JPWO2022224684A1 - - Google Patents
Info
- Publication number
- JPWO2022224684A1 JPWO2022224684A1 JP2023516361A JP2023516361A JPWO2022224684A1 JP WO2022224684 A1 JPWO2022224684 A1 JP WO2022224684A1 JP 2023516361 A JP2023516361 A JP 2023516361A JP 2023516361 A JP2023516361 A JP 2023516361A JP WO2022224684 A1 JPWO2022224684 A1 JP WO2022224684A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
- C23C22/63—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021071460 | 2021-04-20 | ||
PCT/JP2022/013649 WO2022224684A1 (ja) | 2021-04-20 | 2022-03-23 | 銅部材 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022224684A1 true JPWO2022224684A1 (ja) | 2022-10-27 |
Family
ID=83722285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023516361A Pending JPWO2022224684A1 (ja) | 2021-04-20 | 2022-03-23 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022224684A1 (ja) |
KR (1) | KR20230170899A (ja) |
CN (1) | CN116670326A (ja) |
TW (1) | TW202311563A (ja) |
WO (1) | WO2022224684A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI822620B (zh) * | 2023-03-24 | 2023-11-11 | 景碩科技股份有限公司 | 銅箔基板的前處理方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000036660A (ja) * | 1998-07-17 | 2000-02-02 | Hitachi Chem Co Ltd | ビルドアップ多層配線板の製造方法 |
MY182166A (en) * | 2013-09-20 | 2021-01-18 | Namics Corp | Copper foil, copper foil with carrier foil, and copper-clad laminate |
CN107002249B (zh) * | 2015-09-30 | 2018-05-22 | 三井金属矿业株式会社 | 粗糙化处理铜箔、覆铜层叠板和印刷电路板 |
JP6985745B2 (ja) * | 2018-06-20 | 2021-12-22 | ナミックス株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
JP6806405B1 (ja) * | 2020-04-27 | 2021-01-06 | ナミックス株式会社 | 複合銅部材 |
-
2022
- 2022-03-23 WO PCT/JP2022/013649 patent/WO2022224684A1/ja active Application Filing
- 2022-03-23 CN CN202280008657.5A patent/CN116670326A/zh active Pending
- 2022-03-23 JP JP2023516361A patent/JPWO2022224684A1/ja active Pending
- 2022-03-23 KR KR1020237021593A patent/KR20230170899A/ko unknown
- 2022-03-29 TW TW111111931A patent/TW202311563A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20230170899A (ko) | 2023-12-19 |
CN116670326A (zh) | 2023-08-29 |
TW202311563A (zh) | 2023-03-16 |
WO2022224684A1 (ja) | 2022-10-27 |