TWI841876B - Semiconductor strip cutting and sorting equipment, package drying equipment and handling equipment - Google Patents

Abstract

The embodiments of the present invention provide a semiconductor strip cutting and sorting device, a package drying device and a transport device. The package drying device for drying singulated packages in the semiconductor strip cutting and sorting device according to the embodiments of the present invention comprises: a base for placing the packages; a gantry for being movable above or below the base; a spray unit for spraying air toward the packages placed on the base; and a suction unit for being adjacent to the spray unit in the gantry for sucking liquid scattered from the packages.

Description

Semiconductor strip cutting and sorting equipment, package drying equipment and handling equipment

The present invention relates to a package drying device in a semiconductor strip cutting and sorting equipment, and more particularly to a device for rapidly and effectively drying singulated packages.

Semiconductor manufacturing processes are processes used to manufacture semiconductor devices on wafers, including exposure, evaporation, etching, ion implantation, cleaning, etc. Semiconductor strip cutting and sorting equipment cuts a strip with multiple packages into individual packages, cleans, dries, and inspects each package, and then classifies it into normal or defective states and loads it into the final storage container, i.e., tray.

Inspection of each package is performed using visual inspection devices such as cameras. In order to conduct precise inspection, foreign objects that may hinder the inspection need to be removed from each package. The cleaning liquid used to clean the cut package may also become an obstacle during the inspection process, so it is necessary to manage so that no residual cleaning liquid remains on the package.

Therefore, embodiments of the present invention provide a package drying device capable of quickly and effectively removing cleaning liquid remaining in singulated semiconductor packages and a semiconductor strip cutting and sorting apparatus having the package drying device.

The problems to be solved by the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other problems to be solved that are not mentioned from the following description.

According to an embodiment of the present invention, a package drying device for drying singulated packages in a semiconductor strip cutting and sorting device includes: a base on which the package is placed; a gantry which is movably arranged above or below the base; a spray unit which is arranged on the gantry and sprays air toward the package placed on the base; and a suction unit which is arranged adjacent to the spray unit in the gantry and sucks liquid scattered from the package.

According to an embodiment of the present invention, the base may include: a placement portion for placing the package body; and a protruding portion that protrudes more than the placement portion.

According to an embodiment of the present invention, the placement portion may have the same size and shape as the packaging body.

According to an embodiment of the present invention, the protrusion may protrude from the mounting portion to a height that is the same as the thickness of the packaging body.

According to an embodiment of the present invention, the air jet unit may jet air in an inclined direction.

According to an embodiment of the present invention, the suction unit may be located in a direction in which the spray unit is tilted.

According to an embodiment of the present invention, the suction unit may be inclined in a direction opposite to the direction in which the spray unit is inclined.

According to an embodiment of the present invention, a package transporting device for transporting singulated packages in a semiconductor strip cutting and sorting device includes: a turning table including a base for placing the package and a rotating shaft for rotating the base; a drying unit for drying the package placed on the base; and a portable fixture table for accommodating the package from the turning table. The drying unit includes: a gantry, which is arranged to be movable above or below the base; a spray unit, which is arranged on the gantry and sprays air toward the package placed on the base; and a suction unit, which is arranged adjacent to the spray unit in the gantry and sucks liquid scattered from the package.

According to an embodiment of the present invention, the semiconductor strip cutting and sorting equipment includes: a loading unit for loading a semiconductor strip configured with a plurality of packages; a cutting unit for cutting the semiconductor strip and transferring singulated semiconductor packages; and a sorting unit for drying and inspecting the semiconductor packages and storing them in a tray. The sorting unit includes: a turning table including a base for placing the packages and a rotating shaft for rotating the base; a drying unit for drying the packages placed on the base; and a portable fixture table for accommodating the packages from the turning table. The base includes: a placement portion for placing the packages; and a protruding portion formed in the remaining area of the base except for the placement portion and protruding beyond the placement portion. The drying unit includes: a gantry frame, which is movably arranged above or below the base; a spray unit, which is arranged on the gantry frame and sprays air toward a package placed on the base; and a suction unit, which is arranged adjacent to the spray unit in the gantry frame and sucks liquid scattered from the package.

According to an embodiment of the present invention, the suction unit is configured as a spray unit that sprays air toward the package body and a device that sucks water vapor scattered from the package body, thereby removing water vapor from the package body and preventing the water vapor from scattering to the surroundings.

The effects of the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other effects not mentioned from the following description.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person with ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in various different ways, not limited to the embodiments described herein.

In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar constituent elements are marked with the same figure marks throughout the entire specification.

In addition, among a plurality of embodiments, components having the same structure are denoted by the same reference numerals only in a representative embodiment, and only structures different from the representative embodiment are described in the remaining embodiments.

Throughout the specification, when it is stated that a part is "connected (or coupled)" to other parts, it includes not only the case of "direct connection (or coupling)" but also the case of "indirect connection (or coupling)" with other parts placed in between. In addition, when it is stated that a part "includes" a certain constituent element, unless otherwise stated, it means that other constituent elements may also be included rather than excluded.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person having ordinary knowledge in the technical field to which the present invention belongs. Terms such as terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meanings in the relevant technical context, and will not be ideally or excessively interpreted as formal meanings unless they are clearly defined in this application.

FIG1 shows a schematic structure of a semiconductor strip cutting and sorting apparatus 10 according to an embodiment of the present invention. Referring to FIG1 , the semiconductor package cutting and sorting apparatus 10 according to an embodiment of the present invention includes a loading unit 100, a cutting unit 200, and a sorting unit 300.

The semiconductor strip cutting and sorting device 10 according to an embodiment of the present invention includes a loading unit 100 for loading a semiconductor strip S configured with multiple packages, a cutting unit 200 for cutting the semiconductor strip S and transferring singulated packages P, and a sorting unit 300 for drying and inspecting the packages P and storing them in a tray.

The loading unit 100 delivers the semiconductor strip S delivered from the outside to the temporary storage unit 205 of the cutting unit 200. Although not shown in detail in FIG. 1 , the loading unit 100 may include a magazine for loading the semiconductor strip S and a pusher for pushing and delivering the semiconductor strip S. The semiconductor strip S supplied to the loading unit 100 may be located in the temporary storage unit 205.

The strip picker 210 holds the semiconductor strip S located in the temporary storage unit 205 and transfers it to the chuck 240. The package picker 220 holds the package P cut by the cutter 250 and transferred by the chuck 240 by vacuum adsorption and transfers it to the cleaning unit 260 and the turning table 310. The guide frame 230 provides a path for the strip picker 210 and the package picker 220 to move in the X-axis direction. The guide frame 230 can be combined with a driving unit for moving the strip picker 210 and the package picker 220.

The chuck 240 can transfer the semiconductor strip S and the package P between the strip picker 210 and the cutter 250 and between the cutter 250 and the package picker 220, respectively. The chuck 240 can move in the Y-axis direction, can rotate around the Z-axis direction, and can place the semiconductor strip S. The chuck 240 absorbs the semiconductor strip S transferred by the strip picker 210 and transfers it to the cutter 250. In addition, the chuck 240 transfers a plurality of packages P cut by the cutter 250 to the package picker 220. That is, the chuck 240 can reciprocate between the cutter 250 and the first guide frame 230. The package picker 220 may suck the semiconductor package P cleaned in the cleaning unit 260 and transfer it to the inverting stage 310, and the semiconductor package P transferred to the inverting stage 310 may be dried by the drying unit 320. The inverting stage 310 may move along the guide frame 230.

The classification unit 300 classifies the semiconductor packages P according to the inspection results of each semiconductor package P. The classification unit 300 can be referred to as a transport device for transporting the individualized packages P. More specifically, the classification unit 300 independently picks up the semiconductor packages P loaded on the first accompanying fixture table 341 and the second accompanying fixture table 346 after the inspection by the ball inspection unit 330B, the mark inspection unit 330M, and the alignment inspection unit 360, and classifies them in sequence according to the inspection results and transports them to other locations. The first accompanying fixture table 341 and the second accompanying fixture table 346 can be moved by the first accompanying fixture driving component 340 and the second accompanying fixture driving component 345, respectively.

The sorting unit 300 for this purpose may include a sorting picker 370, a sorting picker driving part 380, a first carry-out tray 351, a second carry-out tray 356, a first carry-out tray driving part 350 and a second carry-out tray driving part 355.

The sorting picker 370 picks up the semiconductor packages P that have been inspected by the ball inspection unit 330B, the mark inspection unit 330M, and the alignment inspection unit 360 and are loaded on the first accompanying fixture table 341 and the second accompanying fixture table 346, respectively, and transfers them to the first and second carrying-out trays 351 and 356 to be described later.

The sorting picker driving component 380 may be formed in a rail shape and arranged along the X-axis direction, and a portion thereof may be arranged adjacent to the alignment inspection unit 360. The sorting picker driving component 380 moves the sorting picker 370 in the X-axis direction. For this purpose, the sorting picker driving component 380 may have a driving tool for moving the sorting picker 370 built therein.

The first unloading tray 351 and the second unloading tray 356 can be loaded with qualified semiconductor packages P and unqualified semiconductor packages P respectively and unloaded to other locations. Different from this, the first unloading tray 351 and the second unloading tray 356 can also evaluate the grade of the semiconductor packages P according to the manufacturing status and load them respectively according to the grade. For example, the first unloading tray 351 can be loaded with semiconductor packages P of grade A, and the second unloading tray 356 can be loaded with semiconductor packages P of grade B whose manufacturing status is lower than grade A.

If the sorting picker 370 picks up the semiconductor packages P from the first accompanying fixture stage 341 and the second accompanying fixture stage 346 and loads all of them on the first unloading tray 351 or the second unloading tray 356, the first unloading tray 351 or the second unloading tray 356 moves in the Y-axis direction to transfer the semiconductor packages P to other locations.

The first unloading tray driving member 350 moves the first unloading tray 351. The first unloading tray driving member 350 may have a built-in driving tool for moving the first unloading tray 351.

The second unloading tray driving member 355 moves the second unloading tray 356. The second unloading tray driving member 355 may have a driving tool for moving the second unloading tray 356 built therein.

The semiconductor strip cutting and sorting device 10 can cut, clean, dry and inspect the semiconductor strip S, sort it and discharge it to other places as described above. On the other hand, the package picker 220 according to the embodiment of the present invention is not limited to being included in the semiconductor strip cutting and sorting device 10, and can be applied to a general semiconductor package manufacturing system. Hereinafter, a device and method for using a cleaning liquid in the cleaning unit 260 and quickly and effectively drying the package P in the drying unit 320 will be described.

Generally, the semiconductor strip S and the package P are composed of a spherical surface B forming a ball (Ball) for electrical connection and a marking surface M engraved with a mark of each package P. On the other hand, the state in which the spherical surface B of the package P faces upward and the marking surface M faces downward is referred to as a dead bug, and the state in which the marking surface M of the package P faces upward and the spherical surface B faces downward is referred to as a live bug. The cutting and cleaning processes in the cutting unit 200 are performed in the dead bug state with the spherical surface B facing upward, and each package P is transferred to the turning table 310 through the package picker 220 in the dead bug state.

Referring to FIG. 2 (a) and FIG. 3 (a), the turning table 310 includes: a peripheral frame 311 capable of moving in a horizontal direction; a base 312 for adsorbing and fixing the package P; and a rotation axis 313 for rotating the base 312 relative to the peripheral frame 311. The base 312 can rotate around the rotation axis 313 while sucking the marking surface M of the package P so that the spherical surface B of the package P faces upward as shown in FIG. 2 (a), and can also face the spherical surface B of the package P downward as shown in FIG. 3 (b).

FIG4 shows the process of removing water vapor from a package by spraying air. Referring to FIG4 , cleaning liquid remains around the package P placed on the base 312, and the spray unit 322 sprays air toward the package P from above to remove the water vapor. However, as indicated by the dotted line in FIG4 , water vapor accumulates due to the step between the base 312 and the package P. For such accumulated water vapor, it is not easy to remove the water vapor even by spraying air, and if air is sprayed toward the step, noise is generated and may have a negative impact on the working environment.

At the same time, if air is sprayed on the package body P, part of the water vapor evaporates and the other part of the water vapor may be scattered to other devices around. As shown in FIG1, a visual inspection device such as a ball inspection unit 330B can be set around the drying unit 320. If the water vapor is scattered to the visual inspection device, it may have a bad influence on the subsequent inspection function.

Therefore, the embodiment of the present invention provides a drying device capable of quickly and effectively removing the water vapor of the package body P. According to the embodiment of the present invention, the suction unit 323 is formed together with the spray unit 322 to suck the scattered water vapor, thereby preventing the water vapor from scattering to the peripheral device. In addition, according to the embodiment of the present invention, the base 312 is formed with a placement portion 312A for placing the package body P and a protrusion 312B protruding from the placement portion 312A to remove the step between the package body P and the base 312, thereby preventing the water vapor from accumulating on the step.

The package drying device for drying singulated packages P in the semiconductor strip cutting and sorting equipment 10 according to an embodiment of the present invention includes: a base 312 for placing the package P; a gantry 321 movably arranged above the base 312; a spray unit 322 arranged on the gantry for spraying air toward the package placed on the base; and a suction unit 323 arranged adjacent to the spray unit 322 in the gantry 321 for sucking liquid scattered from the package P.

5 to 7 show a base 312 for mounting a package according to an embodiment of the present invention. FIG5 shows the base 312 without a package P mounted thereon, FIG6 shows the base 312 with a package P mounted thereon, and FIG7 shows the base 312 in yet another form.

As shown in Fig. 5 and Fig. 6, the base 312 includes a placement portion 312A for placing the package P and a protrusion 312B protruding from the placement portion 312A. As shown in Fig. 5, the placement portion 312A formed in a groove shape capable of placing the package is arranged in the base 312. In addition, the protrusion 312B protruding upward from the placement portion 312A is formed in the remaining area of the base 312 except the placement portion 312A.

According to an embodiment of the present invention, the placement portion 312A may have the same size and shape as the package body P. As shown in FIG. 5 and FIG. 6, the placement portion 312A is formed in a manner having the same size and shape as the package body P, and the protrusion 312B is formed in the remaining area. The package body P is embedded in the placement portion 312A formed in a groove shape, and there is no step or it is very narrow between the package body P and the protrusion 312B, so that the cleaning liquid cannot penetrate. The placement portion 312A can be formed to be the same as the package body P or slightly larger, and it can be designed according to the embodiment in consideration of tolerance and the size that the cleaning liquid can penetrate.

According to an embodiment of the present invention, the protrusion 312B may protrude from the mounting portion 312A to the same height as the thickness of the package P. By configuring the protrusion 312B to have the same protrusion height as the package P, it is possible to prevent a step from being generated between the package P and the protrusion 312B, and ultimately prevent water vapor from accumulating on the step and the cleaning liquid from remaining in the package P.

On the other hand, the base 312 may be provided in various shapes. As shown in FIG5 and FIG6, the placement parts 312A may be configured in an array form, and as shown in FIG7, the placement parts 312A may be configured so that the packages P are not adjacent to each other in the row direction and the column direction.

According to an embodiment of the present invention, the base 312 can be changed according to the type of package P. That is, when processing a package P of a different type from the previous process, another type of base 312 can be used. In addition, the base 312 can be divided into two models, one is used for various types of packages P, and the other is changed according to the type of package P.

For example, as shown in FIG8 , the base 312 may include a base plate 3122 commonly used for various types of packages P and an adsorption plate 3121 detachably coupled to the base plate 3122. The adsorption plate 3121 directly in contact with the package P includes a placement portion 312A and a protrusion 312B, and the shapes of the placement portion 312A and the protrusion 312B may be different according to the type of package P. For example, the size and dimension of the placement portion 312A or the protrusion height of the protrusion 312B may be different according to the type of package P.

Figures 9 and 10 show the structure of a drying unit for drying a package according to an embodiment of the present invention. Figure 9 shows a situation where the drying unit 320 is located above the base 312, and Figure 10 shows a situation where the drying unit 320 is located below the base 312.

9 and 10 , a package P is placed in a placement portion 312A between protrusions 312B of a base 312. A drying device for removing moisture from the package P includes: a gantry 321 movably disposed above or below the base 312; a spray unit 322 disposed on the gantry and spraying air toward the package placed on the base; and a suction unit 323 disposed adjacent to the spray unit 322 in the gantry 321 and sucking liquid scattered from the package P.

As shown in FIG9 and FIG10, the moving body 324 is configured to move in a horizontal direction (e.g., x direction) along with the gantry 321, the spray unit 322 is coupled to the moving body 324 via a first connecting member 325, and the suction unit 323 is coupled to the moving body 324 via a second connecting member 326. That is, the spray unit 322 and the suction unit 323 can move in a horizontal direction (e.g., x direction) together with the moving body 324 moving along with the gantry 321.

According to an embodiment of the present invention, the air jet unit 322 can spray air in an inclined direction. As shown in FIG9 and FIG10, the air jet unit 322 can spray air in a state of being inclined at a certain angle in a vertical direction (e.g., z direction) toward the package body P. Unlike the situation where water vapor splashes everywhere when simply spraying in a vertical direction, the air jet unit 322 sprays air in an inclined state toward the package body P, thereby being able to guide the water vapor in a certain direction and more conveniently manage it.

According to an embodiment of the present invention, the suction unit 323 may be located in the direction in which the spray unit 322 is tilted. Referring to FIG. 9 and FIG. 10 , the spray unit 322 is tilted in the +x direction to spray air, and the suction unit 323 is located in the +x direction from the spray unit 322. As shown in FIG. 9 and FIG. 10 , the suction unit 323 is arranged in the direction in which the spray unit 322 is tilted, so that the guided water vapor can be removed more easily through the suction unit 323.

According to an embodiment of the present invention, the suction unit 323 may be tilted in a direction opposite to the tilted direction of the spray unit 322. As shown in FIG9 and FIG10, the spray unit 322 is tilted in a direction opposite to the tilted direction (+x direction) of the suction unit 323 (e.g., -x direction) to suck water vapor. In this way, the tilted direction of the suction unit 323 is configured to be opposite to the tilted direction of the spray unit 322, so that the water vapor guided by the spray unit 322 can be more easily sucked by the suction unit 323.

The above-mentioned drying device for removing moisture from the package P can constitute a part of the package transporting device and the semiconductor strip cutting and sorting device 10. The package transporting device for transporting individualized packages in the semiconductor strip cutting and sorting device 10 according to the embodiment of the present invention includes: a turning table 310, including a base 312 for placing the package P and a rotating shaft 313 for rotating the base 312; a drying unit 320 for drying the package P placed on the base 312; and accompanying fixture tables 341, 346 for accommodating the package P from the turning table 310. The drying unit 320 includes: a gantry 321, which is arranged to be movable above or below the base 312; a spray unit 322, which is arranged on the gantry and sprays air toward the package placed on the base; and a suction unit 323, which is arranged adjacent to the spray unit 322 in the gantry 321 and sucks liquid scattered from the package P.

The semiconductor strip cutting and sorting device 10 according to the embodiment of the present invention includes: a loading unit 100 for loading a semiconductor strip S equipped with a plurality of packages; a cutting unit 200 for cutting the semiconductor strip S and transferring singulated semiconductor packages P; and a sorting unit 300 for drying and inspecting the semiconductor packages P and storing them in trays 351, 356. The sorting unit 300 includes: a turning table 310 including a base 312 for placing the package P and a rotating shaft 313 for rotating the base 312; a drying unit 320 for drying the package P placed on the base 312; and accompanying fixture tables 341, 346 for accommodating the package P from the turning table 310. The drying unit 320 includes: a gantry 321, which is arranged to be movable above or below the base 312; a spray unit 322, which is arranged on the gantry and sprays air toward the package placed on the base; and a suction unit 323, which is arranged adjacent to the spray unit 322 in the gantry 321 and sucks liquid scattered from the package P.

This embodiment and the drawings attached in this specification only clearly indicate a part of the technical concept included in the present invention. It is obvious that the variants and specific embodiments that can be easily derived by technical personnel in this field within the scope of the technical concept included in the specification and drawings of the present invention are all included in the patent application scope of the present invention.

Therefore, the concept of the present invention should not be limited to the described embodiments, but should be within the scope of the attached patent application. All concepts that are equivalent to or equivalently modified to the scope of the patent application belong to the scope of the concept of the present invention.

100: Loading unit 200: Cutting unit 205: Temporary storage unit 210: Strip picker 220: Package picker 230: Guide frame 240: Chuck 250: Cutter 260: Cleaning unit 300: Sorting unit 310: Turntable 311: Peripheral frame 312: Base 312A: Placement part 312B: Projection part 313: Rotating shaft 320: Drying unit 321: Gantry 322: Air injection unit 323: Suction unit 324: Moving body 325: First connecting part 326: Second connecting part 330B: Ball inspection unit 330M: Mark inspection unit 340: First accompanying fixture drive component 341: First accompanying fixture platform 345: Second accompanying fixture drive component 346: Second accompanying fixture platform 350: First removal tray drive component 351: First removal tray 352: Second removal tray 355: Removal tray drive component 356: Second removal tray 360: Inspection unit 370: Sorting picker 380: Sorting picker drive component 800: Sorting unit 3121: Adsorption plate 3122: Base plate P: Semiconductor package S: Semiconductor strip

FIG. 1 shows a schematic structure of a semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention.

FIG. 2 and FIG. 3 show the turning table in a state where the package is sucked.

FIG. 4 shows the process of removing moisture from a package by spraying air.

5 to 8 show a base on which a package is placed according to an embodiment of the present invention.

FIG. 9 shows the structure of a drying unit for drying a package according to an embodiment of the present invention.

FIG. 10 shows the structure of a drying unit for drying a package according to another embodiment of the present invention.

(without)

312A: Placement Department

312B: protrusion

321: Gantry

322: Jet unit

323: Suction unit

324: Mobile body

325: First connecting component

326: Second connecting component

P:Semiconductor package

Claims (11)

A package transport device is used to transport individualized packages in a semiconductor strip cutting and sorting device, wherein the package transport device comprises: a turning table, comprising a base for placing the package and a rotating shaft for rotating the base; a drying unit for drying the package placed on the base; and a portable fixture table for accommodating the package from the turning table, wherein the drying unit comprises: a gantry, which is arranged above or below the base to be movable; a spray unit, which is arranged on the gantry and sprays air toward the package placed on the base, wherein the spray unit sprays air toward the package in a state of being tilted at a certain angle; and a suction unit, which is arranged adjacent to the spray unit in the gantry and sucks liquid scattered from the package. According to the package transport device described in claim 1, the base includes: a placement portion for placing the package; and a protruding portion that protrudes more than the placement portion. According to the package transporting device described in claim 2, the placement portion has the same size and shape as the package. According to the package transporting device described in claim 2, the protrusion protrudes from the mounting portion to a height equal to the thickness of the package. According to the package transport device described in claim 1, the suction unit is located in the tilted direction of the air injection unit. According to the package transport device described in claim 5, the suction unit is inclined in the opposite direction to the direction in which the spray unit is inclined. A semiconductor strip cutting and sorting device, comprising: a loading unit for loading a semiconductor strip equipped with a plurality of packages; a cutting unit for cutting the semiconductor strip and transferring the individualized semiconductor packages; and a sorting unit for drying and inspecting the semiconductor packages and storing them in a tray, wherein the sorting unit comprises: a turning table comprising a base for placing the packages and a rotating shaft for rotating the base; a drying unit for drying the packages placed on the base; and a portable fixture table for accommodating the packages from the turning table, wherein the base comprises a rotating shaft for rotating the base; and a portable fixture table for accommodating the packages from the turning table. The drying unit comprises: a placement part for placing the package body; and a protrusion formed in the remaining area of the base except the placement part and protruding more than the placement part, and the drying unit comprises: a gantry frame, which is arranged above or below the base to be movable; a spray unit, which is arranged on the gantry frame and sprays air toward the package body placed on the base, wherein the spray unit sprays air toward the package body in a state of tilting a certain angle; and a suction unit, which is arranged adjacent to the spray unit in the gantry frame and sucks the liquid scattered from the package body. According to the semiconductor strip cutting and sorting equipment described in claim 7, the placement portion has the same size and shape as the package body. The semiconductor strip cutting and sorting device according to claim 7, wherein the protrusion protrudes from the mounting portion to the same height as the thickness of the package body. According to the semiconductor strip cutting and sorting equipment described in claim 7, the suction unit is located in the inclined direction of the air injection unit. According to the semiconductor strip cutting and sorting equipment described in claim 10, the suction unit is inclined in the opposite direction to the direction in which the air injection unit is inclined.

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