CN116670326A - 铜部件 - Google Patents

铜部件 Download PDF

Info

Publication number
CN116670326A
CN116670326A CN202280008657.5A CN202280008657A CN116670326A CN 116670326 A CN116670326 A CN 116670326A CN 202280008657 A CN202280008657 A CN 202280008657A CN 116670326 A CN116670326 A CN 116670326A
Authority
CN
China
Prior art keywords
copper
base material
resin base
resin
copper part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280008657.5A
Other languages
English (en)
Chinese (zh)
Inventor
小畠直贵
佐藤牧子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of CN116670326A publication Critical patent/CN116670326A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
CN202280008657.5A 2021-04-20 2022-03-23 铜部件 Pending CN116670326A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-071460 2021-04-20
JP2021071460 2021-04-20
PCT/JP2022/013649 WO2022224684A1 (ja) 2021-04-20 2022-03-23 銅部材

Publications (1)

Publication Number Publication Date
CN116670326A true CN116670326A (zh) 2023-08-29

Family

ID=83722285

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280008657.5A Pending CN116670326A (zh) 2021-04-20 2022-03-23 铜部件

Country Status (5)

Country Link
JP (1) JPWO2022224684A1 (https=)
KR (1) KR20230170899A (https=)
CN (1) CN116670326A (https=)
TW (1) TW202311563A (https=)
WO (1) WO2022224684A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822620B (zh) * 2023-03-24 2023-11-11 景碩科技股份有限公司 銅箔基板的前處理方法
TWI876554B (zh) * 2023-09-26 2025-03-11 南亞塑膠工業股份有限公司 銅箔的表面處理方法、抗氧化銅箔、及鋰電池的負極

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105408525A (zh) * 2013-07-23 2016-03-16 Jx日矿日石金属株式会社 表面处理铜箔、附载体铜箔、基材、树脂基材、印刷配线板、覆铜积层板及印刷配线板的制造方法
CN105556004A (zh) * 2013-09-20 2016-05-04 三井金属矿业株式会社 铜箔、带有载体箔的铜箔及覆铜层压板
KR20160109731A (ko) * 2015-03-12 2016-09-21 주식회사 두하누리 금속과 고분자 간 접착 방법 및 이를 이용한 기판
JP6806405B1 (ja) * 2020-04-27 2021-01-06 ナミックス株式会社 複合銅部材

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000036660A (ja) * 1998-07-17 2000-02-02 Hitachi Chem Co Ltd ビルドアップ多層配線板の製造方法
WO2017056534A1 (ja) * 2015-09-30 2017-04-06 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
JP6985745B2 (ja) * 2018-06-20 2021-12-22 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105408525A (zh) * 2013-07-23 2016-03-16 Jx日矿日石金属株式会社 表面处理铜箔、附载体铜箔、基材、树脂基材、印刷配线板、覆铜积层板及印刷配线板的制造方法
CN105556004A (zh) * 2013-09-20 2016-05-04 三井金属矿业株式会社 铜箔、带有载体箔的铜箔及覆铜层压板
KR20160109731A (ko) * 2015-03-12 2016-09-21 주식회사 두하누리 금속과 고분자 간 접착 방법 및 이를 이용한 기판
JP6806405B1 (ja) * 2020-04-27 2021-01-06 ナミックス株式会社 複合銅部材

Also Published As

Publication number Publication date
KR20230170899A (ko) 2023-12-19
TW202311563A (zh) 2023-03-16
JPWO2022224684A1 (https=) 2022-10-27
WO2022224684A1 (ja) 2022-10-27

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