TW202236470A - Semiconductor strip cutting and sorting equipment, packaging body drying device and carrying device - Google Patents

Semiconductor strip cutting and sorting equipment, packaging body drying device and carrying device Download PDF

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TW202236470A
TW202236470A TW110142978A TW110142978A TW202236470A TW 202236470 A TW202236470 A TW 202236470A TW 110142978 A TW110142978 A TW 110142978A TW 110142978 A TW110142978 A TW 110142978A TW 202236470 A TW202236470 A TW 202236470A
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package
unit
base
drying
air
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TW110142978A
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Chinese (zh)
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TWI788107B (en
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李龍煥
李龍玹
李昊俊
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韓商细美事有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

The embodiment of the invention provides semiconductor strip cutting and sorting equipment, a packaging body drying device and a carrying device. A package drying apparatus for drying singulated packages in a semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention comprises: a base on which the packages are placed and which moves along a transfer guide; the protection unit is arranged on the moving path of the base to surround the base; the air injection unit is arranged on the protection unit and injects air towards the packaging body placed on the base; and a suction unit which is provided on the protection unit and sucks the water vapor scattered from the package.

Description

半導體條帶切割及分類設備、封裝體乾燥裝置及搬運裝置Semiconductor strip cutting and sorting equipment, package drying equipment and handling equipment

本發明涉及半導體條帶切割及分類設備中封裝體乾燥裝置，更具體地提供用於迅速且有效地乾燥單個化的封裝體的裝置。The present invention relates to a package drying device in semiconductor strip cutting and sorting equipment, and more particularly provides a device for rapidly and efficiently drying singulated packages.

半導體製造製程作爲用於在晶圓上製造半導體元件的製程，例如包括曝光、蒸鍍、蝕刻、離子注入、清洗等。半導體條帶切割及分類設備將配置有複數個封裝體的條帶以封裝體單位切割而單個化，通過針對各封裝體的清洗、乾燥、檢查，區分爲正常或者不良狀態而分別分類並裝載於最終的收納容器即托盤。The semiconductor manufacturing process includes, for example, exposure, evaporation, etching, ion implantation, cleaning, and the like as a process for manufacturing semiconductor elements on a wafer. Semiconductor tape cutting and sorting equipment cuts and separates a tape with a plurality of packages in units of packages, cleans, dries, and inspects each package, classifies it as normal or defective, and loads it in the The ultimate storage container is the tray.

針對各封裝體的檢查通過相機之類視覺檢查裝置執行，爲了精密的檢查，各封裝體需要去除可能會阻礙檢查的異物。使用於清洗被切割的封裝體的清洗液也可能在檢查過程中成爲阻礙，因此需要管理成在封裝體不殘留清洗液。The inspection of each package is performed by a visual inspection device such as a camera. For precise inspection, each package needs to remove foreign matter that may hinder the inspection. The cleaning liquid used for cleaning the cut package may hinder the inspection process, so it is necessary to manage so that the cleaning liquid does not remain on the package.

因此，本發明的實施例提供能夠在有效地去除殘留於單個化的半導體封裝體的清洗液的同時防止水汽飛散到其它裝置的封裝體乾燥裝置以及具備封裝體乾燥裝置的半導體條帶切割及分類設備。Therefore, an embodiment of the present invention provides a package drying device capable of effectively removing cleaning fluid remaining in singulated semiconductor packages while preventing water vapor from scattering to other devices, and a semiconductor strip cutting and sorting device equipped with a package drying device. equipment.

本發明的解决課題不限於以上提及的，所屬技術領域中具有通常知識者可以從下面的記載明確地理解未提及的其它解决課題。The problems to be solved by the present invention are not limited to those mentioned above, and other problems not mentioned can be clearly understood from the following description by those skilled in the art.

根據本發明的實施例的用於在半導體條帶切割及分類設備中乾燥單個化的封裝體的封裝體乾燥裝置包括：底座，安放所述封裝體並沿著傳送導件移動；防護單元，在所述底座的移動路徑上設置成圍繞所述底座；噴氣單元，設置於所述防護單元並朝向安放於所述底座的封裝體噴射空氣；以及抽吸單元，設置於所述防護單元並抽吸從所述封裝體飛散的水汽。A package drying device for drying individualized packages in a semiconductor strip cutting and sorting device according to an embodiment of the present invention includes: a base for placing the packages and moving along a conveying guide; a protection unit for The movement path of the base is arranged to surround the base; an air jet unit is arranged on the protection unit and sprays air toward the package placed on the base; and a suction unit is arranged on the protection unit and sucks Moisture escaping from the package.

根據本發明的實施例，可以是，所述防護單元位於從在所述底座安放所述封裝體的安放位置到對所述封裝體執行檢查的檢查位置之間。According to an embodiment of the present invention, the protection unit may be located between a placement position where the package is placed on the base and an inspection position where the package is inspected.

根據本發明的實施例，可以是，所述噴氣單元向傾斜的方向噴射空氣。According to an embodiment of the present invention, it may be that the air injection unit injects air in an oblique direction.

根據本發明的實施例，可以是，所述抽吸單元位於所述噴氣單元傾斜的方向。According to an embodiment of the present invention, it may be that the suction unit is located in a direction where the air injection unit is inclined.

根據本發明的實施例，可以是，所述抽吸單元向相對於所述噴氣單元傾斜的方向相反方向傾斜。According to an embodiment of the present invention, the suction unit may be inclined in a direction opposite to the direction in which the air injection unit is inclined.

根據本發明的實施例，可以是，所述底座包括：安放部，安放所述封裝體；以及凸出部，比所述安放部凸出。According to an embodiment of the present invention, it may be that the base includes: a seating portion for seating the package; and a protruding portion protruding from the seating portion.

根據本發明的實施例，可以是，所述安放部具有與所述封裝體相同的大小以及形狀。According to an embodiment of the present invention, it may be that the placement portion has the same size and shape as the package body.

根據本發明的實施例，可以是，所述凸出部從所述安放部凸出與所述封裝體的厚度相同的高度。According to an embodiment of the present invention, it may be that the protruding portion protrudes from the seating portion to a height equal to the thickness of the package.

根據本發明的實施例的在半導體條帶切割及分類設備中搬運單個化的封裝體的封裝體搬運裝置包括：翻轉台，包括安放所述封裝體的底座和用於旋轉所述底座的旋轉軸；乾燥單元，乾燥安放於所述底座的所述封裝體；以及隨行夾具台，從所述翻轉台容納所述封裝體。所述乾燥單元包括：防護單元，在所述翻轉台的移動路徑上設置成圍繞所述底座；噴氣單元，設置於所述防護單元並朝向安放於所述底座的封裝體噴射空氣；以及抽吸單元，設置於所述防護單元並抽吸從所述封裝體飛散的水汽。A package handling device for handling individualized packages in a semiconductor strip cutting and sorting device according to an embodiment of the present invention includes: an overturning table including a base for placing the package and a rotating shaft for rotating the base a drying unit for drying the package mounted on the base; and a pallet table for accommodating the package from the turning table. The drying unit includes: a protection unit arranged to surround the base on the moving path of the turning table; an air spray unit arranged on the protection unit and spraying air toward the package placed on the base; and suction The unit is arranged on the protection unit and sucks the water vapor scattered from the package.

根據本發明的實施例的半導體條帶切割及分類設備包括：裝載單元，裝載配置有複數個封裝體的半導體條帶；切割單元，切割所述半導體條帶並傳送單個化的半導體封裝體；以及分類單元，對所述半導體封裝體進行乾燥及檢查並收納於托盤。所述分類單元包括：翻轉台，包括安放所述封裝體並沿著傳送導件移動的底座以及用於旋轉所述底座的旋轉軸；乾燥單元，乾燥安放於所述底座的所述封裝體；以及隨行夾具台，從所述翻轉台容納所述封裝體。所述底座包括：安放部，安放所述封裝體；以及凸出部，形成於所述底座中除所述安放部以外的其餘區域，並比所述安放部凸出所述封裝體的高度，所述乾燥單元包括：防護單元，在所述底座的移動路徑上設置成圍繞所述底座；噴氣單元，設置於所述防護單元並朝向安放於所述底座的安放部的封裝體噴射空氣；以及抽吸單元，設置於所述防護單元並抽吸從所述封裝體飛散的水汽。The semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention includes: a loading unit that loads a semiconductor strip configured with a plurality of packages; a cutting unit that cuts the semiconductor strip and transfers the individualized semiconductor packages; and The sorting unit dries and inspects the semiconductor packages and stores them in trays. The sorting unit includes: an overturning table, including a base for placing the package and moving along the conveying guide, and a rotating shaft for rotating the base; a drying unit, for drying the package placed on the base; and a pallet station for receiving the packages from the inverting station. The base includes: a placement part for placing the package; and a protruding part formed in the rest of the base except the placement part and protruding from the placement part by the height of the package, The drying unit includes: a protection unit disposed on a moving path of the base so as to surround the base; an air spray unit disposed on the protection unit and spraying air toward a package placed on a mounting portion of the base; and The suction unit is arranged on the protection unit and sucks the water vapor scattered from the package.

根據本發明的實施例，將防護單元配置於安放有封裝體的底座的移動路徑上，並將噴射空氣的噴氣單元以及抽吸水汽的抽吸單元構成於防護單元中，從而能夠在從封裝體迅速且有效地去除封裝體的水汽的同時防止水汽飛散。According to an embodiment of the present invention, the protection unit is arranged on the moving path of the base on which the package is placed, and the air injection unit for spraying air and the suction unit for sucking water vapor are formed in the protection unit, so that Quickly and effectively remove the water vapor from the package while preventing the water vapor from scattering.

本發明的效果不限於以上提及的，所屬技術領域中具有通常知識者可以從下面的記載明確地理解未提及的其它效果。The effects of the present invention are not limited to those mentioned above, and other effects not mentioned can be clearly understood from the following description by those skilled in the art.

以下，參照圖式來詳細說明本發明的實施例，以使得本發明所屬技術領域中具有通常知識者能夠容易地實施。本發明可以以各種不同方式實現，不限於在此說明的實施例。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings so that those skilled in the art to which the present invention pertains can easily implement. The present invention can be implemented in various ways and is not limited to the embodiments described here.

爲了清楚地說明本發明，省略了與說明無關的部分，貫穿說明書整體對相同或類似的構成要件標注相同的圖式標記。In order to clearly describe the present invention, parts irrelevant to the description are omitted, and the same or similar constituent elements are denoted by the same drawing symbols throughout the entire specification.

另外，在多個實施例中，對具有相同結構的構成要件，使用相同的圖式標記來僅說明代表性實施例，在其餘的其它實施例中僅說明與代表性實施例不同的結構。In addition, among the plurality of embodiments, only representative embodiments will be described using the same reference numerals for constituent elements having the same structure, and only structures different from the representative embodiments will be described in the remaining other embodiments.

在說明書整體中，當表述某部分與其它部分“連接（或者結合）”時，其不僅是“直接連接（或者結合）”的情况，還包括將其它部件置於中間“間接連接（或者結合）”的情况。另外，當表述某部分“包括”某構成要件時，只要沒有特別相反記載，其意指可以還包括其它構成要件而不是排除其它構成要件。Throughout the specification, when it is expressed that a certain part is "connected (or combined)" with other parts, it is not only the case of "directly connected (or combined)", but also "indirectly connected (or combined)" with other parts interposed. "Case. In addition, when it is stated that a certain part "includes" a certain constituent element, as long as there is no specific contrary statement, it means that other constituent elements may be included rather than excluded.

只要沒有不同地定義，包括技術或科學術語在內在此使用的所有術語具有與本發明所屬技術領域中具有通常知識者一般所理解的含義相同的含義。在通常使用的詞典中定義的術語之類的術語應解釋爲具有與相關技術文脈上具有的含義一致的含義，只要在本申請中沒有明確定義，不會理想性或過度地解釋爲形式性含義。Unless defined differently, all terms used herein including technical or scientific terms have the same meaning as generally understood by those having ordinary knowledge in the technical field to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having meanings that are consistent with the meanings they have in the relevant technical context, and as long as they are not clearly defined in this application, they will not be ideally or excessively interpreted as formal meanings .

圖1示出根據本發明的實施例的半導體條帶切割及分類設備10的概要結構。參照圖1，根據本發明的實施例的半導體封裝體切割及分類設備10包括裝載單元100、切割單元200以及分類單元300。FIG. 1 shows a schematic structure of a semiconductor strip cutting and sorting apparatus 10 according to an embodiment of the present invention. Referring to FIG. 1 , a semiconductor package cutting and sorting apparatus 10 according to an embodiment of the present invention includes a loading unit 100 , a cutting unit 200 and a sorting unit 300 .

根據本發明的實施例的半導體條帶切割及分類設備10包括裝載配置有複數個封裝體的半導體條帶S的裝載單元100、切割半導體條帶S並傳送單個化的封裝體P的切割單元200以及乾燥及檢查封裝體P並收納於托盤的分類單元300。The semiconductor strip cutting and sorting apparatus 10 according to an embodiment of the present invention includes a loading unit 100 that loads a semiconductor strip S configured with a plurality of packages, a cutting unit 200 that cuts the semiconductor strip S and transfers the singulated packages P And a sorting unit 300 for drying and inspecting the packages P and storing them in trays.

裝載單元100將從外部傳送的半導體條帶S向切割單元200的臨時保管單元205傳遞。雖未在圖1詳細示出，裝載單元100可以包括裝載半導體條帶S的料盒以及將半導體條帶S推動傳遞的推送器。供應到裝載單元100的半導體條帶S可以位於臨時保管單元205。The loading unit 100 transfers the semiconductor strip S conveyed from the outside to the temporary storage unit 205 of the dicing unit 200 . Although not shown in detail in FIG. 1 , the loading unit 100 may include a magazine for loading the semiconductor strips S and a pusher for pushing the semiconductor strips S for delivery. The semiconductor strip S supplied to the loading unit 100 may be located in the temporary storage unit 205 .

條帶拾取器210把持位於臨時保管單元205的半導體條帶S向卡盤240傳送。封裝體拾取器220將被切刀250切割並通過卡盤240傳送的封裝體P通過真空吸附方式把持而向清洗單元260以及翻轉台310傳送。導架230提供用於供條帶拾取器210、封裝體拾取器220向X軸方向移動的路徑。在導架230可以結合用於使條帶拾取器210以及封裝體拾取器220移動的驅動部。The tape picker 210 grasps the semiconductor tape S located in the temporary storage unit 205 and transfers it to the chuck 240 . The package picker 220 grasps the package P cut by the cutter 250 and transported by the chuck 240 by vacuum suction, and transports it to the cleaning unit 260 and the turning table 310 . The guide frame 230 provides a path for the tape picker 210 and the package picker 220 to move in the X-axis direction. A driving part for moving the tape picker 210 and the package picker 220 may be incorporated in the guide frame 230 .

卡盤240可以使得在條帶拾取器210和切刀250之間以及在切刀250和封裝體拾取器220之間分別傳送半導體條帶S和封裝體P。卡盤240可以向Y軸方向移動，並可以以Z軸方向爲中心旋轉，並且可以安放半導體條帶S。卡盤240將通過條帶拾取器210傳送的半導體條帶S吸附並向切刀250傳送。另外，卡盤240將通過切刀250完成切割的複數個封裝體P向封裝體拾取器220傳遞。即，卡盤240可以在切刀250和第一導架230之間往復移動。可以是，封裝體拾取器220吸附在清洗單元260中清洗的半導體封裝體P而向翻轉台310傳送，傳送到翻轉台310的半導體封裝體P通過乾燥單元320乾燥。在此，翻轉台310可以構成爲沿著傳送導件314移動。The chuck 240 may allow semiconductor strips S and packages P to be transferred between the strip picker 210 and the cutter 250 and between the cutter 250 and the package picker 220 , respectively. The chuck 240 can move in the Y-axis direction and rotate around the Z-axis direction, and can place the semiconductor strip S thereon. The chuck 240 absorbs and transfers the semiconductor strip S conveyed by the tape picker 210 to the cutter 250 . In addition, the chuck 240 transfers the plurality of packages P cut by the cutter 250 to the package picker 220 . That is, the chuck 240 may reciprocate between the cutter 250 and the first guide frame 230 . Alternatively, the package picker 220 absorbs the semiconductor packages P cleaned in the cleaning unit 260 and transfers them to the inversion table 310 , and the semiconductor packages P transferred to the inversion table 310 are dried by the drying unit 320 . Here, the turning table 310 may be configured to move along the conveying guide 314 .

分類單元300根據針對各半導體封裝體P的檢查結果而分別分類半導體封裝體P。分類單元300可以指稱爲用於搬運單個化的封裝體P的搬運裝置。更具體地，分類單元300將通過球檢查單元330B、標記檢查單元330M、對準檢查單元360完成檢查而裝載於第一隨行夾具台341和第二隨行夾具台346的半導體封裝體P獨立地拾取而根據檢查結果依次分類並向其它地點傳送。第一隨行夾具台341和第二隨行夾具台346可以分別通過第一隨行夾具驅動部件340和第二隨行夾具驅動部件345移動。The sorting unit 300 sorts the semiconductor packages P according to the inspection results for the semiconductor packages P, respectively. The sorting unit 300 may refer to a handling device for handling the singulated packages P. As shown in FIG. More specifically, the sorting unit 300 independently inspects the semiconductor packages P loaded on the first pallet 341 and the second pallet 346 after being inspected by the ball inspection unit 330B, the mark inspection unit 330M, and the alignment inspection unit 360 . According to the inspection results, they are sorted sequentially and sent to other locations. The first pallet table 341 and the second pallet table 346 may be moved by the first pallet driving part 340 and the second pallet driving part 345, respectively.

爲此的分類單元300可以包括分揀拾取器370、分揀拾取器驅動部件380、第一搬出托盤351、第二搬出托盤356、第一搬出托盤驅動部件350以及第二搬出托盤驅動部件355。The sorting unit 300 for this purpose may include a sorting picker 370 , a sorting picker drive unit 380 , a first carry-out tray 351 , a second carry-out tray 356 , a first carry-out tray drive unit 350 , and a second carry-out tray drive unit 355 .

分揀拾取器370將通過球檢查單元330B、標記檢查單元330M、對準檢查單元360完成檢查而分別裝載於第一隨行夾具台341和第二隨行夾具台346的半導體封裝體P拾取而向要後述的第一搬出托盤351、第二搬出托盤356傳送。The sorting picker 370 picks up the semiconductor packages P that have been inspected by the ball inspection unit 330B, the mark inspection unit 330M, and the alignment inspection unit 360 and loaded on the first pallet table 341 and the second pallet table 346 respectively. It is conveyed to the first carry-out tray 351 and the second carry-out tray 356 which will be described later.

分揀拾取器驅動部件380可以呈導軌狀形成並沿著X軸方向設置，一部分設置成與對準檢查單元360相鄰。分揀拾取器驅動部件380使分揀拾取器370向X軸方向移動。爲此的分揀拾取器驅動部件380可以內置有用於移動分揀拾取器370的驅動工具。The sorting picker driving part 380 may be formed in a rail shape and disposed along the X-axis direction, and a part thereof is disposed adjacent to the alignment checking unit 360 . The sorting picker drive unit 380 moves the sorting picker 370 in the X-axis direction. The sorting picker driving part 380 for this purpose may incorporate a driving tool for moving the sorting picker 370 .

第一搬出托盤351和第二搬出托盤356可以分別裝載合格半導體封裝體P和不合格半導體封裝體P而向其它地點搬出。與此不同地，第一搬出托盤351和第二搬出托盤356也可以根據製造狀態而將半導體封裝體P評價等級並按照等級分別裝載。例如，可以是，第一搬出托盤351裝載A等級的半導體封裝體P，第二搬出托盤356裝載製造狀態比A等級低的B等級的半導體封裝體P。The first carry-out tray 351 and the second carry-out tray 356 can be loaded with acceptable semiconductor packages P and defective semiconductor packages P, respectively, and can be carried out to other locations. On the other hand, the first carry-out tray 351 and the second carry-out tray 356 may evaluate and rank the semiconductor packages P according to the manufacturing state, and may load each rank. For example, the first carry-out tray 351 may be loaded with A-grade semiconductor packages P, and the second carry-out tray 356 may be loaded with B-grade semiconductor packages P whose manufacturing status is lower than that of A-grade.

若分揀拾取器370從第一隨行夾具台341和第二隨行夾具台346拾取半導體封裝體P而全部裝載於第一搬出托盤351或者第二搬出托盤356各自，第一搬出托盤351或者第二搬出托盤356向Y軸方向移動而將半導體封裝體P向其它地點傳遞。If the sorting picker 370 picks up the semiconductor packages P from the first pallet 341 and the second pallet 346 and loads them all on the first carry-out tray 351 or the second carry-out tray 356, the first carry-out tray 351 or The second carry-out tray 356 moves in the Y-axis direction to transfer the semiconductor package P to another point.

第一搬出托盤驅動部件350使第一搬出托盤351移動。第一搬出托盤驅動部件350可以內置有用於移動第一搬出托盤351的驅動工具。The first delivery tray drive unit 350 moves the first delivery tray 351 . The first carry-out tray driving unit 350 may incorporate a drive tool for moving the first carry-out tray 351 .

第二搬出托盤驅動部件355使第二搬出托盤356移動。第二搬出托盤驅動部件355可以內置有用於移動第二搬出托盤356的驅動工具。The second delivery tray drive unit 355 moves the second delivery tray 356 . The second carry-out tray driving unit 355 may incorporate a drive tool for moving the second carry-out tray 356 .

半導體條帶切割及分類設備10可以如前述那樣將半導體條帶S切割、清洗、乾燥以及檢查後分類並向其它地點排出。另一方面，根據本發明的實施例的封裝體拾取器220不限於包括在半導體條帶切割及分類設備10中，可以適用於普通的半導體封裝體製造系統。以下，說明用於在清洗單元260中使用清洗液而在乾燥單元320中迅速且有效地乾燥封裝體P的裝置以及方法。The semiconductor strip cutting and sorting apparatus 10 can sort and discharge the semiconductor strip S after cutting, cleaning, drying and checking as described above. On the other hand, the package picker 220 according to the embodiment of the present invention is not limited to be included in the semiconductor strip cutting and sorting apparatus 10, and may be applicable to a general semiconductor package manufacturing system. Hereinafter, an apparatus and method for drying packages P quickly and efficiently in drying unit 320 using cleaning liquid in cleaning unit 260 will be described.

通常，半導體條帶S和封裝體P由形成有用於電連接的球（Ball）的球面B和刻印有各封裝體P的標記的標記面M構成。另一方面，將封裝體P的球面B朝上且標記面M朝下的狀態指稱爲死蟲（Dead Bug），將封裝體P的標記面M朝上且球面B朝下的狀態指稱爲活蟲（Live Bug）。切割單元200中的切割以及清洗過程都在球面B朝上的死蟲狀態下執行，各封裝體P在死蟲狀態下通過封裝體拾取器220向翻轉台310傳遞。Generally, the semiconductor strip S and the package P are composed of a spherical surface B on which balls for electrical connection are formed, and a marking surface M on which a mark of each package P is engraved. On the other hand, the state of the package P with the spherical surface B facing upward and the marked surface M facing downward is referred to as a dead bug (Dead Bug), and the state of the package P with the marked surface M facing upward and the spherical surface B facing downward is referred to as a live bug. Bug (Live Bug). The cutting and cleaning processes in the cutting unit 200 are performed in a state of dead insects with the spherical surface B facing upwards, and each package P is transferred to the turning table 310 through the package picker 220 in the state of dead insects.

參照圖2的（a）以及圖3的（a），翻轉台310包括：能夠向水平方向移動的外圍架311；吸附並固定封裝體P的底座312；以及使底座312相對於外圍架311旋轉的旋轉軸313。底座312可以以抽吸封裝體P的標記面M的狀態以旋轉軸313爲中心旋轉而如圖2的（a）那樣使封裝體P的球面B朝上，另外，可以如圖3的（b）那樣使封裝體P的球面B朝下。2 (a) and FIG. 3 (a), the flip table 310 includes: a peripheral frame 311 that can move horizontally; a base 312 that absorbs and fixes the package P; and rotates the base 312 relative to the peripheral frame 311 The axis of rotation 313 . The base 312 can be rotated around the rotating shaft 313 in the state of suctioning the marked surface M of the package P so that the spherical surface B of the package P faces upward as shown in (a) of FIG. ) so that the spherical surface B of the package P faces down.

圖4示出通過噴射空氣去除封裝體的水汽的過程。參照圖4，在安放於底座312的封裝體P的周邊殘留有清洗液，噴氣單元322在上方朝向封裝體P噴射空氣而去除水汽。然而，如圖4中用虛線所表示那樣，發生由於底座312和封裝體P之間的臺階而水汽堆積的情况。針對這樣堆積的水汽，即使噴射空氣也不易去除水汽，另外若向臺階噴射空氣，則産生噪音而可能對作業環境帶來壞影響。FIG. 4 shows the process of removing moisture from the package by spraying air. Referring to FIG. 4 , cleaning liquid remains around the package P placed on the base 312 , and the air spray unit 322 sprays air toward the package P from above to remove water vapor. However, as indicated by the dotted line in FIG. 4 , a situation where moisture accumulates due to a step between the base 312 and the package P occurs. For such accumulated water vapor, it is difficult to remove the water vapor even by spraying air, and if air is sprayed on the steps, noise may be generated and may have a bad influence on the work environment.

同時，若對封裝體P噴射空氣，則一部分的水汽蒸發，另一部分水汽可能飛散到周邊的其它裝置。如圖1所示，在乾燥單元320的周邊可以設置球檢查單元330B之類視覺檢查裝置，若水汽飛散到視覺檢查裝置，則可能對以後的檢查功能帶來壞影響。At the same time, when air is injected into the package P, part of the water vapor evaporates, and another part of the water vapor may scatter to other peripheral devices. As shown in FIG. 1 , a visual inspection device such as a ball inspection unit 330B can be installed around the drying unit 320 . If water vapor scatters to the visual inspection device, it may have a bad influence on the subsequent inspection function.

因此，本發明的實施例提供能夠迅速且有效地去除封裝體P的水汽的乾燥裝置。根據本發明的實施例，構成位於底座312的移動路徑而阻斷飛散的水汽以使得不從封裝體飛散水汽的防護單元321，將朝向封裝體P噴射空氣的噴氣單元322和從封裝體P抽吸水汽的抽吸單元323構成在防護單元321的內部，從而能夠在去除封裝體P的水汽的同時使水汽不飛散到周邊。Therefore, the embodiments of the present invention provide a drying device capable of removing moisture from the package P quickly and effectively. According to an embodiment of the present invention, the protective unit 321 that forms a moving path on the base 312 to block the scattered water vapor so that the water vapor does not scatter from the package, and the air injection unit 322 that sprays air toward the package P and draws air from the package P The suction unit 323 for absorbing water vapor is formed inside the protection unit 321 so that the water vapor in the package P can be removed without scattering the water vapor to the periphery.

根據本發明的實施例的用於在半導體條帶切割及分類設備10中乾燥單個化的封裝體P的封裝體乾燥裝置包括：底座312，安放封裝體P並沿著傳送導件314移動；防護單元321，在底座312的移動路徑上設置成圍繞底座312；噴氣單元322，設置於防護單元321並朝向安放於底座312的封裝體P噴射空氣；以及抽吸單元323，設置於防護單元321並抽吸從封裝體P飛散的水汽。The package drying device for drying individualized packages P in the semiconductor strip cutting and sorting equipment 10 according to an embodiment of the present invention includes: a base 312 for placing the packages P and moving along the conveying guide 314; The unit 321 is arranged on the movement path of the base 312 to surround the base 312; the air jet unit 322 is arranged on the protection unit 321 and sprays air toward the package P placed on the base 312; and the suction unit 323 is arranged on the protection unit 321 and The water vapor scattered from the package P is sucked.

圖5至圖7示出根據本發明的實施例的封裝體乾燥裝置的一例。圖5示出從上方觀察的封裝體乾燥裝置，圖6示出從y方向觀察的封裝體乾燥裝置，圖7示出從x方向觀察的封裝體乾燥裝置。5 to 7 show an example of a package drying device according to an embodiment of the present invention. FIG. 5 shows the package drying device viewed from above, FIG. 6 shows the package drying device viewed from the y direction, and FIG. 7 shows the package drying device viewed from the x direction.

參照圖5至圖7，防護單元321位於翻轉台310的移動路徑的一部分。防護單元321具有隧道那樣的形態，阻斷成吸附於底座312的封裝體P的水汽不飛散到周邊。另外，防護單元321可以實現爲在具有隧道形態的同時能夠設置其它裝置的結構物。在防護單元321中可以設置用於去除水汽的噴氣單元322和抽吸單元323。Referring to FIGS. 5 to 7 , the protection unit 321 is located in a part of the moving path of the turning table 310 . The shield unit 321 has a tunnel-like form, and blocks the moisture of the package P adsorbed on the base 312 from scattering to the surrounding area. In addition, the protection unit 321 can be implemented as a structure capable of installing other devices while having a tunnel form. An air spray unit 322 and a suction unit 323 for removing moisture may be provided in the protection unit 321 .

根據本發明的實施例，防護單元321可以位於從在底座312安放封裝體P的安放位置P1到對封裝體P執行檢查的檢查位置P2之間。封裝體P在清洗單元260中清洗後在安放位置P1被吸附到翻轉台310的底座312，之後被翻轉台310以球面朝上的死蟲狀態傳送到檢查位置P2並進行檢查。防護單元321位於安放位置P1和檢查位置P2之間，從而能夠去除可能阻礙檢查的封裝體P的水汽。According to an embodiment of the present invention, the protection unit 321 may be located between the placement position P1 where the package P is placed on the base 312 and the inspection position P2 where the package P is inspected. After the package P is cleaned in the cleaning unit 260 , it is adsorbed to the base 312 of the inverting table 310 at the placement position P1 , and is then transported to the inspection position P2 by the inverting table 310 in the state of dead insects with the spherical surface facing upwards for inspection. The protection unit 321 is located between the placement position P1 and the inspection position P2 , so as to remove moisture that may hinder the inspection of the package P.

噴氣單元322向封裝體P噴射空氣而使水汽從封裝體P脫離。通過噴氣單元322噴射的空氣的壓力使得附著在封裝體P上的清洗液從封裝體P分離。噴氣單元322可以設置於防護單元321的頂棚而向下方並朝向封裝體P噴射空氣。The air injection unit 322 injects air to the package P to detach moisture from the package P. As shown in FIG. The pressure of the air sprayed by the air spray unit 322 separates the cleaning liquid attached to the package P from the package P. Referring to FIG. The air spray unit 322 may be disposed on the ceiling of the protection unit 321 to spray air downward and toward the package P. As shown in FIG.

抽吸單元323施加真空壓力來抽吸周邊的流體。抽吸單元323可以抽吸通過噴氣單元322的空氣壓力從封裝體P分離的水汽。抽吸單元323可以在防護單元321的頂棚設置於噴氣單元322的周邊。The suction unit 323 applies vacuum pressure to suck fluid in the periphery. The suction unit 323 may suck moisture separated from the package P by the air pressure of the air spray unit 322 . The suction unit 323 may be disposed on the ceiling of the protection unit 321 and around the air jet unit 322 .

根據本發明的實施例，噴氣單元322可以向傾斜的方向噴射空氣。如圖7所示，噴氣單元322可以以相對於垂直方向（例如：z方向）傾斜一定角度的狀態噴射空氣。例如，噴氣單元322可以朝向相對於翻轉台310的移動方向（例如：y方向）相反的方向傾斜。噴氣單元322以傾斜的狀態朝向封裝體P噴射空氣，從而能夠將水汽向一定的方向引導，能夠更容易地管理水汽聚集的位置。According to an embodiment of the present invention, the air injection unit 322 may inject air in an oblique direction. As shown in FIG. 7 , the air injection unit 322 may inject air in a state inclined at a certain angle relative to the vertical direction (eg, the z direction). For example, the air jet unit 322 may be tilted in a direction opposite to the moving direction (eg, y direction) of the turning table 310 . The air injection unit 322 injects air toward the package P in an inclined state, so that the water vapor can be guided in a certain direction, and the location where the water vapor gathers can be managed more easily.

根據本發明的實施例，抽吸單元323可以位於噴氣單元322傾斜的方向。如圖7所示，抽吸單元323可以位於噴氣單元322傾斜的方向（例如：-y方向）。噴氣單元322以向特定方向傾斜的狀態噴射空氣而向一定的方向引導水汽，抽吸單元323位於噴氣單元322傾斜的方向，從而能夠有效地抽吸向一定的方向引導的水汽。According to an embodiment of the present invention, the suction unit 323 may be located in a direction in which the air jet unit 322 is inclined. As shown in FIG. 7 , the suction unit 323 may be located in a direction in which the jet unit 322 is inclined (for example: -y direction). The air spray unit 322 sprays air in a state tilted in a specific direction to guide water vapor in a certain direction, and the suction unit 323 is located in a direction in which the air spray unit 322 is tilted, so that the water vapor guided in a certain direction can be effectively sucked.

根據本發明的實施例，抽吸單元323可以向相對於噴氣單元322傾斜的方向相反方向傾斜。如圖7所示，抽吸單元323可以朝向噴氣單元322傾斜的方向（例如：-y方向）的相反方向（例如：+y方向）傾斜。噴氣單元322以向特定方向傾斜的狀態噴射空氣而向一定的方向引導水汽，抽吸單元323以向與噴氣單元322相反方向傾斜的狀態抽吸水汽，從而能夠容易地抽吸更多的水汽。According to an embodiment of the present invention, the suction unit 323 may be inclined in a direction opposite to the direction in which the air jet unit 322 is inclined. As shown in FIG. 7 , the suction unit 323 may incline toward the opposite direction (for example: +y direction) to the direction in which the air jet unit 322 inclines (for example: -y direction). The air spray unit 322 injects air in a state tilted in a specific direction to guide water vapor in a certain direction, and the suction unit 323 sucks water vapor in a state inclined in a direction opposite to the air spray unit 322, so that more water vapor can be easily sucked.

圖8以及圖9示出根據本發明的實施例的安放封裝體的底座的一例。圖8示出沒有安放封裝體P的狀態的底座312，圖9示出安放有封裝體P的狀態的底座312。8 and 9 show an example of a base for mounting a package according to an embodiment of the present invention. FIG. 8 shows the base 312 in the state where the package P is not placed, and FIG. 9 shows the base 312 in the state where the package P is placed.

如圖8以及圖9所示，底座312包括安放封裝體P的安放部312A和比安放部312A凸出的凸出部312B。如圖5所示，在底座312中排列有能夠安放封裝體的呈槽形態形成的安放部312A。另外，在底座312中除安放部312A以外的其餘區域形成比安放部312A向上方凸出的凸出部312B。As shown in FIGS. 8 and 9 , the base 312 includes a placement portion 312A for placing the package P and a protruding portion 312B protruding from the placement portion 312A. As shown in FIG. 5 , a seating portion 312A formed in the form of a groove capable of housing a package is arranged in the base 312 . In addition, a protruding portion 312B protruding upward from the seating portion 312A is formed in the remaining area of the base 312 except the seating portion 312A.

根據本發明的實施例，安放部312A可以具有與封裝體P相同的大小以及形狀。如圖8以及圖9所示，以具有與封裝體P相同的大小以及形狀的方式形成安放部312A，在其餘區域形成凸出部312B。封裝體P嵌入於呈槽形態構成的安放部312A，在此，在封裝體P和凸出部312B之間沒有臺階或非常窄，因此清洗液不能滲入。安放部312A可以形成爲與封裝體P相同或稍微大，其可以根據實施例，考慮公差和清洗液能夠滲入的尺寸來進行設計。According to an embodiment of the present invention, the placement portion 312A may have the same size and shape as the package P. Referring to FIG. As shown in FIGS. 8 and 9 , the mounting portion 312A is formed to have the same size and shape as the package P, and the protrusion 312B is formed in the remaining area. The package P is inserted into the receiving portion 312A formed in the form of a groove, and there is no step or is very narrow between the package P and the protruding portion 312B, so that cleaning liquid cannot penetrate. The seating portion 312A may be formed to be the same as or slightly larger than the package body P, and it may be designed in consideration of tolerances and dimensions into which cleaning fluid can penetrate according to embodiments.

根據本發明的實施例，凸出部312B可以從安放部312A凸出與封裝體P的厚度相同的高度。將凸出部312B的凸出高度構成爲與封裝體P相同，從而能夠防止在封裝體P和凸出部312B之間産生臺階，最終防止水汽堆積於臺階而清洗液殘留於封裝體P。According to an embodiment of the present invention, the protruding part 312B may protrude from the seating part 312A by the same height as the thickness of the package body P. Referring to FIG. The protruding height of the protruding portion 312B is configured to be the same as that of the package P, thereby preventing a step between the package P and the protruding portion 312B, and finally preventing water vapor from accumulating on the step and cleaning liquid remaining in the package P.

圖10示出根據本發明的實施例的封裝體乾燥裝置的另一例。圖10示出適用了如圖8以及圖9那樣構成的底座312的乾燥單元320的結構。參照圖10，在底座312中，封裝體P安放於在具有與封裝體P的高度相同的凸出高度的凸出部312B之間以槽的形態形成的安放部312A。如圖10那樣，在與封裝體P對應形態的槽安放封裝體P，從而不發生封裝體P和底座312之間的臺階引起水汽堆積的現象，能夠使得清洗液不殘留於封裝體P和底座312。FIG. 10 shows another example of a package drying device according to an embodiment of the present invention. FIG. 10 shows a structure of a drying unit 320 to which a base 312 configured as shown in FIGS. 8 and 9 is applied. Referring to FIG. 10 , in the base 312 , the package P is seated in a seating portion 312A formed in the form of a groove between protrusions 312B having the same protrusion height as the package P. Referring to FIG. As shown in Figure 10, the package P is placed in the groove corresponding to the form of the package P, so that the step between the package P and the base 312 does not cause water vapor to accumulate, and the cleaning liquid does not remain on the package P and the base. 312.

圖11以及圖12示出根據本發明的實施例的安放封裝體的底座的另一例。11 and 12 illustrate another example of a base for mounting a package according to an embodiment of the present invention.

另一方面，底座312可以提供爲各種形狀。如圖8以及圖9所示，安放部312A可以構成爲陣列形態，如圖11所示，安放部312A可以構成爲使封裝體P向行方向和列方向彼此不相鄰。On the other hand, the base 312 may be provided in various shapes. As shown in FIG. 8 and FIG. 9 , the mounting portions 312A can be configured in an array form, and as shown in FIG. 11 , the mounting portions 312A can be configured so that the packages P are not adjacent to each other in the row direction and the column direction.

根據本發明的實施例，底座312可以根據封裝體P的類型變更。即，當處理與之前製程不同類型的封裝體P時，可以使用其它類型的底座312。另外，底座312可以區分爲2個模型，一個是針對各種類型的封裝體P共同使用，另一個是按照封裝體P的類型進行變更。According to an embodiment of the present invention, the base 312 can be changed according to the type of the package P. Referring to FIG. That is, when processing a different type of package P than the previous process, other types of submounts 312 may be used. In addition, the base 312 can be divided into two models, one is commonly used for various types of packages P, and the other is changed according to the type of the package P.

例如，如圖12所示，底座312可以包括針對多種類型的封裝體P共同使用的底座板3122和可裝卸地結合於底座板3122的吸附板3121。與封裝體P直接接觸的吸附板3121包括安放部312A和凸出部312B，安放部312A和凸出部312B的形態可以按照封裝體P的種類不同。例如，安放部312A的大小、尺寸或者凸出部312B的凸出高度可以按照封裝體P的種類不同。For example, as shown in FIG. 12 , the base 312 may include a base plate 3122 commonly used for various types of packages P and an adsorption plate 3121 detachably combined with the base plate 3122 . The suction plate 3121 directly in contact with the package P includes a seating portion 312A and a protruding portion 312B, and the shapes of the seating portion 312A and the protruding portion 312B can be different according to the type of the package P. For example, the size and dimension of the seating part 312A or the protrusion height of the protrusion part 312B may be different according to the type of the package P. FIG.

上述的用於去除封裝體P的水汽的乾燥裝置可以構成爲封裝體搬運裝置和半導體條帶切割及分類設備10的一部分。根據本發明的實施例的在半導體條帶切割及分類設備10中搬運單個化的封裝體的封裝體搬運裝置包括：翻轉台310，包括安放封裝體P的底座312和用於旋轉底座312的旋轉軸313；乾燥單元320，乾燥安放於底座312的封裝體P；以及隨行夾具台341、346，從翻轉台310容納封裝體P。乾燥單元320包括：防護單元321，在翻轉台310的移動路徑上設置成圍繞底座312；噴氣單元322，設置於防護單元321並朝向安放於底座312的封裝體P噴射空氣；以及抽吸單元323，設置於防護單元321並抽吸從封裝體P飛散的水汽。The above-mentioned drying device for dehumidifying the packages P may be constituted as a part of the package handling device and the semiconductor strip cutting and sorting device 10 . The package handling device for handling individualized packages in the semiconductor strip cutting and sorting equipment 10 according to an embodiment of the present invention includes: an inverting table 310 including a base 312 for placing the package P and a rotation mechanism for rotating the base 312 The shaft 313 ; the drying unit 320 for drying the package P placed on the base 312 ; Drying unit 320 comprises: protection unit 321, is arranged on the movement path of turning table 310 to surround base 312; Air jet unit 322, is arranged on protection unit 321 and sprays air toward the package body P that is placed on base 312; And suction unit 323 , is arranged in the protection unit 321 and sucks the water vapor scattered from the package P.

根據本發明的實施例的半導體條帶切割及分類設備10包括：裝載單元100，裝載配置有複數個封裝體的半導體條帶S；切割單元200，切割半導體條帶S並傳送單個化的半導體封裝體P；以及分類單元300，對半導體封裝體P進行乾燥及檢查並收納於托盤351、356。分類單元300包括：翻轉台310，包括安放封裝體P的底座312和用於旋轉底座312的旋轉軸313；乾燥單元320，乾燥安放於底座312的封裝體P；以及隨行夾具台341、346，從翻轉台310容納封裝體P。乾燥單元320包括：防護單元321，在翻轉台310的移動路徑上設置成圍繞底座312；噴氣單元322，設置於防護單元321並朝向安放於底座312的封裝體P噴射空氣；以及抽吸單元323，設置於防護單元321並抽吸從封裝體P飛散的水汽。The semiconductor strip cutting and sorting equipment 10 according to an embodiment of the present invention includes: a loading unit 100, loading a semiconductor strip S configured with a plurality of packages; a cutting unit 200, cutting the semiconductor strip S and delivering individualized semiconductor packages body P; and a sorting unit 300 for drying and inspecting the semiconductor package P and storing it in trays 351 and 356 . The sorting unit 300 includes: an overturning table 310 including a base 312 for placing the package P and a rotating shaft 313 for rotating the base 312; a drying unit 320 for drying the package P placed on the base 312; and pallets 341, 346 , the package P is accommodated from the inversion stage 310 . Drying unit 320 comprises: protection unit 321, is arranged on the movement path of turning table 310 to surround base 312; Air jet unit 322, is arranged on protection unit 321 and sprays air toward the package body P that is placed on base 312; And suction unit 323 , is arranged in the protection unit 321 and sucks the water vapor scattered from the package P.

本實施例以及本說明書中所附的圖式只不過明確表示包括在本發明中的技術構思的一部分，顯而易見由所屬技術領域中具有通常知識者能夠在包括在本發明的說明書以及圖式中的技術構思的範圍內容易導出的變形例和具體實施例均包括在本發明的權利範圍中。This embodiment and the accompanying drawings in this specification only clearly represent a part of the technical concept included in the present invention. Modifications and specific embodiments that can be easily derived within the scope of the technical concept are included in the scope of rights of the present invention.

因此，本發明的構思不應局限於所說明的實施例，不僅是所附的申請專利範圍，與其申請專利範圍等同或等價變形的所有構思屬於本發明構思的範疇。Therefore, the concept of the present invention should not be limited to the illustrated embodiments, not only the appended patent scope, but all the concepts that are equivalent or equivalently deformed to the scope of the patent application belong to the scope of the concept of the present invention.

10:設備 250:切刀 100:裝載單元 200:切割單元 205:臨時保管單元 210:條帶拾取器 220:封裝體拾取器 230:導架 240:卡盤 250:切刀 260:清洗單元 300:分類單元 310:翻轉台 311:外圍架 312:底座 313:旋轉軸 312A:安放部 312B:凸出部 313:旋轉軸 314:傳送導件 320:乾燥單元 321:防護單元 322:噴氣單元 323:抽吸單元 324:第一連接部件 325:第二連接部件 330B:球檢查單元 330M:標記檢查單元 340:第一隨行夾具驅動部件 341:第一隨行夾具台 345:第二隨行夾具驅動部件 346:第二隨行夾具台 350:第一搬出托盤驅動部件 351:第一搬出托盤 352:第二搬出托盤 355:第二搬出托盤驅動部件 356:第二搬出托盤 360:檢查部 370:分揀拾取器 380:分揀拾取器驅動部件 800:分類部 3121:吸附板 3122:底座板 B:球面 P:半導體封裝體 P1:安放位置 P2:檢查位置 M:標記面 S:半導體條帶 10: Equipment 250: cutter 100: loading unit 200: cutting unit 205:Temporary storage unit 210: Strip picker 220: Package picker 230: guide frame 240: Chuck 250: cutter 260: cleaning unit 300: Taxa 310: Flip table 311: peripheral frame 312: base 313:Rotary axis 312A: Placement Department 312B: Protrusion 313:Rotary axis 314: Transmission guide 320: drying unit 321: Protection unit 322: jet unit 323: suction unit 324: the first connecting part 325: the second connecting part 330B: Ball inspection unit 330M: Mark inspection unit 340: First pallet drive part 341: The first traveling fixture table 345: Second pallet driving part 346: Second accompanying fixture table 350: The first unloading tray drive unit 351: The first pallet is moved out 352: The second unloading pallet 355: The second unloading tray driving part 356: The second pallet is moved out 360: Inspection Department 370: Sorting picker 380:Sorting picker drive components 800: Classification Department 3121: adsorption plate 3122: base plate B: Spherical P: semiconductor package P1: Placement P2: Check position M: marked surface S: Semiconductor strip

圖1示出根據本發明的實施例的半導體條帶切割及分類設備的概要結構。FIG. 1 shows a schematic structure of a semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention.

圖2以及圖3示出吸附有封裝體的狀態的翻轉台。FIG. 2 and FIG. 3 show the reversing table in a state in which packages are sucked.

圖4示出通過噴射空氣去除封裝體的水汽的過程。FIG. 4 shows the process of removing moisture from the package by spraying air.

圖5至圖7示出根據本發明的實施例的封裝體乾燥裝置的一例。5 to 7 show an example of a package drying device according to an embodiment of the present invention.

圖8以及圖9示出根據本發明的實施例的安放封裝體的底座的一例。8 and 9 show an example of a base for mounting a package according to an embodiment of the present invention.

圖10示出根據本發明的實施例的封裝體乾燥裝置的另一例。FIG. 10 shows another example of a package drying device according to an embodiment of the present invention.

圖11以及圖12示出根據本發明的實施例的安放封裝體的底座的另一例。11 and 12 illustrate another example of a base for mounting a package according to an embodiment of the present invention.

無none

310:翻轉台 310: Flip table

314:傳送導件 314: Transmission guide

321:防護單元 321: Protection unit

322:噴氣單元 322: jet unit

323:抽吸單元 323: suction unit

325:第二連接部件 325: the second connecting part

330B:球檢查單元 330B: Ball inspection unit

P1:安放位置 P1: Placement

P2:檢查位置 P2: Check position

Claims (20)

一種封裝體乾燥裝置，用於在半導體條帶切割及分類設備中乾燥單個化的封裝體，其中，所述封裝體乾燥裝置包括： 底座，安放所述封裝體並沿著傳送導件移動； 防護單元，在所述底座的移動路徑上設置成圍繞所述底座； 噴氣單元，設置於所述防護單元並朝向安放於所述底座的所述封裝體噴射空氣；以及 抽吸單元，設置於所述防護單元並抽吸從所述封裝體飛散的水汽。 A package drying device for drying individualized packages in semiconductor strip cutting and sorting equipment, wherein the package drying device comprises: a base for placing the package and moving along the conveying guide; a protection unit arranged to surround the base on a moving path of the base; an air spray unit, which is arranged on the protection unit and sprays air toward the package placed on the base; and The suction unit is arranged on the protection unit and sucks the water vapor scattered from the package. 如請求項1所述之封裝體乾燥裝置，其中， 所述防護單元位於從在所述底座安放所述封裝體的安放位置到對所述封裝體執行檢查的檢查位置之間。 The package drying device according to claim 1, wherein, The protection unit is located between a placement position where the package is placed on the base and an inspection position where inspection is performed on the package. 如請求項1所述之封裝體乾燥裝置，其中， 所述噴氣單元向傾斜的方向噴射空氣。 The package drying device according to claim 1, wherein, The air injection unit injects air in an oblique direction. 如請求項3所述之封裝體乾燥裝置，其中， 所述抽吸單元位於所述噴氣單元傾斜的方向。 The package drying device according to claim 3, wherein, The suction unit is located in a direction in which the jet unit is inclined. 如請求項4所述之封裝體乾燥裝置，其中， 所述抽吸單元向相對於所述噴氣單元傾斜的方向相反方向傾斜。 The package drying device according to claim 4, wherein, The suction unit is inclined in a direction opposite to the direction in which the air injection unit is inclined. 如請求項1所述之封裝體乾燥裝置，其中， 所述底座包括： 安放部，安放所述封裝體；以及 凸出部，比所述安放部凸出。 The package drying device according to claim 1, wherein, The base includes: an accommodating part for accommodating the package; and The protruding part is protruding from the accommodating part. 如請求項6所述之封裝體乾燥裝置，其中， 所述安放部具有與所述封裝體相同的大小以及形狀。 The package drying device according to Claim 6, wherein, The placement portion has the same size and shape as the packaging body. 如請求項6所述之封裝體乾燥裝置，其中， 所述凸出部從所述安放部凸出與所述封裝體的厚度相同的高度。 The package drying device according to Claim 6, wherein, The protruding portion protrudes from the seating portion to a height equal to the thickness of the package. 一種封裝體搬運裝置，在半導體條帶切割及分類設備中搬運單個化的封裝體，其中，所述封裝體搬運裝置包括： 翻轉台，包括安放所述封裝體的底座和用於旋轉所述底座的旋轉軸； 乾燥單元，乾燥安放於所述底座的所述封裝體；以及 隨行夾具台，從所述翻轉台容納所述封裝體， 所述乾燥單元包括： 防護單元，在所述翻轉台的移動路徑上設置成圍繞所述底座； 噴氣單元，設置於所述防護單元並朝向安放於所述底座的所述封裝體噴射空氣；以及 抽吸單元，設置於所述防護單元並抽吸從所述封裝體飛散的水汽。 A package handling device for handling individualized packages in semiconductor strip cutting and sorting equipment, wherein the package handling device includes: an overturning table, including a base for placing the package and a rotating shaft for rotating the base; a drying unit for drying the package placed on the base; and a pallet table to receive the package from the flip table, The drying unit includes: a protection unit arranged to surround the base on the moving path of the turning platform; an air spray unit, which is arranged on the protection unit and sprays air toward the package placed on the base; and The suction unit is arranged on the protection unit and sucks the water vapor scattered from the package. 如請求項9所述之封裝體搬運裝置，其中， 所述防護單元位於從在所述底座安放所述封裝體的安放位置到對所述封裝體執行檢查的檢查位置之間。 The package handling device according to claim 9, wherein, The protection unit is located between a placement position where the package is placed on the base and an inspection position where inspection is performed on the package. 如請求項9所述之封裝體搬運裝置，其中， 所述噴氣單元向傾斜的方向噴射空氣。 The package handling device according to claim 9, wherein, The air injection unit injects air in an oblique direction. 如請求項11所述之封裝體搬運裝置，其中， 所述抽吸單元位於所述噴氣單元傾斜的方向。 The package handling device according to claim 11, wherein, The suction unit is located in a direction in which the jet unit is inclined. 如請求項12所述之封裝體搬運裝置，其中， 所述抽吸單元向相對於所述噴氣單元傾斜的方向相反方向傾斜。 The package handling device according to claim 12, wherein, The suction unit is inclined in a direction opposite to the direction in which the air injection unit is inclined. 如請求項9所述之封裝體搬運裝置，其中， 所述底座包括： 安放部，安放所述封裝體；以及 凸出部，比所述安放部凸出。 The package handling device according to claim 9, wherein, The base includes: an accommodating part for accommodating the package; and The protruding part is protruding from the accommodating part. 如請求項14所述之封裝體搬運裝置，其中， 所述安放部具有與所述封裝體相同的大小以及形狀。 The package handling device according to claim 14, wherein, The placement portion has the same size and shape as the packaging body. 如請求項15所述之封裝體搬運裝置，其中， 所述凸出部從所述安放部凸出與所述封裝體的厚度相同的高度。 The package handling device according to claim 15, wherein, The protruding portion protrudes from the seating portion to a height equal to the thickness of the package. 一種半導體條帶切割及分類設備，包括： 裝載單元，裝載配置有複數個封裝體的半導體條帶； 切割單元，切割所述半導體條帶並傳送單個化的半導體封裝體；以及 分類單元，對所述半導體封裝體進行乾燥及檢查並收納於托盤， 所述分類單元包括： 翻轉台，包括安放所述封裝體並沿著傳送導件移動的底座以及用於旋轉所述底座的旋轉軸； 乾燥單元，乾燥安放於所述底座的所述封裝體；以及 隨行夾具台，從所述翻轉台容納所述封裝體， 所述底座包括： 安放部，安放所述封裝體；以及 凸出部，形成於所述底座中除所述安放部以外的其餘區域，並比所述安放部凸出所述封裝體的高度， 所述乾燥單元包括： 防護單元，在所述底座的移動路徑上設置成圍繞所述底座； 噴氣單元，設置於所述防護單元並朝向安放於所述底座的所述安放部的所述封裝體噴射空氣；以及 抽吸單元，設置於所述防護單元並抽吸從所述封裝體飛散的水汽。 A semiconductor strip cutting and sorting equipment, comprising: a loading unit for loading semiconductor strips configured with a plurality of packages; a dicing unit that cuts the semiconductor strip and delivers the singulated semiconductor packages; and a sorting unit for drying and inspecting the semiconductor packages and storing them in trays, The taxa include: an inversion table comprising a base on which the package is placed and moved along the conveying guide, and a rotating shaft for rotating the base; a drying unit for drying the package placed on the base; and a pallet table to receive the package from the flip table, The base includes: an accommodating part for accommodating the package; and a protruding portion formed in the remaining area of the base except the placement portion, and protruding from the placement portion by a height of the package, The drying unit includes: a protection unit arranged to surround the base on a moving path of the base; an air jet unit disposed on the protection unit and jetting air toward the package placed on the placement portion of the base; and The suction unit is arranged on the protection unit and sucks the water vapor scattered from the package. 如請求項17所述之半導體條帶切割及分類設備，其中， 所述防護單元位於從在所述底座安放所述封裝體的安放位置到對所述封裝體執行檢查的檢查位置之間。 The semiconductor strip cutting and sorting equipment as claimed in claim 17, wherein, The protection unit is located between a placement position where the package is placed on the base and an inspection position where inspection is performed on the package. 如請求項17所述之半導體條帶切割及分類設備，其中， 所述噴氣單元向傾斜的方向噴射空氣， 所述抽吸單元位於所述噴氣單元傾斜的方向。 The semiconductor strip cutting and sorting equipment as claimed in claim 17, wherein, The air injection unit injects air in an oblique direction, The suction unit is located in a direction in which the jet unit is inclined. 如請求項19所述之半導體條帶切割及分類設備，其中， 所述抽吸單元向相對於所述噴氣單元傾斜的方向相反方向傾斜。 The semiconductor strip cutting and sorting equipment as described in claim 19, wherein, The suction unit is inclined in a direction opposite to the direction in which the air injection unit is inclined.
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