CN114551283A - Semiconductor strip cutting and classifying equipment, packaging body drying device and carrying device - Google Patents

Semiconductor strip cutting and classifying equipment, packaging body drying device and carrying device Download PDF

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Publication number
CN114551283A
CN114551283A CN202111356046.3A CN202111356046A CN114551283A CN 114551283 A CN114551283 A CN 114551283A CN 202111356046 A CN202111356046 A CN 202111356046A CN 114551283 A CN114551283 A CN 114551283A
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China
Prior art keywords
package
unit
base
drying
semiconductor
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Pending
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CN202111356046.3A
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Chinese (zh)
Inventor
李龙焕
李龙玹
李昊俊
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Semes Co Ltd
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Semes Co Ltd
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Publication of CN114551283A publication Critical patent/CN114551283A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

The embodiment of the invention provides a semiconductor strip cutting and sorting device, a packaging body drying device and a conveying device. A package drying device for drying singulated packages in a semiconductor tape cutting and sorting apparatus according to an embodiment of the present invention includes: a base for receiving the package and moving along a transfer guide; a shielding unit disposed to surround the base on a moving path of the base; an air injection unit disposed at the protection unit and injecting air toward the package seated at the base; and a suction unit which is disposed in the protection unit and sucks the moisture scattered from the package body.

Description

Semiconductor strip cutting and classifying equipment, packaging body drying device and carrying device
Technical Field
The present invention relates to a package drying device in a semiconductor tape cutting and sorting apparatus, and more particularly, to a device for rapidly and efficiently drying singulated packages.
Background
Semiconductor manufacturing processes include, for example, exposure, evaporation, etching, ion implantation, cleaning, and the like as processes for manufacturing semiconductor elements on a wafer. The semiconductor tape cutting and sorting apparatus cuts and singulates a tape in which a plurality of packages are arranged in package units, and sorts and loads the tape into trays, which are final storage containers, in a normal or defective state by cleaning, drying, and inspecting each package.
Inspection of each package is performed by a visual inspection apparatus such as a camera, and for precise inspection, each package needs to remove foreign matter that may hinder the inspection. Since the cleaning liquid used for cleaning the cut packages may also be an obstacle in the inspection process, it is necessary to manage so that the cleaning liquid does not remain in the packages.
Disclosure of Invention
Accordingly, embodiments of the present invention provide a package drying device capable of effectively removing a cleaning solution remaining in singulated semiconductor packages while preventing moisture from being scattered to other devices, and a semiconductor tape cutting and sorting apparatus having the package drying device.
The problem to be solved by the present invention is not limited to the above-mentioned problem, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.
A package drying device for drying singulated packages in a semiconductor tape cutting and sorting apparatus according to an embodiment of the present invention includes: a base for receiving the package and moving along a transfer guide; a shielding unit disposed to surround the base on a moving path of the base; an air injection unit provided to the protection unit and injecting air toward the package seated on the base; and a suction unit which is disposed in the protection unit and sucks the moisture scattered from the package body.
According to an embodiment of the present invention, it may be that the shield unit is located between a mounting position where the package is mounted on the base and an inspection position where inspection of the package is performed.
According to an embodiment of the present invention, the air injection unit may inject the air in an inclined direction.
According to an embodiment of the present invention, it may be that the suction unit is located in a direction in which the air injection unit is inclined.
According to an embodiment of the present invention, the suction unit may be inclined in a direction opposite to the direction in which the air injection unit is inclined.
According to an embodiment of the present invention, it may be that the base includes: a mounting portion that mounts the package; and a protruding portion protruding from the seating portion.
According to an embodiment of the present invention, the seating portion may have the same size and shape as the package body.
According to an embodiment of the present invention, the protrusion may protrude from the seating portion by a height equal to a thickness of the package body.
A package conveyance device for conveying singulated packages in a semiconductor tape cutting and sorting apparatus according to an embodiment of the present invention includes: the overturning platform comprises a base for placing the packaging body and a rotating shaft for rotating the base; a drying unit drying the package mounted on the base; and a pallet table that accommodates the package from the flipping table. The drying unit includes: a shielding unit disposed to surround the base on a moving path of the turn-over table; an air injection unit provided to the protection unit and injecting air toward the package seated on the base; and a suction unit which is disposed in the protection unit and sucks the moisture scattered from the package body.
The semiconductor tape cutting and sorting apparatus according to an embodiment of the present invention includes: a loading unit for loading the semiconductor strip provided with a plurality of packages; a cutting unit cutting the semiconductor strip and transferring the singulated semiconductor packages; and a sorting unit for drying and inspecting the semiconductor package and storing the semiconductor package in a tray. The classification unit includes: a flipping table including a base on which the package is seated and moved along a transfer guide and a rotation shaft for rotating the base; a drying unit drying the package mounted on the base; and a pallet table for accommodating the package from the inverting table. The base includes: a mounting portion that mounts the package; and a protrusion part formed in the rest region of the base except the seating part and protruding the package body more than the seating part by a height, the drying unit including: a shielding unit disposed to surround the base on a moving path of the base; an air injection unit provided to the protection unit and injecting air toward the package seated on the seating portion of the base; and a suction unit which is disposed in the protection unit and sucks the moisture scattered from the package body.
According to the embodiment of the present invention, the shielding unit is disposed on the moving path of the base on which the package is mounted, and the air injection unit injecting air and the suction unit sucking moisture are configured in the shielding unit, so that the moisture of the package can be rapidly and effectively removed from the package while being prevented from being scattered.
The effects of the present invention are not limited to the above-mentioned ones, and other effects not mentioned can be clearly understood by those skilled in the art from the following descriptions.
Drawings
Fig. 1 shows a schematic structure of a semiconductor tape cutting and sorting apparatus according to an embodiment of the present invention.
Fig. 2 and 3 show the inverting table in a state where the package is sucked.
Fig. 4 shows a process of removing moisture of the package by injecting air.
Fig. 5 to 7 show an example of a package drying apparatus according to an embodiment of the present invention.
Fig. 8 and 9 show an example of a base for mounting a package according to an embodiment of the present invention.
Fig. 10 shows another example of the package drying apparatus according to the embodiment of the present invention.
Fig. 11 and 12 show another example of a base for mounting a package according to an embodiment of the present invention.
(description of reference numerals)
100: the loading unit 200: cutting unit
205: temporary storage unit 210: tape picker
220: package pickup 230: guide frame
240: the chuck 250: cutting knife
260: the cleaning unit 300: classification unit
310: the flipping table 311: peripheral frame
312: base 313: rotating shaft
320: the drying unit 321: protection unit
322: the gas injection unit 323: suction unit
324: first connecting member 325: second connecting part
330B: ball check unit 330M: mark inspection unit
340: first pallet driving part 341: first pallet table
345: second pallet driving part 346: second pallet table
350: first carry-out tray driving unit 351: first carrying out tray
352: second carry-out tray 355: carry-out tray driving part
356: second carry-out tray 360: inspection section
370: the sorting picker 380: sorting picker driving component
800: a classification part P: semiconductor package
S: semiconductor strip
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those having ordinary knowledge in the art to which the present invention pertains can easily carry out the embodiments. The invention may be implemented in various different ways and is not limited to the embodiments described herein.
In order to clearly explain the present invention, portions that are not related to the description are omitted, and the same or similar constituent elements are denoted by the same reference numerals throughout the specification.
In addition, in the embodiments, only the representative embodiment will be described using the same reference numerals for constituent elements having the same structure, and only the structure different from the representative embodiment will be described in the other embodiments.
When a part is "connected (or coupled)" to another part throughout the specification, it includes not only a case of "directly connecting (or coupling)" but also a case of "indirectly connecting (or coupling)" interposing another part. In addition, when a certain portion is "included" in a certain constituent element, unless otherwise stated, it means that other constituent elements may be included instead of excluding other constituent elements.
Unless otherwise defined, all terms used herein including technical and scientific terms have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Fig. 1 shows a schematic structure of a semiconductor tape cutting and sorting apparatus 10 according to an embodiment of the present invention. Referring to fig. 1, a semiconductor package cutting and sorting apparatus 10 according to an embodiment of the present invention includes a loading unit 100, a cutting unit 200, and a sorting unit 300.
The semiconductor tape cutting and sorting apparatus 10 according to an embodiment of the present invention includes a loading unit 100 that loads a semiconductor tape S configured with a plurality of packages, a cutting unit 200 that cuts the semiconductor tape S and conveys the singulated packages P, and a sorting unit 300 that dries and inspects the packages P and receives them in a tray.
The loading unit 100 transfers the semiconductor strip S transferred from the outside to the temporary storage unit 205 of the cutting unit 200. Although not shown in detail in fig. 1, the loading unit 100 may include a magazine for loading the semiconductor strips S and a pusher for pushing and transferring the semiconductor strips S. The semiconductor strips S supplied to the loading unit 100 may be located at the temporary storage unit 205.
The tape picker 210 holds the semiconductor tape S located in the temporary storage unit 205 and transfers the semiconductor tape S to the chuck 240. The package pickup 220 holds the package P cut by the cutter 250 and transferred by the chuck 240 by a vacuum suction method, and transfers the package P to the cleaning unit 260 and the inverting stage 310. The guide 230 provides a path for the tape picker 210 and the package picker 220 to move in the X-axis direction. The guide frame 230 may be coupled with a driving part for moving the tape picker 210 and the package picker 220.
The chuck 240 may transfer the semiconductor strip S and the packages P between the strip picker 210 and the cutter 250 and between the cutter 250 and the package picker 220, respectively. The chuck 240 may move in the Y-axis direction and may rotate centering on the Z-axis direction, and may mount the semiconductor strip S. The chuck 240 sucks the semiconductor strip S transferred by the strip picker 210 and transfers it toward the cutter 250. In addition, the chuck 240 transfers the plurality of packages P cut by the cutter 250 to the package picker 220. That is, the chuck 240 may reciprocate between the cutting knife 250 and the first guide 230. The package pickup 220 may adsorb the semiconductor packages P washed in the washing unit 260 and transfer the semiconductor packages P to the flipping table 310, and the semiconductor packages P transferred to the flipping table 310 may be dried by the drying unit 320. Here, the flipping table 310 may be configured to move along the conveying guide 314.
The sorting unit 300 sorts the semiconductor packages P according to the inspection result for each semiconductor package P. The sorting unit 300 may be referred to as a conveying device for conveying the singulated packages P. More specifically, the sorting unit 300 picks up the semiconductor packages P loaded on the first and second pallet stages 341 and 346 upon completion of the inspection by the ball inspection unit 330B, the mark inspection unit 330M, and the alignment inspection unit 360 independently, sorts them in order according to the inspection result, and transfers them to other places. First pallet table 341 and second pallet table 346 may be moved by first pallet driving part 340 and second pallet driving part 345, respectively.
The sorting unit 300 for this may include a sorting pickup 370, a sorting pickup driving part 380, a first carry-out tray 351, a second carry-out tray 356, a first carry-out tray driving part 350, and a second carry-out tray driving part 355.
The sorting picker 370 picks up the semiconductor packages P loaded on the first pallet 341 and the second pallet 346 by the ball inspection unit 330B, the mark inspection unit 330M, and the alignment inspection unit 360 and transfers the semiconductor packages P to a first carry-out tray 351 and a second carry-out tray 356, which will be described later.
The sorting pickup driving part 380 may be formed in a rail shape and disposed along the X-axis direction, a portion of which is disposed adjacent to the alignment checking unit 360. The sorting pickup driving part 380 moves the sorting pickup 370 in the X-axis direction. The sorting picker driving part 380 for this purpose may be built in with a driving tool for moving the sorting picker 370.
The first and second carry-out trays 351 and 356 can be loaded with the non-defective semiconductor packages P and the non-defective semiconductor packages P, respectively, and carried out to other places. In contrast, first carry-out tray 351 and second carry-out tray 356 may be loaded with semiconductor packages P rated according to the manufacturing state. For example, the first carry-out tray 351 may be loaded with a level a semiconductor packages P, and the second carry-out tray 356 may be loaded with a level B semiconductor packages P whose manufacturing state is lower than the level a.
When the sorting picker 370 picks up the semiconductor packages P from the first pallet 341 and the second pallet 346 and loads them on the first carry-out tray 351 or the second carry-out tray 356, the first carry-out tray 351 or the second carry-out tray 356 moves in the Y-axis direction and transfers the semiconductor packages P to another place.
The first discharge tray driving unit 350 moves the first discharge tray 351. The first carry-out tray driving member 350 may incorporate a driving tool for moving the first carry-out tray 351.
The second discharge tray driving unit 355 moves the second discharge tray 356. The second carry-out tray driving member 355 may have a driving tool built therein for moving the second carry-out tray 356.
The semiconductor strip cutting and sorting apparatus 10 may sort and discharge the semiconductor strips S to other places after cutting, washing, drying and inspection as described above. On the other hand, the package pickup 220 according to the embodiment of the present invention is not limited to be included in the semiconductor tape cutting and sorting apparatus 10, and may be applied to a general semiconductor package manufacturing system. Hereinafter, an apparatus and a method for rapidly and efficiently drying the package P in the drying unit 320 using the cleaning liquid in the cleaning unit 260 will be described.
Generally, the semiconductor strip S and the package P are configured by a spherical surface B on which a Ball (Ball) for electrical connection is formed and a mark surface M on which a mark of each package P is marked. On the other hand, a state in which the spherical surface B of the package P faces upward and the mark surface M faces downward is referred to as Dead Bug (Dead Bug), and a state in which the mark surface M of the package P faces upward and the spherical surface B faces downward is referred to as Live Bug (Live Bug). The cutting and cleaning processes in the cutting unit 200 are performed in a dead-worm state in which the spherical surface B faces upward, and the respective packages P are transferred to the flipping table 310 through the package pickup 220 in the dead-worm state.
Referring to fig. 2 (a) and 3 (a), the flipping table 310 includes: a peripheral frame 311 movable in the horizontal direction; a base 312 for sucking and fixing the package P; and a rotating shaft 313 for rotating the base 312 with respect to the peripheral frame 311. The base 312 may rotate around the rotation axis 313 with the mark surface M of the package P sucked, and may turn the spherical surface B of the package P upward as shown in fig. 2 (a) or may turn the spherical surface B of the package P downward as shown in fig. 3 (B).
Fig. 4 shows a process of removing moisture of the package by injecting air. Referring to fig. 4, the cleaning solution remains around the package P mounted on the base 312, and the air blowing unit 322 blows air upward toward the package P to remove moisture. However, as indicated by a dotted line in fig. 4, moisture accumulation due to a step between the base 312 and the package P occurs. The moisture accumulated in this way is not easily removed even by injecting air, and if air is injected to the step, noise is generated and the working environment may be adversely affected.
Meanwhile, if air is injected into the package P, a part of the moisture evaporates, and another part of the moisture may be scattered to other peripheral devices. As shown in fig. 1, a visual inspection device such as a ball inspection unit 330B may be provided around the drying unit 320, and if moisture is scattered in the visual inspection device, the subsequent inspection function may be adversely affected.
Accordingly, the embodiment of the present invention provides a drying apparatus capable of rapidly and effectively removing moisture of the package P. According to the embodiment of the present invention, the shielding unit 321 which is located in the moving path of the base 312 and blocks the scattered moisture so as not to scatter the moisture from the package is configured, and the air injection unit 322 which injects air toward the package P and the suction unit 323 which sucks the moisture from the package P are configured inside the shielding unit 321, so that the moisture of the package P can be removed while the moisture is not scattered to the periphery.
The package drying device for drying the singulated packages P in the semiconductor tape cutting and sorting apparatus 10 according to an embodiment of the present invention includes: a base 312 for receiving the package P and moving along the transfer guide 314; a shield unit 321 disposed to surround the base 312 on a moving path of the base 312; an air injection unit 322 provided at the protection unit 321 and injecting air toward the package P mounted on the base 312; and a suction unit 323 provided to the shield unit 321 and suctioning the moisture scattered from the package P.
Fig. 5 to 7 show an example of a package drying apparatus according to an embodiment of the present invention. Fig. 5 shows the package drying apparatus as viewed from above, fig. 6 shows the package drying apparatus as viewed from the y-direction, and fig. 7 shows the package drying apparatus as viewed from the x-direction.
Referring to fig. 5 to 7, the shielding unit 321 is located at a portion of a moving path of the flipping table 310. The shield unit 321 has a tunnel-like shape, and blocks moisture adsorbed to the package P of the base 312 from being scattered to the periphery. In addition, the shielding unit 321 may be implemented as a structure that has a tunnel form and can be provided with other devices. An air injection unit 322 and a suction unit 323 for removing moisture may be provided in the shielding unit 321.
According to an embodiment of the present invention, the shielding unit 321 may be located from a seating position P1 where the package P is seated at the seating 312 to an inspection position P2 where inspection of the package P is performed. The package P is cleaned in the cleaning unit 260, then is sucked to the base 312 of the flipping table 310 at the mounting position P1, and then is transferred to the inspection position P2 by the flipping table 310 in a dead-worm state with the sphere facing upward and inspected. The shielding unit 321 is located between the seating position P1 and the inspection position P2, so that moisture that may hinder the inspection of the package P can be removed.
The air injection unit 322 injects air to the package P to remove moisture from the package P. The cleaning liquid attached to the package P is separated from the package P by the pressure of the air injected by the air injection unit 322. The air blowing unit 322 may be disposed on the ceiling of the protection unit 321 to blow air downward toward the package P.
The suction unit 323 applies vacuum pressure to suck surrounding fluid. The suction unit 323 may suction the moisture separated from the package body P by the air pressure of the air injection unit 322. The suction unit 323 may be provided at the periphery of the air injection unit 322 at the ceiling of the shielding unit 321.
According to an embodiment of the present invention, the air injection unit 322 may inject air in an inclined direction. As shown in fig. 7, the air injection unit 322 may inject air in a state of being inclined at a certain angle with respect to a vertical direction (e.g., z direction). For example, the gas injection unit 322 may be inclined toward the opposite direction with respect to the moving direction (e.g., y-direction) of the flipping table 310. The air injection unit 322 injects air toward the package P in an inclined state, so that moisture can be guided in a certain direction, and the position where moisture is collected can be more easily managed.
According to an embodiment of the present invention, the suction unit 323 may be located in a direction in which the gas injection unit 322 is inclined. As shown in fig. 7, the suction unit 323 may be located in a direction (e.g., -y direction) in which the gas spraying unit 322 is inclined. The air injection unit 322 injects air in a state of being inclined in a specific direction to guide the moisture in a certain direction, and the suction unit 323 is located in the direction in which the air injection unit 322 is inclined, so that the moisture guided in a certain direction can be effectively sucked.
According to an embodiment of the present invention, the suction unit 323 may be inclined in an opposite direction to the direction in which the air injection unit 322 is inclined. As shown in fig. 7, the suction unit 323 may be inclined toward the opposite direction (e.g., + y direction) of the direction in which the gas spraying unit 322 is inclined (e.g., -y direction). The air blowing unit 322 blows air in a state of being inclined in a specific direction to guide moisture in a certain direction, and the suction unit 323 sucks moisture in a state of being inclined in a direction opposite to the air blowing unit 322, so that more moisture can be easily sucked.
Fig. 8 and 9 show an example of a base for mounting a package according to an embodiment of the present invention. Fig. 8 shows the mount 312 in a state where the package P is not mounted, and fig. 9 shows the mount 312 in a state where the package P is mounted.
As shown in fig. 8 and 9, the base 312 includes a mounting portion 312A on which the package P is mounted and a protruding portion 312B protruding from the mounting portion 312A. As shown in fig. 5, a mounting portion 312A formed in a groove shape and capable of mounting a package is arranged in the base 312. In addition, a protruding portion 312B protruding upward from the mounting portion 312A is formed in the base 312 in a region other than the mounting portion 312A.
According to an embodiment of the present invention, the seating portion 312A may have the same size and shape as the package body P. As shown in fig. 8 and 9, the mounting portion 312A is formed to have the same size and shape as the package P, and the projection 312B is formed in the remaining region. The package P is fitted into the seating portion 312A configured in a groove shape, where there is no step or is very narrow between the package P and the projection 312B, and thus the cleaning liquid cannot penetrate. The seating portion 312A may be formed to be the same as or slightly larger than the package body P, and may be designed in consideration of a tolerance and a size into which the cleaning liquid can penetrate according to an embodiment.
According to an embodiment of the present invention, the protrusion 312B may protrude from the seating portion 312A by the same height as the thickness of the package body P. The protruding height of the protruding portion 312B is set to be the same as that of the package P, so that a step can be prevented from being generated between the package P and the protruding portion 312B, and finally, the cleaning liquid can be prevented from remaining on the package P due to accumulation of moisture on the step.
Fig. 10 shows another example of the package drying apparatus according to the embodiment of the present invention. Fig. 10 shows a configuration of a drying unit 320 to which the base 312 configured as shown in fig. 8 and 9 is applied. Referring to fig. 10, in the base 312, a package P is seated on seating parts 312A formed in a groove shape between protruding parts 312B having the same protruding height as the height of the package P. As shown in fig. 10, by placing the package P in the groove corresponding to the package P, the step between the package P and the base 312 does not cause the accumulation of moisture, and the cleaning liquid can be prevented from remaining on the package P and the base 312.
Fig. 11 and 12 show another example of a base for mounting a package according to an embodiment of the present invention.
On the other hand, the base 312 may be provided in various shapes. As shown in fig. 8 and 9, the mounting portions 312A may be configured in an array form, and as shown in fig. 11, the mounting portions 312A may be configured such that the packages P are not adjacent to each other in the row direction and the column direction.
According to an embodiment of the present invention, the base 312 may be changed according to the type of the package P. That is, when a different type of package P from the previous process is processed, other types of pedestals 312 may be used. The base 312 may be divided into 2 models, one of which is used in common for each type of package P, and the other of which is changed according to the type of package P.
For example, as shown in fig. 12, the base 312 may include a base plate 3122 commonly used for various types of packages P and a suction plate 3121 detachably coupled to the base plate 3122. The suction plate 3121 directly contacting the package P includes a seating portion 312A and a protruding portion 312B, and the form of the seating portion 312A and the protruding portion 312B may be different according to the type of the package P. For example, the size and dimension of the seating portion 312A or the protruding height of the protruding portion 312B may be different according to the kind of the package body P.
The drying device for removing moisture of the packages P described above may be constructed as a part of the package handling device and the semiconductor tape cutting and sorting apparatus 10. A package conveyance device for conveying singulated packages in the semiconductor tape cutting and sorting apparatus 10 according to an embodiment of the present invention includes: a flipping table 310 including a base 312 for mounting the package P and a rotation shaft 313 for rotating the base 312; a drying unit 320 drying the package P mounted on the base 312; and pallet tables 341 and 346 for accommodating the package P from the inverting table 310. The drying unit 320 includes: a shielding unit 321 disposed to surround the base 312 on a moving path of the flipping table 310; an air injection unit 322 provided at the protection unit 321 and injecting air toward the package P mounted on the base 312; and a suction unit 323 provided to the shield unit 321 and suctioning the moisture scattered from the package P.
The semiconductor tape cutting and sorting apparatus 10 according to an embodiment of the present invention includes: a loading unit 100 for loading a semiconductor strip S on which a plurality of packages are arranged; a cutting unit 200 cutting the semiconductor strip S and transferring the singulated semiconductor packages P; and a sorting unit 300 for drying and inspecting the semiconductor packages P and storing the semiconductor packages P in trays 351 and 356. The classification unit 300 includes: a flipping table 310 including a base 312 for mounting the package P and a rotation shaft 313 for rotating the base 312; a drying unit 320 drying the package P mounted on the base 312; and pallet tables 341 and 346 for accommodating the package P from the inverting table 310. The drying unit 320 includes: a shielding unit 321 disposed to surround the base 312 on a moving path of the flipping table 310; an air injection unit 322 provided at the protection unit 321 and injecting air toward the package P mounted on the base 312; and a suction unit 323 provided to the shield unit 321 and suctioning the moisture scattered from the package P.
The present embodiment and the drawings attached to the present specification are merely part of the technical idea included in the present invention, and it is apparent that modifications and specific embodiments which can be easily derived by those skilled in the art within the scope of the technical idea included in the specification and the drawings are included in the scope of the right of the present invention.
Therefore, the inventive concept should not be limited to the described embodiments, but rather should be construed in breadth and scope in accordance with the appended claims, and any and all equivalents thereof.

Claims (20)

1. A package drying device for drying a singulated package in a semiconductor tape cutting and sorting apparatus, wherein the package drying device comprises:
a base for receiving the package and moving along a transfer guide;
a shielding unit disposed to surround the base on a moving path of the base;
an air injection unit provided to the protection unit and injecting air toward the package seated on the base; and
and the pumping unit is arranged on the protection unit and pumps the water vapor scattered from the packaging body.
2. The package drying apparatus according to claim 1,
the protection unit is located from a placement position where the package is placed on the base to an inspection position where inspection of the package is performed.
3. The package drying apparatus according to claim 1,
the air injection unit injects air in an inclined direction.
4. The package drying apparatus according to claim 3,
the suction unit is located in a direction in which the air injection unit is inclined.
5. The package drying apparatus according to claim 4,
the suction unit is inclined in a direction opposite to the direction in which the air injection unit is inclined.
6. The package drying apparatus according to claim 1,
the base includes:
a mounting portion that mounts the package; and
a protruding portion protruding from the seating portion.
7. The package drying apparatus according to claim 6,
the mounting portion has the same size and shape as the package body.
8. The package drying apparatus according to claim 6,
the protrusion protrudes from the seating portion by the same height as the thickness of the package body.
9. A package conveyance device that conveys singulated packages in a semiconductor tape cutting and sorting apparatus, wherein the package conveyance device comprises:
the overturning platform comprises a base for placing the packaging body and a rotating shaft for rotating the base;
a drying unit drying the package mounted on the base; and
a pallet table for accommodating the package from the inverting table,
the drying unit includes:
a shielding unit disposed to surround the base on a moving path of the turn-over table;
an air injection unit disposed at the protection unit and injecting air toward the package seated at the base; and
and the pumping unit is arranged on the protection unit and pumps the water vapor scattered from the packaging body.
10. The package handling apparatus of claim 9,
the protection unit is located from a placement position where the package is placed on the base to an inspection position where inspection of the package is performed.
11. The package handling apparatus of claim 9,
the air injection unit injects air in an inclined direction.
12. The package handling apparatus of claim 11,
the suction unit is located in a direction in which the air injection unit is inclined.
13. The package handling apparatus of claim 12,
the suction unit is inclined in a direction opposite to the direction in which the air injection unit is inclined.
14. The package handling apparatus of claim 9,
the base includes:
a mounting portion that mounts the package; and
a protruding portion protruding from the seating portion.
15. The package handling apparatus of claim 14,
the mounting portion has the same size and shape as the package body.
16. The package handling apparatus of claim 15,
the protrusion protrudes from the seating portion by the same height as the thickness of the package body.
17. A semiconductor strip dicing and sorting apparatus comprising:
a loading unit for loading the semiconductor strip provided with a plurality of packages;
a cutting unit cutting the semiconductor strip and transferring the singulated semiconductor packages; and
a sorting unit for drying and inspecting the semiconductor packages and storing the semiconductor packages in a tray,
the classification unit includes:
a flipping table including a base on which the package is seated and moved along a transfer guide and a rotation shaft for rotating the base;
a drying unit drying the package mounted on the base; and
a pallet table for accommodating the package from the inverting table,
the base includes:
a mounting portion that mounts the package; and
a protrusion part formed in the rest region of the base except the placement part and protruding from the package body by a height greater than that of the placement part,
the drying unit includes:
a shielding unit disposed to surround the base on a moving path of the base;
an air injection unit provided to the protection unit and injecting air toward the package seated on the seating portion of the base; and
and the pumping unit is arranged on the protection unit and pumps the water vapor scattered from the packaging body.
18. The semiconductor tape cutting and sorting apparatus of claim 17,
the protection unit is located from a placement position where the package is placed on the base to an inspection position where inspection of the package is performed.
19. The semiconductor tape cutting and sorting apparatus of claim 17,
the air injection unit injects air in an inclined direction,
the suction unit is located in a direction in which the air injection unit is inclined.
20. The semiconductor tape cutting and sorting apparatus of claim 19, wherein,
the suction unit is inclined in a direction opposite to the direction in which the air injection unit is inclined.
CN202111356046.3A 2020-11-25 2021-11-16 Semiconductor strip cutting and classifying equipment, packaging body drying device and carrying device Pending CN114551283A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2020-0160024 2020-11-25
KR1020200160024A KR20220072935A (en) 2020-11-25 2020-11-25 Apparatus for drying package in semiconductor strip sawing and sorting equipment

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KR (1) KR20220072935A (en)
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JP2004207424A (en) * 2002-12-25 2004-07-22 Towa Corp Cutting-off method and equipment of substrate
CN100470758C (en) * 2004-05-07 2009-03-18 韩美半导体株式会社 sawing and handler system for manufacturing semiconductor package
KR20070092541A (en) * 2006-03-10 2007-09-13 한미반도체 주식회사 Air knife system for semiconductor production
JP5156459B2 (en) * 2008-04-09 2013-03-06 Ｔｏｗａ株式会社 Substrate cutting method and apparatus
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JP2022083993A (en) 2022-06-06

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