铜箔、基材、及树脂基材
WO2015040998A1 (ja) * 2013-09-20 2015-03-26 三井金属鉱業株式会社 銅箔、キャリア箔付銅箔及び銅張積層板
KR101701103B1 (ko) * 2015-03-12 2017-02-01 주식회사 두하누리 금속과 고분자 간 접착 방법 및 이를 이용한 기판
WO2017056534A1 (ja) * 2015-09-30 2017-04-06 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP6985745B2 (ja) * 2018-06-20 2021-12-22 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP6806405B1 (ja) * 2020-04-27 2021-01-06 ナミックス株式会社 複合銅部材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822620B (zh) * 2023-03-24 2023-11-11 景碩科技股份有限公司 銅箔基板的前處理方法
TWI876554B (zh) * 2023-09-26 2025-03-11 南亞塑膠工業股份有限公司 銅箔的表面處理方法、抗氧化銅箔、及鋰電池的負極

Also Published As

Publication number Publication date
KR20230170899A (ko) 2023-12-19
JPWO2022224684A1 (https=) 2022-10-27
CN116670326A (zh) 2023-08-29
WO2022224684A1 (ja) 2022-10-27

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