CN114551282A - Semiconductor strip cutting and sorting equipment, conveying device and method - Google Patents

Semiconductor strip cutting and sorting equipment, conveying device and method Download PDF

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Publication number
CN114551282A
CN114551282A CN202111353570.5A CN202111353570A CN114551282A CN 114551282 A CN114551282 A CN 114551282A CN 202111353570 A CN202111353570 A CN 202111353570A CN 114551282 A CN114551282 A CN 114551282A
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CN
China
Prior art keywords
flow path
semiconductor
vacuum pressure
valve
suction duct
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Pending
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CN202111353570.5A
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Chinese (zh)
Inventor
李在京
李龙玹
李龙焕
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Semes Co Ltd
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Semes Co Ltd
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Publication of CN114551282A publication Critical patent/CN114551282A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/02—Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Abstract

Embodiments of the present invention provide a semiconductor strip cutting and sorting apparatus, a conveying device and a method. The apparatus for transferring semiconductor packages in a semiconductor tape cutting and sorting apparatus includes: an adsorption plate formed with a vacuum hole for adsorbing the semiconductor package; a main body portion in which a first flow path that is coupled to the adsorption plate and communicates with the vacuum hole is formed; a suction duct connected to the first flow path for air flow for applying vacuum pressure; a vacuum pressure forming part for applying vacuum pressure through the suction duct and the first flow path; a first valve disposed between the vacuum pressure forming unit and the suction duct to open or close the suction duct; a second flow path connected to the first flow path to form a path through which external gas can flow; and a second valve coupled to the second flow path to open or close the second flow path.

Description

Semiconductor strip cutting and sorting equipment, conveying device and method
Technical Field
The present invention relates to an apparatus and method for transferring semiconductor packages in a semiconductor tape cutting and sorting apparatus, and more particularly, to an apparatus and method for transferring semiconductor packages washed with a washing liquid.
Background
Semiconductor manufacturing processes include, for example, exposure, evaporation, etching, ion implantation, cleaning, and the like as processes for manufacturing semiconductor elements on a wafer. The semiconductor tape cutting and sorting apparatus cuts and singulates a tape in which a plurality of packages are arranged in package units, and sorts and loads the tape into trays, which are final storage containers, in a normal or defective state by cleaning, drying, and inspecting each package.
Inspection of each package is performed by a visual inspection apparatus such as a camera, and for precise inspection, each package needs to remove foreign matter that may hinder the inspection. Since the cleaning liquid used for cleaning the cut packages may also be an obstacle in the inspection process, it is necessary to manage so that the cleaning liquid does not remain in the packages.
Disclosure of Invention
Accordingly, embodiments of the present invention provide an apparatus and method for transferring semiconductor packages while preventing a cleaning solution from remaining in a semiconductor tape cutting and sorting apparatus.
The problem to be solved by the present invention is not limited to the above-mentioned problem, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.
The apparatus for transferring semiconductor packages in a semiconductor tape cutting and sorting apparatus includes: an adsorption plate formed with a vacuum hole for adsorbing the semiconductor package; a main body portion in which a first flow path that is coupled to the adsorption plate and communicates with the vacuum hole is formed; a suction duct connected to the first flow path for air flow for applying vacuum pressure; a vacuum pressure forming part for applying vacuum pressure through the suction duct and the first flow path; a first valve disposed between the vacuum pressure forming part and the suction duct to open or close the suction duct; a second flow path connected to the first flow path to form a path through which external gas can flow; and a second valve coupled to the second flow path to open or close the second flow path.
In this embodiment, the apparatus may further include: a filter unit disposed in a part of the suction duct to filter the liquid flowing through the suction duct; and a drain container for storing the liquid filtered by the filter unit.
In this embodiment, the second flow path may be formed in the main body portion.
In this embodiment, the second valve may be opened for a certain period of time if the main body portion is located at the target delivery position.
In this embodiment, the second valve may be closed when the predetermined time elapses, the first valve may be closed to release the vacuum pressure when the second valve is closed, and the semiconductor package may be mounted to the target transfer position when the vacuum pressure is released.
In this embodiment, the second flow path may be formed as a side surface portion connecting the first flow path and the main body portion.
In this embodiment, the second flow path may be formed to connect the first flow path and an upper surface portion of the main body portion.
In this embodiment, the second flow path may be formed in the adsorption plate.
A method for transferring semiconductor packages in a semiconductor tape cutting and sorting apparatus according to an embodiment of the present invention includes: picking up the semiconductor package by applying vacuum pressure through a first flow path of a body portion connected to a suction hole for sucking the semiconductor package in a package pickup; a step of positioning the package pickup, which has sucked the semiconductor package, at a target transfer position; a step of opening a second flow path that is connected to the first flow path and forms a path through which external gas can flow, and sucking moisture present in the first flow path; and cutting off the second flow path and releasing the vacuum pressure to place the semiconductor package at the target transfer position.
In this embodiment, the second flow path may be formed in the main body portion.
In this embodiment, the opening or closing of the second flow path may be performed by a second valve coupled to the second flow path.
In this embodiment, the step of pumping moisture present in the first flow path may include the step of opening the second valve for a certain period of time.
In this embodiment, the second flow path may be formed as a side surface portion connecting the first flow path and the main body portion.
In this embodiment, the second flow path may be formed to connect the first flow path and an upper surface portion of the main body portion.
In this embodiment, the second flow path may be formed on the adsorption plate in which the adsorption hole for adsorbing the semiconductor package is formed.
The semiconductor tape cutting and sorting apparatus according to an embodiment of the present invention includes: a loading unit for loading a semiconductor tape on which a plurality of packages are arranged; a cutting section including a package picker that cuts the semiconductor strip and conveys the singulated semiconductor packages; and a sorting unit for drying and inspecting the semiconductor packages and storing the semiconductor packages in a tray. The package pickup may include: an adsorption plate formed with a vacuum hole for adsorbing the semiconductor package; a main body portion in which a first flow path that is coupled to the adsorption plate and communicates with the vacuum hole is formed; a suction duct connected to the first flow path for air flow for applying vacuum pressure; a vacuum pressure forming part for applying vacuum pressure through the suction duct and the first flow path; a first valve disposed between the vacuum pressure forming part and the suction duct to open or close the suction duct; a second flow path that is formed inside the main body and that forms a path through which external air can flow between a side surface of the main body and the first flow path; and a second valve coupled to the second flow path to open or close the second flow path.
In one embodiment, the semiconductor strip dicing and sorting apparatus may further include: a filter unit disposed in a part of the first flow path and configured to filter the liquid flowing through the first flow path; and a drain container for storing the liquid filtered by the filter unit.
In one embodiment, the second valve may be opened during a certain time period if the body portion is located at a flipping station.
In one embodiment, the second valve may be closed if the certain time elapses, the first valve may be closed to release the vacuum pressure if the second valve is closed, and the semiconductor package may be mounted to the flipping table if the vacuum pressure is released.
In one embodiment, the second flow path may be formed as a side surface portion connecting the first flow path and the main body portion.
According to the embodiment of the present invention, the second flow path through which the external gas can flow is constituted so as to suck the moisture remaining in the first flow path to which the vacuum pressure for adsorbing the semiconductor package is applied, and therefore, the moisture can be prevented from being discharged to the semiconductor package.
The effects of the present invention are not limited to the above-mentioned ones, and other effects not mentioned can be clearly understood by those skilled in the art from the following descriptions.
Drawings
Fig. 1 shows a schematic structure of a semiconductor tape cutting and sorting apparatus according to an embodiment of the present invention.
Fig. 2 illustrates a case where moisture is discharged during the transfer of the semiconductor package.
Fig. 3 illustrates an example of an apparatus for transferring a semiconductor package according to an embodiment of the present invention.
Fig. 4 illustrates a process of removing moisture remaining in the first flow path during the transfer of the semiconductor package according to an embodiment of the present invention.
Fig. 5 illustrates an example of guiding gas in an apparatus for transferring a semiconductor package according to an embodiment of the present invention.
Fig. 6 is a flowchart of a method for transferring a semiconductor package according to an embodiment of the present invention.
(description of reference numerals)
100: the loading section 200: cutting part
205: the temporary storage 210: tape picker
220: picking up the data 230: first guide frame
240: the chuck 250: cutting part
260: cleaning section 300: classification unit
310: the flipping station 315: second guide frame
320: the drying section 330: inspection section
341: first pallet table 346: second pallet table
350: first discharge tray driving unit 351: first carrying out tray
352: second carry-out tray 355: carry-out tray driving part
356: second carry-out tray 360: inspection section
370: the sorting picker 380: sorting picker driving component
800: a classification unit C: semiconductor package
P: semiconductor package S: semiconductor strip
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those having ordinary knowledge in the art to which the present invention pertains can easily carry out the embodiments. The invention may be implemented in various different ways and is not limited to the embodiments described herein.
In order to clearly explain the present invention, portions that are not related to the description are omitted, and the same or similar constituent elements are denoted by the same reference numerals throughout the specification.
In addition, in the embodiments, only the representative embodiment will be described using the same reference numerals for the constituent elements having the same configuration, and only the configuration different from the representative embodiment will be described in the other embodiments.
In the entire specification, when it is stated that a certain portion is "connected (or coupled)" to another portion, it includes not only a case of "directly connecting (or coupled)" but also a case of "indirectly connecting (or coupled)" with another portion interposed therebetween. In addition, when a certain portion is "included" in a certain constituent element, unless otherwise stated, it means that other constituent elements may be included instead of excluding other constituent elements.
Unless otherwise defined, all terms used herein including technical and scientific terms have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Fig. 1 shows a schematic structure of a semiconductor tape cutting and sorting apparatus according to an embodiment of the present invention. Referring to fig. 1, the semiconductor package cutting and sorting apparatus according to an embodiment of the present invention includes a loading part 100, a cutting part 200, and a sorting part 300.
The semiconductor tape cutting and sorting apparatus according to an embodiment of the present invention includes a loading part 100 loading a semiconductor tape S on which a plurality of packages are arranged, a cutting part 200 having a package picker 220 cutting the semiconductor tape S and transferring the singulated semiconductor packages P, and a sorting part 300 drying and inspecting the semiconductor packages P and receiving them in a tray.
The loading section 100 transfers the semiconductor strip S transferred from the outside to the temporary storage section 205 of the dicing section 200. Although not shown in detail in fig. 1, the loading portion 100 may include a magazine for loading the semiconductor strip S and a pusher for pushing and transferring the semiconductor strip S. The semiconductor strip S supplied to the loading section 100 may be located at the temporary storage section 205.
The tape picker 210 holds the semiconductor tape S positioned in the temporary storage 205 and transfers the semiconductor tape S to the chuck 240. The package pickup device 220 holds the semiconductor package P cut by the cutting unit 250 and transferred by the chuck 240 by a vacuum suction method, and transfers the semiconductor package P to the cleaning unit 260 and the flipping table 310. The first guide 230 provides a path for the tape picker 210 and the package picker 220 to move in the X-axis direction. The first guide 230 may be coupled with a driving part for moving the tape picker 210 and the package picker 220.
The chuck 240 may transfer the semiconductor strip S and the semiconductor packages P between the strip picker 210 and the cutting part 250 and between the cutting part 250 and the package picker 220, respectively. The chuck 240 may move in the Y-axis direction and may rotate centering on the Z-axis direction, and may mount the semiconductor strip S. The chuck 240 sucks the semiconductor strip S transferred by the strip picker 210 and transfers it to the cutting part 250. In addition, the chuck 240 transfers the plurality of semiconductor packages P, which have been cut by the cutting part 250, to the package picker 220. That is, the chuck 240 may reciprocate between the cutting part 250 and the first guide 230. The package pickup 220 may pick up the semiconductor packages P washed in the washing part 260 and transfer the semiconductor packages P to the flipping table 310, and the semiconductor packages P transferred to the flipping table 310 may be dried by the drying part 320. The flipping table 310 may be moved along a second guide frame 315.
The sorting unit 300 sorts the semiconductor packages P based on the inspection results for the semiconductor packages P. More specifically, the sorting part 300 picks up the semiconductor packages P loaded on the first and second pallet stages 341 and 346 upon completion of the inspection by the vision inspection parts 330 and 360 independently, sorts them in order according to the inspection result, and transfers them to another place.
The sorting part 300 for this may include a sorting pickup 370, a sorting pickup driving part 380, a first carry-out tray 351, a second carry-out tray 356, a first carry-out tray driving part 350, and a second carry-out tray driving part 355.
The sorting picker 370 picks up the semiconductor packages P loaded on the first pallet table 341 and the second pallet table 346, respectively, after the inspection by the visual inspection units 330 and 360 is completed, and transfers the semiconductor packages P to a first discharge tray 351 and a second discharge tray 356, which will be described later.
The sorting pickup driving part 380 may be formed in a rail shape and disposed along the X-axis direction, and a portion thereof is disposed adjacent to the vision inspection part 360. The sorting pickup driving part 380 moves the sorting pickup 370 in the X-axis direction. The sorting picker driving part 380 for this purpose may be built in with a driving tool for moving the sorting picker 370.
The first and second carry-out trays 351 and 356 can be loaded with the non-defective semiconductor packages P and the non-defective semiconductor packages P, respectively, and carried out to other places. In contrast, first carry-out tray 351 and second carry-out tray 356 may be loaded with semiconductor packages P rated according to the manufacturing state. For example, the first carry-out tray 351 may be loaded with a level a semiconductor packages P, and the second carry-out tray 356 may be loaded with a level B semiconductor packages P whose manufacturing state is lower than the level a.
When the sorting picker 370 picks up the semiconductor packages P from the first pallet 341 and the second pallet 346 and loads them on the first carry-out tray 351 or the second carry-out tray 356, the first carry-out tray 351 or the second carry-out tray 356 moves in the Y-axis direction and transfers the semiconductor packages P to another place.
The first discharge tray driving unit 350 moves the first discharge tray 351. The first carry-out tray driving member 350 may incorporate a driving tool for moving the first carry-out tray 351.
The second discharge tray driving unit 355 moves the second discharge tray 356. The second carry-out tray driving member 355 may have a driving tool built therein for moving the second carry-out tray 356.
The semiconductor strip cutting and sorting apparatus may sort and discharge the semiconductor strip S to other places after cutting, cleaning, drying and inspection as described above. On the other hand, the package pickup 220 according to the embodiment of the present invention is not limited to be included in the semiconductor tape cutting and sorting apparatus, and may be applied to a general semiconductor package manufacturing system. Hereinafter, an apparatus and method for preventing moisture from being discharged to the semiconductor packages P in the package pickup 220 according to an embodiment of the present invention are explained.
Fig. 2 shows a case where moisture is discharged during the transfer of the semiconductor package P. The package picker 220 transferring the semiconductor packages P includes: an adsorption plate 2210 formed with vacuum holes 2211 for adsorbing the semiconductor package P; a main body 2220 having a first flow path 2221 connected to the adsorption plate 2210 and communicating with the vacuum hole 2211 formed therein; a suction duct 2290 connected to the first flow path 2221 for the flow of air for applying vacuum pressure; a vacuum pressure forming part 2230 for applying vacuum pressure through the suction pipe 2290 and the first flow path 2221; and a first valve 2240 disposed between the vacuum pressure generating unit 2230 and the first flow path 2221 to open or close the first flow path 2221. In addition, the package picker 220 may further include: a filter 2270 disposed in a part of the suction duct 2290 and filtering the liquid flowing through the first flow path 2221; and a drain container 2280 for storing the liquid filtered by the filter 2270. In addition, a fastening part 2295 fastened between the main body part 2220 and the suction duct 2290 to connect the first flow path 2221 and the suction duct 2290 may be provided to the pack picker 220.
The suction plate 2210 is directly brought into contact with the semiconductor package P, and then the semiconductor package P is sucked by vacuum pressure. The suction plate 2210 may be differently configured according to package types in order to pick up various types of semiconductor packages P, and may be replaced as necessary. The body portion 2220 clamps the suction plate 2210, and is connected to the suction duct 2290 through the fastening portion 2295. The main body 2220 may transfer the semiconductor package P by moving in the horizontal direction and the vertical direction, and may include a driving unit for driving the main body 2220 and a controller. The suction duct 2290, as a duct through which gas for applying vacuum pressure flows, may be implemented in a tube form having a certain length. A filter 2270 is formed in a part of the suction duct 2290, and a gas based on the vacuum pressure of the vacuum pressure forming unit 2230 is flowed by opening and closing the first valve 2240.
Referring to fig. 2 (a), the cleaning solution remaining in the semiconductor packages P may rise together and remain in the first flow path 2221 and the suction pipe 2290 due to the vacuum pressure applied to adsorb the semiconductor packages P. If the vacuum pressure is released to place the semiconductor package P at the target transfer position (e.g., the turn table 310) in a state where the cleaning solution remains in the first flow path 2221 and the suction duct 2290, the cleaning solution remaining in the first flow path 2221 and the suction duct 2290 may be discharged together as shown in fig. 2 (b). If the cleaning liquid is discharged, moisture may be scattered to the inspection portion 330 located around the turntable 310, which may adversely affect the inspection performance.
Although the cleaning liquid reaching the filter portion 2270 is collected by the drain container 2280 without being discharged in the process of applying the vacuum pressure, if the semiconductor package P is completely adsorbed to the adsorption plate 2210 and the gas does not flow to the filter portion 2270 any more, the cleaning liquid remaining in the first flow path 2221 and the suction pipe 2290 cannot move together and remain.
Accordingly, the embodiment of the present invention provides an apparatus and method for preventing the cleaning liquid from being discharged during the adsorption release process of the semiconductor packages P by guiding the gas flow to the filter 2270 continuously after the semiconductor packages P are adsorbed on the adsorption plate 2210, so that the cleaning liquid does not remain in the first flow path 2221 and the suction duct 2290. The apparatus (package pickup 220) for transferring the semiconductor package P according to the embodiment of the present invention may be constructed as shown in fig. 3.
The apparatus (package picker 220) for transferring the semiconductor packages P in the semiconductor tape cutting and sorting apparatus includes: an adsorption plate 2210 formed with vacuum holes 2211 for adsorbing the semiconductor package P; a main body 2220 having a first flow path 2221 connected to the adsorption plate 2210 and communicating with the vacuum hole 2211 formed therein; a suction duct 2290 connected to the first flow path 2221 for air flow for applying vacuum pressure; a vacuum pressure forming part 2230 for applying vacuum pressure through the suction pipe 2290 and the first flow path 2221; a first valve 2240 disposed between the vacuum pressure forming part 2230 and the suction duct 2290 to open or close the suction duct 2290; a second flow path 2250 in which a path through which external air can flow is formed between the side surface of the main body portion and the first flow path in the interior of the main body portion 2220; and a second valve 2260 coupled to the second flow path 2250 to open or close the second flow path 2250.
According to the embodiment of the present invention, the gas can flow through the second flow path by the vacuum pressure also in the case where the semiconductor package P is adsorbed to the adsorption plate 2210, and thus the cleaning liquid remaining in the first flow path 2221 and the suction pipe 2290 can flow inside together with the gas and move to the drain container 2280. Therefore, the cleaning liquid does not remain in the first flow path 2221 and the suction duct 2290, and the cleaning liquid can be prevented from being discharged when the vacuum suction is released and the semiconductor package P is mounted on the turn table 310.
In an embodiment, the package picker 220 may further include: a filtering part 2270 disposed at a portion of the suction duct 2290 to filter the liquid flowing through the suction duct 2290; and a drain container 2280 for storing the liquid filtered by the filter 2270.
Referring to fig. 4 (a), when the package pickup 220 reaches the flipping table 310 in a state where vacuum pressure is applied to suck the semiconductor package P, the second valve 2260 is opened to allow external gas to flow into the inside through the second flow path 2250. That is, if the body portion 2220 is located at the target delivery position (the flipping station 310), the second valve 2260 may be opened for a certain period of time. Referring to fig. 4 (b), the cleaning solution remaining in the first flow path 2221 and the suction pipe 2290 is collected into the drain receptacle 2280 through the filter 2270 due to the pressure of the gas flowing in through the second flow path 2250.
Referring to fig. 4 (c), the second valve 2260 is closed after a certain time has elapsed, the first valve 2240 is closed to release the vacuum pressure when the second valve 2260 is closed, and the semiconductor package P is seated at the target transfer position when the vacuum pressure is released (the flipping table 310). According to the embodiment of the present invention, the cleaning liquid does not remain in the first flow path 2221 and the suction duct 2290, and thus the cleaning liquid can be prevented from being discharged when the semiconductor package P is mounted to the flipping table 310.
Fig. 5 illustrates an example of the second flow path 2250 through which external gas flows in the apparatus for transferring the semiconductor package P according to an embodiment of the present invention. According to an embodiment of the present invention, as shown in (a), (c) of fig. 5, the second flow path 2250 may be formed in the main body portion 2220. As shown in fig. 5 (a), the second flow path 2250 may be formed to connect the first flow path 2221 and the side surface portion of the main body.
As shown in fig. 5 (c), the second flow path 2250 may be formed to connect the first flow path 2221 and the upper surface of the main body 2220. As shown in fig. 5 (b), the second flow path 2250 may be formed in the adsorption plate 2210.
Fig. 6 is a flowchart of a method for transferring the semiconductor package P according to an embodiment of the present invention. Each operation of fig. 6 may be performed by each module of the semiconductor tape cutting and sorting apparatus through a controller that controls the operation of the semiconductor packages P.
The method for transferring semiconductor packages P in the semiconductor tape cutting and sorting apparatus according to an embodiment of the present invention includes: a step (S605) of picking up the semiconductor package P in the package pickup 220 by applying vacuum pressure through the first flow path 2221 connected to the adsorption hole 2211 for adsorbing the semiconductor package P; a step (S610) of positioning the package pickup 220, which has adsorbed the semiconductor package P, at the target transfer position; a step (S615) of opening the second flow path 2250 connected to the first flow path 2221 to form a path through which external gas can flow, and sucking water vapor existing in the first flow path 2221; and a step (S620) of cutting off the second flow path 2250 and releasing the empty pressure to place the semiconductor package P at the target transfer position.
In an embodiment, the second flow path 2250 may be formed in the main body 2220 as shown in fig. 5 (a) and (c).
In one embodiment, as shown in fig. 4, the opening or closing of the second flow path 2250 may be performed by a second valve 2260 coupled to the second flow path 2250.
In an embodiment, as in fig. 4 (a), the step of pumping moisture existing in the first flow path 2221 (S615) may include the step of opening the second valve 2260 for a certain period of time.
In an embodiment, as shown in fig. 5 (a), the second flow path 2250 may be formed as a side surface portion connecting the first flow path 2221 and the main body portion 2220.
In an embodiment, as shown in fig. 5 (c), the second flow path 2250 may be formed to connect the first flow path 2221 and the upper surface portion of the main body 2220.
In an embodiment, as shown in fig. 5 (b), the second flow path 2250 may be formed on the adsorption plate 2210.
The present embodiment and the drawings attached to the present specification are merely part of the technical idea included in the present invention, and it is apparent that modifications and specific embodiments which can be easily derived by those skilled in the art within the scope of the technical idea included in the specification and the drawings are included in the scope of the right of the present invention.
Therefore, the inventive concept should not be limited to the described embodiments, but rather should be construed in breadth and scope in accordance with the appended claims, and any and all equivalents thereof.

Claims (20)

1. An apparatus for transferring semiconductor packages in a semiconductor tape cutting and sorting device, the apparatus comprising:
an adsorption plate formed with a vacuum hole for adsorbing the semiconductor package;
a main body portion in which a first flow path that is coupled to the adsorption plate and communicates with the vacuum hole is formed;
a suction duct connected to the first flow path for air flow for applying vacuum pressure;
a vacuum pressure forming part for applying vacuum pressure through the suction duct and the first flow path;
a first valve disposed between the vacuum pressure forming part and the suction duct to open or close the suction duct;
a second flow path connected to the first flow path to form a path through which external gas can flow; and
and a second valve coupled to the second flow path to open or close the second flow path.
2. The apparatus of claim 1,
the device further comprises: a filter unit disposed in a part of the suction duct to filter the liquid flowing through the suction duct; and a drain container for storing the liquid filtered by the filter unit.
3. The apparatus of claim 1,
the second flow path is formed in the main body.
4. The apparatus of claim 3,
the second valve is opened for a period of time if the body portion is in a target delivery position.
5. The apparatus of claim 4,
the second valve is closed if the certain time elapses,
the first valve closes and the vacuum pressure is relieved if the second valve closes,
the semiconductor package is mounted to the target transfer position if the vacuum pressure is released.
6. The apparatus of claim 1,
the second flow path is formed to connect the first flow path and a side surface portion of the main body.
7. The apparatus of claim 1,
the second flow path is formed to connect the first flow path and an upper surface portion of the body portion.
8. The apparatus of claim 1,
the second flow path is formed in the adsorption plate.
9. A method for conveying semiconductor packages in a semiconductor tape cutting and sorting apparatus, the method comprising:
picking up the semiconductor package by applying vacuum pressure through a first flow path of a body portion connected to a suction hole for sucking the semiconductor package in a package pickup;
a step of positioning the package pickup, which has sucked the semiconductor package, at a target transfer position;
a step of opening a second flow path that is connected to the first flow path and forms a path through which external gas can flow, and sucking moisture present in the first flow path; and
cutting off the second flow path and releasing the vacuum pressure to place the semiconductor package at the target transfer position.
10. The method of claim 9,
the second flow path is formed in the main body.
11. The method of claim 9,
the opening or closing of the second flow path is performed by a second valve coupled to the second flow path.
12. The method of claim 11,
the step of pumping moisture present in the first flow path includes the step of opening the second valve for a period of time.
13. The method of claim 9,
the second flow path is formed to connect the first flow path and a side surface portion of the main body.
14. The method of claim 9,
the second flow path is formed to connect the first flow path and an upper surface portion of the body portion.
15. The method of claim 9,
the second flow path is formed on the adsorption plate having the adsorption hole for adsorbing the semiconductor package formed thereon.
16. A semiconductor strip cutting and sorting apparatus, comprising:
a loading unit for loading a semiconductor tape on which a plurality of packages are arranged;
a cutting section including a package picker that cuts the semiconductor strip and conveys the singulated semiconductor packages; and
a sorting unit for drying and inspecting the semiconductor packages and storing the semiconductor packages in a tray,
the package pickup includes:
an adsorption plate formed with a vacuum hole for adsorbing the semiconductor package;
a main body portion in which a first flow path that is coupled to the adsorption plate and communicates with the vacuum hole is formed;
a suction duct connected to the first flow path for air flow for applying vacuum pressure;
a vacuum pressure forming part for applying vacuum pressure through the suction duct and the first flow path;
a first valve disposed between the vacuum pressure forming part and the suction duct to open or close the suction duct;
a second flow path that is formed inside the main body and that forms a path through which external air can flow between a side surface of the main body and the first flow path; and
and a second valve coupled to the second flow path to open or close the second flow path.
17. The semiconductor tape cutting and sorting apparatus of claim 16,
the semiconductor strip cutting and sorting apparatus further comprises:
a filter unit disposed in a part of the first flow path and configured to filter the liquid flowing through the first flow path; and
and a drain container for storing the liquid filtered by the filter unit.
18. The semiconductor tape cutting and sorting apparatus of claim 16,
the second valve is opened during a certain time if the body portion is located at the flipping table.
19. The semiconductor tape cutting and sorting apparatus of claim 18,
the second valve is closed if the certain time elapses,
the first valve closes and the vacuum pressure is relieved if the second valve closes,
the semiconductor package is mounted to the flipping table if the vacuum pressure is released.
20. The semiconductor tape cutting and sorting apparatus of claim 16,
the second flow path is formed to connect the first flow path and a side surface portion of the main body.
CN202111353570.5A 2020-11-25 2021-11-16 Semiconductor strip cutting and sorting equipment, conveying device and method Pending CN114551282A (en)

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KR10-2020-0160025 2020-11-25

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JPH0727154U (en) * 1993-10-19 1995-05-19 東京航空計器株式会社 Air pressure release circuit of wafer vacuum suction holding mechanism
TW420375U (en) * 1999-07-28 2001-01-21 Motech Taiwan Automatic Corp Improved sucking tool for picking up and placing
KR20080011902A (en) * 2006-08-01 2008-02-11 세메스 주식회사 Apparatus for transfering substrates, apparatus for treatign substrates, and method for cooling substrates
JP2011181936A (en) * 2011-03-28 2011-09-15 Renesas Electronics Corp Method for manufacturing semiconductor device
KR101543864B1 (en) * 2013-11-13 2015-08-11 세메스 주식회사 Bonding head and die bonding apparatus including the same
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CN111326473A (en) * 2020-04-08 2020-06-23 西安奕斯伟硅片技术有限公司 Silicon wafer bearing device and edge polishing equipment

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KR20220072936A (en) 2022-06-03
TWI792697B (en) 2023-02-11

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